APPARATUS AND METHOD FOR IMMERSION LITHOGRAPHY
    61.
    发明申请
    APPARATUS AND METHOD FOR IMMERSION LITHOGRAPHY 审中-公开
    装置和方法

    公开(公告)号:US20080304025A1

    公开(公告)日:2008-12-11

    申请号:US11760365

    申请日:2007-06-08

    CPC classification number: G03F7/70716 G03F7/70341

    Abstract: An immersion lithography apparatus includes a lens assembly having an imaging lens, a wafer stage for securing a wafer beneath the lens assembly, a fluid module for providing a fluid into a space between the lens assembly and the wafer, and a plurality of extraction units positioned proximate to an edge of the wafer. The extraction units are configured to operate independently to remove a portion of the fluid provided into the space between the lens assembly and the wafer.

    Abstract translation: 浸没式光刻设备包括具有成像透镜的透镜组件,用于将晶片固定在透镜组件下方的晶片台,用于将流体提供到透镜组件和晶片之间的空间的流体模块以及定位在多个提取单元 靠近晶片的边缘。 提取单元被配置为独立地操作以去除设置在透镜组件和晶片之间的空间中的一部分流体。

    LITHOGRAPHY MATERIAL AND LITHOGRAPHY PROCESS
    62.
    发明申请
    LITHOGRAPHY MATERIAL AND LITHOGRAPHY PROCESS 审中-公开
    LITHOGRAPHY材料和LITHOGRAPHY过程

    公开(公告)号:US20080299487A1

    公开(公告)日:2008-12-04

    申请号:US11828809

    申请日:2007-07-26

    Applicant: Ching-Yu Chang

    Inventor: Ching-Yu Chang

    CPC classification number: G03F7/2041 G03F7/0046

    Abstract: An immersion lithography resist material comprising a matrix polymer having a first polarity and an additive having a second polarity that is substantially greater than the first polarity. The additive may have a molecular weight that is less than about 1000 Dalton. The immersion lithography resist material may have a contact angle that is substantially greater than the contact angle of the matrix polymer.

    Abstract translation: 一种浸没式光刻抗蚀剂材料,包括具有第一极性的基质聚合物和具有基本上大于第一极性的第二极性的添加剂。 添加剂可以具有小于约1000道尔顿的分子量。 浸没式光刻抗蚀剂材料可具有基本上大于基质聚合物的接触角的接触角。

    Method and System For Cleaning A Photomask
    64.
    发明申请
    Method and System For Cleaning A Photomask 有权
    清洁光掩模的方法和系统

    公开(公告)号:US20080185021A1

    公开(公告)日:2008-08-07

    申请号:US11671570

    申请日:2007-02-06

    CPC classification number: G03F1/82 Y10S134/902

    Abstract: A method for cleaning a photomask includes cleaning the photomask with a chemical cleaner, introducing a solution to the photomask, the solution is configured to react with residuals generated from the chemical cleaner to form insoluble precipitates, and rinsing the photomask with a fluid to remove the insoluble precipitates from the photomask.

    Abstract translation: 用于清洁光掩模的方法包括用化学清洁剂清洁光掩模,将溶液引入到光掩模中,溶液被配置为与由化学清洁剂产生的残余物反应以形成不溶性沉淀物,并用流体冲洗光掩模以除去 来自光掩模的不溶性沉淀物。

    Method and System For Making Photo-Resist Patterns
    65.
    发明申请
    Method and System For Making Photo-Resist Patterns 审中-公开
    制作防光图案的方法和系统

    公开(公告)号:US20080102648A1

    公开(公告)日:2008-05-01

    申请号:US11555558

    申请日:2006-11-01

    CPC classification number: H01L21/0271 G03F7/095

    Abstract: A method of forming a resist pattern in a semiconductor device layer includes forming a buffer layer on a semiconductor device layer and forming a resist layer on the buffer layer. A decomposing agent is released into a portion of the buffer layer by a portion of the resist layer whereupon the portion of the buffer layer and the portion of the resist layer are removed to form a process window substantially free of resist residue that can be subsequently exploited for etching of the semiconductor device layer.

