公开(公告)号：US06409892B1

公开(公告)日：2002-06-25

申请号：US09385342

申请日：1999-08-30

申请人： Daniel J. Woodruff ,  Kyle M. Hanson

发明人： Daniel J. Woodruff ,  Kyle M. Hanson

IPC分类号： C25B900

CPC分类号： C25D17/001 ,  C25D5/08 ,  C25D7/123 ,  C25D17/06

摘要： An improved anode, cup and conductor assembly for a reactor vessel includes an anode assembly supported within a cup which holds a supply of process fluid. The cup is supported around its perimeter within the reactor vessel. The anode assembly has an anode shield carrying an anode. The anode shield and the anode are supported from below by a delivery tube which also serves to deliver process fluid to the cup. A bayonet connection is provided between a top portion of the delivery tube and the anode assembly. The fluid delivery tube has a fixed height within the vessel. The anode elevation is adjusted by the interposing of a spacer of desired thickness between the anode and the tube. An electrical conductor is connected to the anode, and passes through the tube to be electrically accessible outside the vessel. The conductor is connected to the anode with a plug-in connection which is completed when the tube is coupled to the anode by the bayonet connection. The spacer is C-shaped to allow changing of the spacer for anode height adjustments without disconnecting the plug-in connection.

摘要翻译： 用于反应器容器的改进的阳极，杯和导体组件包括支撑在保持供给工艺流体的杯内的阳极组件。 杯子围绕反应堆容器内的周边支撑。 阳极组件具有承载阳极的阳极屏蔽层。 阳极护罩和阳极从下方被输送管支撑，输送管也用于将工艺流体输送到杯子。 在输送管的顶部和阳极组件之间提供卡口连接。 流体输送管在容器内具有固定的高度。 通过在阳极和管之间插入所需厚度的间隔物来调节阳极高度。 电导体连接到阳极，并且通过管以在电容器外部电可通达。 导体通过插入式连接连接到阳极，当插管通过卡口连接将管连接到阳极时，该插件连接完成。 间隔件是C形的，以允许在不断开插入式连接的情况下更换用于阳极高度调节的间隔件。

公开(公告)号：US06368475B1

公开(公告)日：2002-04-09

申请号：US09531828

申请日：2000-03-21

申请人： Kyle M. Hanson ,  Scott Grace ,  Matt Johnson ,  Ken Gibbons

发明人： Kyle M. Hanson ,  Scott Grace ,  Matt Johnson ,  Ken Gibbons

IPC分类号： C25B900

CPC分类号： C25D17/008 ,  C25D5/08 ,  C25D17/001 ,  C25D17/002 ,  C25D17/007 ,  H01L21/2885

摘要： A reactor for use in electrochemical processing of a microelectronic workpiece is set forth and described herein. The apparatus comprises one or more walls defining a processing space therebetween for containing a processing fluid. The processing space includes at least a first fluid flow region and a second fluid flow region. A first electrode is disposed in the processing fluid of the first fluid flow region while a second electrode, comprising at least a portion of the microelectronic workpiece, is disposed in the processing fluid of the second fluid flow region. Fluid flow within the first fluid flow region is generally directed toward the first electrode and away from the second electrode while fluid flow within the second fluid flow region is generally directed toward the second electrode and away from the first electrode. Depending on the particular electrochemical process that is to be executed, the first electrode may constitute either an anode or a cathode in the electrochemical processing of the microelectronic workpiece.

摘要翻译： 本文阐述并描述了用于微电子工件的电化学处理的反应器。 该装置包括一个或多个在其间限定处理空间的壁，用于容纳处理流体。 处理空间至少包括第一流体流动区域和第二流体流动区域。 第一电极设置在第一流体流动区域的处理流体中，而包括微电子工件的至少一部分的第二电极设置在第二流体流动区域的处理流体中。 第一流体流动区域内的流体流动通常指向第一电极并远离第二电极，而第二流体流动区域内的流体流动通常指向第二电极并远离第一电极。 根据要执行的特定电化学过程，第一电极可以构成微电子工件的电化学处理中的阳极或阴极。

