公开(公告)号：US08961771B2

公开(公告)日：2015-02-24

申请号：US13559494

申请日：2012-07-26

申请人： Rajesh Baskaran ,  Robert W. Batz, Jr. ,  Bioh Kim ,  Tom L. Ritzdorf ,  John L. Klocke ,  Kyle M. Hanson

发明人： Rajesh Baskaran ,  Robert W. Batz, Jr. ,  Bioh Kim ,  Tom L. Ritzdorf ,  John L. Klocke ,  Kyle M. Hanson

IPC分类号： C25D7/12 ,  C25D17/00 ,  C25D17/02 ,  C25D21/12

CPC分类号： C25D7/12 ,  C25D5/00 ,  C25D7/123 ,  C25D17/001 ,  C25D17/002 ,  C25D17/02 ,  C25D21/12

摘要： Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a cation permeable barrier layer. The cation permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain cationic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit deposit properties (e.g., resistivity) within desired ranges.

摘要翻译： 描述了利用第一处理流体和阳极电解处理微特征工件的工艺和系统。 使用第一处理流体，阳极，第二处理流体和阳离子可渗透阻挡层对微特征工件进行电解处理。 阳离子可渗透阻隔层将第一处理流体与第二处理流体分离，同时允许某些阳离子物质在两种流体之间转移。 所描述的方法在反复电镀循环中产生沉积物，其在所需范围内具有沉积性质（例如电阻率）。

公开(公告)号：US08236159B2

公开(公告)日：2012-08-07

申请号：US11414145

申请日：2006-04-28

申请人： Rajesh Baskaran ,  Robert W. Batz, Jr. ,  Bioh Kim ,  Tom L. Ritzdorf ,  John L. Klocke ,  Kyle M. Hanson

发明人： Rajesh Baskaran ,  Robert W. Batz, Jr. ,  Bioh Kim ,  Tom L. Ritzdorf ,  John L. Klocke ,  Kyle M. Hanson

IPC分类号： C25D7/12 ,  C25D3/38 ,  C25F3/04 ,  C25F3/18

CPC分类号： C25D7/12 ,  C25D5/00 ,  C25D7/123 ,  C25D17/001 ,  C25D17/002 ,  C25D17/02 ,  C25D21/12

摘要： Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a cation permeable barrier layer. The cation permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain cationic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit deposit properties (e.g., resistivity) within desired ranges.

摘要翻译： 描述了利用第一处理流体和阳极电解处理微特征工件的工艺和系统。 使用第一处理流体，阳极，第二处理流体和阳离子可渗透阻挡层对微特征工件进行电解处理。 阳离子可渗透阻隔层将第一处理流体与第二处理流体分离，同时允许某些阳离子物质在两种流体之间转移。 所描述的方法在反复电镀循环中产生沉积物，其在所需范围内具有沉积性质（例如电阻率）。

公开(公告)号：US08852417B2

公开(公告)日：2014-10-07

申请号：US13406387

申请日：2012-02-27

申请人： Rajesh Baskaran ,  Robert W. Batz, Jr. ,  Bioh Kim ,  Tom L. Ritzdorf ,  John Lee Klocke ,  Kyle M. Hanson

发明人： Rajesh Baskaran ,  Robert W. Batz, Jr. ,  Bioh Kim ,  Tom L. Ritzdorf ,  John Lee Klocke ,  Kyle M. Hanson

IPC分类号： C25D17/02 ,  C25D7/12 ,  H01L21/288 ,  H01L21/768 ,  C25D17/00 ,  C25F3/02 ,  C25D5/02 ,  C25D3/38 ,  H05K3/42

CPC分类号： C25D5/028 ,  C25D3/12 ,  C25D3/20 ,  C25D3/30 ,  C25D3/34 ,  C25D3/38 ,  C25D3/46 ,  C25D3/54 ,  C25D5/022 ,  C25D17/001 ,  C25D17/002 ,  C25D21/12 ,  C25F3/02 ,  H01L21/2885 ,  H01L21/76846 ,  H01L21/76868 ,  H01L21/76873 ,  H05K3/423

摘要： Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and a counter electrode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, a counter electrode, a second processing fluid, and an anion permeable barrier layer. The anion permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain anionic species to transfer between the two fluids. Some of the described processes produce deposits over repeated plating cycles that exhibit resistivity values within desired ranges.

摘要翻译： 描述了利用第一处理流体和对电极对微特征工件进行电解处理的工艺和系统。 使用第一处理流体，对电极，第二处理流体和阴离子可渗透阻挡层对微特征工件进行电解处理。 阴离子可渗透阻挡层将第一处理流体与第二处理流体分离，同时允许某些阴离子物质在两种流体之间转移。 所描述的一些方法中的一些在反复电镀循环中产生沉积物，其显示出所需范围内的电阻率值。

公开(公告)号：US07252714B2

公开(公告)日：2007-08-07

申请号：US10295302

申请日：2002-11-15

申请人： Kyle M. Hanson ,  Robert W. Batz, Jr. ,  Rajesh Baskaran ,  Nolan Zimmerman ,  Zhongmin Hu ,  Gregory J. Wilson ,  Paul R. McHugh

发明人： Kyle M. Hanson ,  Robert W. Batz, Jr. ,  Rajesh Baskaran ,  Nolan Zimmerman ,  Zhongmin Hu ,  Gregory J. Wilson ,  Paul R. McHugh