    Abstract translation: 在半导体器件层中形成抗蚀剂图案的方法包括在半导体器件层上形成缓冲层,并在缓冲层上形成抗蚀剂层。 分解剂通过抗蚀剂层的一部分释放到缓冲层的一部分中,随后缓冲层的部分和抗蚀剂层的一部分被去除以形成基本上不含抗蚀剂残留物的工艺窗口,其可以被随后利用 用于蚀刻半导体器件层。

    ESD-resistant photomask and method of preventing mask ESD damage
    67.
    发明授权
    ESD-resistant photomask and method of preventing mask ESD damage 有权
    防静电光掩模和防止掩膜ESD损伤的方法

    公开(公告)号:US07252911B2

    公开(公告)日:2007-08-07

    申请号:US10810920

    申请日:2004-03-26

    Applicant: Ching-Yu Chang

    Inventor: Ching-Yu Chang

    CPC classification number: G03F1/60 G03F1/40 H01J2237/31794

    Abstract: An ESD-resistant photomask and method of preventing mask ESD damage is disclosed. The ESD-resistant photomask includes a mask substrate, a pattern-forming material provided on the substrate, a circuit pattern defined by exposure regions etched in the pattern-forming material, and positive or negative ions implanted into the mask substrate throughout ion implantation regions. The ions in the ion implantation regions dissipate electrostatic charges on the mask, thus preventing the buildup of electrostatic charges which could otherwise attract image-distorting particles to the mask or damage the mask.

    Abstract translation: 公开了一种防静电防护光掩模和防止掩膜ESD损伤的方法。 防静电光掩模包括掩模基板,设置在基板上的图案形成材料,由在图案形成材料中蚀刻的曝光区域限定的电路图案,以及在离子注入区域中注入到掩模基板中的正或负离子。 离子注入区域中的离子消耗掩模上的静电电荷,从而防止静电电荷的积累,否则可能会吸引图像变形颗粒到掩模或损坏掩模。

    Megasonic immersion lithography exposure apparatus and method
    68.
    发明授权
    Megasonic immersion lithography exposure apparatus and method 有权
    超声波浸没式光刻曝光装置及方法

    公开(公告)号:US07224427B2

    公开(公告)日:2007-05-29

    申请号:US10910480

    申请日:2004-08-03

    CPC classification number: G03F7/70341

    Abstract: A megasonic immersion lithography exposure apparatus and method for substantially eliminating microbubbles from an exposure liquid in immersion lithography is disclosed. The apparatus includes an optical system for projecting light through a mask and onto a wafer.An optical transfer chamber is provided adjacent to the optical system for containing an exposure liquid. At least one megasonic plate operably engages the optical transfer chamber for inducing sonic waves in and eliminating microbubbles from the exposure liquid.

    Abstract translation: 公开了一种用于在浸没式光刻中基本上消除曝光液体中的微泡的兆声浸没式光刻曝光装置和方法。 该装置包括用于通过掩模将光投射到晶片上的光学系统。 光学传递室邻近光学系统设置,用于容纳曝光液体。 至少一个兆欧表板可操作地接合光学传递室,用于在曝光液体中引入声波并消除微泡。

    Optical proximity correction photomasks
    69.
    发明申请
    Optical proximity correction photomasks 有权
    光学接近校正光掩模

    公开(公告)号:US20070082275A1

    公开(公告)日:2007-04-12

    申请号:US11245522

    申请日:2005-10-07

    Applicant: Ching-Yu Chang

    Inventor: Ching-Yu Chang

    CPC classification number: G03F1/36

    Abstract: An optical proximity correction photomask comprises a transparent substrate, a main feature having a first transmitivity disposed on the transparent substrate and at least one assist feature having a second transmitivity disposed beside the main feature and on the transparent substrate, wherein the first transmitivity is not equal to the second transmitivity.

    Abstract translation: 光学邻近校正光掩模包括透明衬底,具有设置在透明衬底上的第一透射率的主要特征和在主要特征旁边和透明衬底上具有第二透射率的至少一个辅助特征,其中第一透射率不相等 到第二个透射率。

    Method of reducing alignment measurement errors between device layers
    70.
    发明授权
    Method of reducing alignment measurement errors between device layers 有权
    降低器件层之间校准测量误差的方法

    公开(公告)号:US07192845B2

    公开(公告)日:2007-03-20

    申请号:US10864562

    申请日:2004-06-08

    Abstract: An integrated circuit in which measurement of the alignment between subsequent layers has less susceptibility to stress induced shift. A first layer of the structure has a first overlay mark. A second and/or a third layer are formed in the alignment structure and on the first layer. Portions of the second and/or third layer are selectively removed from regions in and around the first overlay mark. A second overlay mark is formed and aligned to the first overlay mark. The alignment between the second overlay mark and first overlay mark may be measured with an attenuated error due to reflection and refraction or due to an edge profile shift of the first overlay mark.

    Abstract translation: 一种集成电路,其中后续层之间的对准测量对应力诱导偏移具有较小的敏感性。 该结构的第一层具有第一覆盖标记。 在对准结构中和第一层上形成第二层和/或第三层。 第二层和/或第三层的部分从第一重叠标记中和周围的区域选择性地去除。 形成第二重叠标记并与第一覆盖标记对准。 可以由于反射和折射或由于第一重叠标记的边缘轮廓偏移而具有衰减误差来测量第二覆盖标记和第一覆盖标记之间的对准。

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