公开(公告)号：US06322678B1

公开(公告)日：2001-11-27

申请号：US09114261

申请日：1998-07-11

申请人： Daniel J. Woodruff ,  Kyle M. Hanson

发明人： Daniel J. Woodruff ,  Kyle M. Hanson

IPC分类号： C25D1706

CPC分类号： H01L21/68728 ,  C25D17/001 ,  H01L21/68785

摘要： An apparatus for electroplating a workpiece is disclosed in which the apparatus includes a workpiece holding structure. The workpiece holding structure includes a workpiece support having at least one surface that is disposed to engage a front side of the workpiece and at least one electrical contact disposed for contact with at least one corresponding electrical contact on a back-side of the workpiece. The workpiece includes one or more electrically conductive paths between the at least one corresponding electrical contact and a front-side of the workpiece to facilitate electroplating of the front-side surface. An actuator is provided for driving the workpiece support between a first position in which the at least one electrical contact of the workpiece and the at least one contact of the workpiece holding structure are disengaged from one another, and a second position in which the at least one surface clamps the workpiece in a position in which the at least one electrical contact of the workpiece holding structure electrically engages the at least one electrical contact of the workpiece.

摘要翻译： 公开了一种用于电镀工件的设备，其中该设备包括工件保持结构。 工件保持结构包括具有至少一个表面的工件支撑件，所述至少一个表面设置成与工件的前侧相接合，以及至少一个电触点，该电触点设置成用于与工件的背面上的至少一个对应的电触点接触。 所述工件包括在所述至少一个对应的电触点和所述工件的前侧之间的一个或多个导电路径，以便于所述前侧表面的电镀。 提供致动器，用于在第一位置和第二位置之间驱动工件支撑件，在第一位置，工件的至少一个电触点与工件保持结构的至少一个触点彼此脱离，第二位置至少 一个表面将工件夹紧在其中工件保持结构的至少一个电接触与工件的至少一个电接触电接合的位置。

公开(公告)号：US06309520B1

公开(公告)日：2001-10-30

申请号：US09386803

申请日：1999-08-31

申请人： Daniel J. Woodruff ,  Kyle M. Hanson ,  Thomas H. Oberlitner ,  LinLin Chen ,  John M. Pedersen ,  Vladimir Zila

发明人： Daniel J. Woodruff ,  Kyle M. Hanson ,  Thomas H. Oberlitner ,  LinLin Chen ,  John M. Pedersen ,  Vladimir Zila

IPC分类号： C25D1700

CPC分类号： C25D17/001 ,  C25D7/123

摘要： A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the reactor bowl in contact with the electroplating solution. A contact assembly is spaced from the anode within the reactor bowl. The contact assembly includes a plurality of contacts disposed to contact a peripheral edge of the surface of the workpiece to provide electroplating power to the surface of the workpiece. The contacts execute a wiping action against the surface of the workpiece as the workpiece is brought into engagement therewith The contact assembly also including a barrier disposed interior of the plurality of contacts. The barrier includes a member disposed to engage the surface of the workpiece to assist in isolating the plurality of contacts from the electroplating solution. In one embodiment, the plurality of contacts are in the form of discrete flexures while in another embodiment the plurality of contacts are in the form of a Belleville ring contact. A flow path may be provided in the contact assembly for providing a purging gas to the plurality of contacts and the peripheral edge of the workpiece. The purging gas may be used to assist in the formation of the barrier of the contact assembly. A combined electroplating/electroless plating tool and method are also set forth.

摘要翻译： 阐述了将金属镀在工件表面上的反应器。 反应器包括反应器碗，其包括设置在其中的电镀溶液和设置在与电镀溶液接触的反应器碗中的阳极。 接触组件与反应器碗内的阳极间隔开。 接触组件包括多个触点，其设置成接触工件表面的周边边缘以向工件的表面提供电镀功率。 当工件与其接合时，触头在工件的表面上执行擦拭动作。触头组件还包括设置在多个触点内部的屏障。 阻挡层包括设置成接合工件的表面以帮助将多个触点与电镀溶液隔离的构件。 在一个实施例中，多个触点是离散弯曲的形式，而在另一个实施例中，多个触点是贝尔维尔环接触的形式。 可以在接触组件中设置流路，以向多个触点和工件的周边边缘提供净化气体。 吹扫气体可用于帮助形成接触组件的屏障。 还提出了组合电镀/无电镀工具和方法。

公开(公告)号：US06303010B1

公开(公告)日：2001-10-16

申请号：US09386197

申请日：1999-08-31

申请人： Daniel J. Woodruff ,  Kyle M. Hanson ,  Thomas H. Oberlitner ,  LinLin Chen ,  John M. Pedersen ,  Vladimir Zila

发明人： Daniel J. Woodruff ,  Kyle M. Hanson ,  Thomas H. Oberlitner ,  LinLin Chen ,  John M. Pedersen ,  Vladimir Zila

IPC分类号： C25D1704

CPC分类号： H01L21/68721 ,  C25D5/08 ,  C25D7/123 ,  C25D17/001 ,  C25D17/06 ,  H01L21/288 ,  H01L21/2885 ,  H01L21/687 ,  H01L21/68728 ,  H01L21/68735 ,  H01L21/68785

摘要： A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the reactor bowl in contact with the electroplating solution. A contact assembly is spaced from the anode within the reactor bowl. The contact assembly includes a plurality of contacts disposed to contact a peripheral edge of the surface of the workpiece to provide electroplating power to the surface of the workpiece. The contacts execute a wiping action against the surface of the workpiece as the workpiece is brought into engagement therewith The contact assembly also including a barrier disposed interior of the plurality of contacts. The barrier includes a member disposed to engage the surface of the workpiece to assist in isolating the plurality of contacts from the electroplating solution. In one embodiment, the plurality of contacts are in the form of discrete flexures while in another embodiment the plurality of contacts are in the form of a Belleville ring contact. A flow path may be provided in the contact assembly for providing a purging gas to the plurality of contacts and the peripheral edge of the workpiece. The purging gas may be used to assist in the formation of the barrier of the contact assembly. A combined electroplating/electroless plating tool and method are also set forth.

摘要翻译： 阐述了将金属镀在工件表面上的反应器。 反应器包括反应器碗，其包括设置在其中的电镀溶液和设置在与电镀溶液接触的反应器碗中的阳极。 接触组件与反应器碗内的阳极间隔开。 接触组件包括多个触点，其设置成接触工件表面的周边边缘以向工件的表面提供电镀功率。 当工件与其接合时，触头对工件的表面执行擦拭动作。触头组件还包括设置在多个触点内部的屏障。 阻挡层包括设置成接合工件的表面以帮助将多个触点与电镀溶液隔离的构件。 在一个实施例中，多个触点是离散弯曲的形式，而在另一个实施例中，多个触点是贝尔维尔环接触的形式。 可以在接触组件中设置流路，以向多个触点和工件的周边边缘提供净化气体。 吹扫气体可用于帮助形成接触组件的屏障。 还提出了组合电镀/无电镀工具和方法。

公开(公告)号：US06254742B1

公开(公告)日：2001-07-03

申请号：US09351864

申请日：1999-07-12

申请人： Kyle M. Hanson ,  Robert A. Weaver ,  Jerry Simchuk ,  Raymon F. Thompson

发明人： Kyle M. Hanson ,  Robert A. Weaver ,  Jerry Simchuk ,  Raymon F. Thompson

IPC分类号： C25B900

CPC分类号： C25D17/001 ,  Y10S204/07

摘要： In an electroplating reactor for plating a spinning wafer, a diffusion plate is supported above an anode located within a cup filled with process fluid within the reactor. The diffusion plate includes a plurality of openings which are arranged in a spiral pattern. The openings allow for an improved plating thickness distribution on the wafer surface. The openings can be elongated slots curved along the direction of the spiral path.

摘要翻译： 在用于电镀旋转晶片的电镀反应器中，扩散板被支撑在位于反应器内装有工艺流体的杯内的阳极上。 扩散板包括多个以螺旋图案布置的开口。 这些开口允许在晶片表面上改善电镀厚度分布。 开口可以是沿着螺旋路径的方向弯曲的细长槽。

公开(公告)号：US09799537B2

公开(公告)日：2017-10-24

申请号：US12960378

申请日：2010-12-03

申请人： Jason Rye ,  Kyle M. Hanson

发明人： Jason Rye ,  Kyle M. Hanson

IPC分类号： H01L21/02 ,  H01L21/67 ,  H01L21/687 ,  B08B3/04

CPC分类号： H01L21/67051 ,  H01L21/6719 ,  H01L21/68792

摘要： A processing assembly for a semiconductor workpiece generally includes a rotor assembly capable of spinning a workpiece, a chemistry delivery assembly for delivering chemistry to the workpiece, and a chemistry collection assembly for collecting spent chemistry from the workpiece. The chemistry collection assembly may include a weir that is configured to spin with the rotor assembly. A method of processing a semiconductor workpiece is also provided.

公开(公告)号：US08961771B2

公开(公告)日：2015-02-24

申请号：US13559494

申请日：2012-07-26

申请人： Rajesh Baskaran ,  Robert W. Batz, Jr. ,  Bioh Kim ,  Tom L. Ritzdorf ,  John L. Klocke ,  Kyle M. Hanson

发明人： Rajesh Baskaran ,  Robert W. Batz, Jr. ,  Bioh Kim ,  Tom L. Ritzdorf ,  John L. Klocke ,  Kyle M. Hanson

IPC分类号： C25D7/12 ,  C25D17/00 ,  C25D17/02 ,  C25D21/12

CPC分类号： C25D7/12 ,  C25D5/00 ,  C25D7/123 ,  C25D17/001 ,  C25D17/002 ,  C25D17/02 ,  C25D21/12

摘要： Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a cation permeable barrier layer. The cation permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain cationic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit deposit properties (e.g., resistivity) within desired ranges.

摘要翻译： 描述了利用第一处理流体和阳极电解处理微特征工件的工艺和系统。 使用第一处理流体，阳极，第二处理流体和阳离子可渗透阻挡层对微特征工件进行电解处理。 阳离子可渗透阻隔层将第一处理流体与第二处理流体分离，同时允许某些阳离子物质在两种流体之间转移。 所描述的方法在反复电镀循环中产生沉积物，其在所需范围内具有沉积性质（例如电阻率）。

公开(公告)号：US08541309B2

公开(公告)日：2013-09-24

申请号：US12960372

申请日：2010-12-03

申请人： Jason Rye ,  Kyle M. Hanson

发明人： Jason Rye ,  Kyle M. Hanson

IPC分类号： H01L21/302

CPC分类号： H01L21/6719 ,  H01L21/67051 ,  H01L21/68792

摘要： A processing assembly for a semiconductor workpiece generally includes a rotor assembly capable of spinning a workpiece, a chemistry delivery assembly for delivering chemistry to the workpiece, and a chemistry collection assembly for collecting spent chemistry from the workpiece. The chemistry collection assembly includes a weir assembly surrounding the rotor assembly and having a plurality of weirs. Methods for processing a semiconductor workpiece generally include moving at least one of the rotor assembly and the weir assembly.

摘要翻译： 用于半导体工件的处理组件通常包括能够旋转工件的转子组件，用于将化学物质输送到工件的化学物质输送组件以及用于从工件收集废化学物质的化学收集组件。 化学收集组件包括围绕转子组件并具有多个堰的堰组件。 用于处理半导体工件的方法通常包括移动转子组件和堰组件中的至少一个。

公开(公告)号：US20120292194A1

公开(公告)日：2012-11-22

申请号：US13559494

申请日：2012-07-26

申请人： Rajesh Baskaran ,  Robert W. Batz, JR. ,  Bioh Kim ,  Tom L. Ritzdorf ,  John L. Klocke ,  Kyle M. Hanson

发明人： Rajesh Baskaran ,  Robert W. Batz, JR. ,  Bioh Kim ,  Tom L. Ritzdorf ,  John L. Klocke ,  Kyle M. Hanson

IPC分类号： C25D5/02

CPC分类号： C25D7/12 ,  C25D5/00 ,  C25D7/123 ,  C25D17/001 ,  C25D17/002 ,  C25D17/02 ,  C25D21/12

摘要： Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a cation permeable barrier layer. The cation permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain cationic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit deposit properties (e.g., resistivity) within desired ranges.

摘要翻译： 描述了利用第一处理流体和阳极电解处理微特征工件的工艺和系统。 使用第一处理流体，阳极，第二处理流体和阳离子可渗透阻挡层对微特征工件进行电解处理。 阳离子可渗透阻隔层将第一处理流体与第二处理流体分离，同时允许某些阳离子物质在两种流体之间转移。 所描述的方法在反复电镀循环中产生沉积物，其在所需范围内具有沉积性质（例如电阻率）。