IPC分类号： B05C3/00

CPC分类号： H01L21/6723 ,  C23C18/1676 ,  H01L21/67109 ,  Y10T137/0318

摘要： Apparatus and method for thermally controlled processing of microelectronic workpieces with liquids. An apparatus in accordance with and embodiment of the invention includes a process vessel configured to carry a processing liquid, such as an electroless processing liquid. The vessel has a thermally transmissive wall for transferring heat to and/or from the processing liquid within. A heat transfer device, such as a reservoir that receives processing liquid spilling over from the process vessel, transfers heat to or from the processing liquid within the process vessel. The heat transfer device can also transfer heat to or from an internal or external heat source, such as a conduit carrying a heat transfer fluid, or an electrical resistance heater. The interaction between the microelectronic workpiece and the processing liquid can be further controlled by controlling the rate at which the microelectronic workpiece rotates and/or the manner in which the microelectronic workpiece is introduced to and/or withdrawn from the processing liquid.

摘要翻译： 用液体对微电子工件进行热处理的装置和方法。 根据本发明的实施例的装置包括配置成承载诸如无电处理液体的处理液体的处理容器。 容器具有用于将热量传递到和/或内部的处理液体的热传递壁。 传热装置，例如容纳从处理容器溢出的处理液体的储存器，将热量传递到处理容器内或从处理容器内的处理液体。 传热装置还可以将热量传递到内部或外部热源，例如承载传热流体的导管或电阻加热器。 通过控制微电子工件旋转的速度和/或微电子工件被引入和/或从处理液中取出的方式，可以进一步控制微电子工件和处理液之间的相互作用。

公开(公告)号：US07048841B2

公开(公告)日：2006-05-23

申请号：US10354649

申请日：2003-01-28

申请人： Robert W. Batz, Jr. ,  John M. Pedersen ,  John L. Klocke ,  LinLin Chen

发明人： Robert W. Batz, Jr. ,  John M. Pedersen ,  John L. Klocke ,  LinLin Chen

IPC分类号： C23C28/00 ,  C25D17/00

CPC分类号： C25D17/06 ,  C25D5/08 ,  C25D7/123 ,  C25D17/001 ,  H01L21/288 ,  H01L21/2885 ,  Y10T29/49002

摘要： Contact assemblies, electroplating machines with contact assemblies, and methods for making contact assemblies that are used in the fabrication of microelectronic workpieces. The contact assemblies can be wet-contact assemblies or dry-contact assemblies. A contact assembly for use in an electroplating system can comprise a support member and a contact system coupled to the support member. The support member, for example, can be a ring or another structure that has an inner wall defining an opening configured to allow the workpiece to move through the support member along an access path. In one embodiment, the support member is a conductive ring having a plurality of posts depending from the ring that are spaced apart from one another by gaps. The contact system can be coupled to the posts of the support member. The contact system can have a plurality of contact members projecting inwardly into the opening relative to the support member and transversely with respect to the access path. The contact members can comprise electrically conductive biasing elements, such as fingers, that have a contact site and a dielectric coating covering at least a portion of the biasing elements. The contact members can also have a raised feature configured to engage the seed-layer on the workpiece for conducting the current to the seed-layer.

公开(公告)号：US06849167B2

公开(公告)日：2005-02-01

申请号：US10338200

申请日：2003-01-07

申请人： Daniel J. Woodruff ,  Kyle M. Hanson ,  Robert W. Batz, Jr. ,  James T. Kuechmann

发明人： Daniel J. Woodruff ,  Kyle M. Hanson ,  Robert W. Batz, Jr. ,  James T. Kuechmann

IPC分类号： C25D7/12 ,  H01L21/687 ,  C25B9/12 ,  C25D17/06

CPC分类号： H01L21/68728 ,  C25D17/001 ,  H01L21/68785

摘要： An apparatus for electroplating a workpiece is disclosed in which the apparatus includes a workpiece holding structure. The workpiece holding structure includes a workpiece support having at least one surface that is disposed to engage a front side of the workpiece and at least one electrical contact disposed for contact with at least one corresponding electrical contact on a back-side of the workpiece. The workpiece includes one or more electrically conductive paths between the at least one corresponding electrical contact and a front-side of the workpiece to facilitate electroplating of the front-side surface. An actuator is provided for driving the workpiece support between a first position in which the at least one electrical contact of the workpiece and the at least one contact of the workpiece holding structure are disengaged from one another, and a second position in which the at least one surface clamps the workpiece in a position in which the at least one electrical contact of the workpiece holding structure electrically engages the at least one electrical contact of the workpiece.

摘要翻译： 公开了一种用于电镀工件的设备，其中该设备包括工件保持结构。 工件保持结构包括具有至少一个表面的工件支撑件，所述至少一个表面设置成与工件的前侧相接合，以及至少一个电触点，该电触点设置成用于与工件的背面上的至少一个对应的电触点接触。 所述工件包括在所述至少一个对应的电触点和所述工件的前侧之间的一个或多个导电路径，以便于所述前侧表面的电镀。 提供致动器，用于在第一位置和第二位置之间驱动工件支撑件，在第一位置，工件的至少一个电触点与工件保持结构的至少一个触点彼此脱离，第二位置至少 一个表面将工件夹紧在其中工件保持结构的至少一个电接触与工件的至少一个电接触电接合的位置。

公开(公告)号：US06527925B1

公开(公告)日：2003-03-04

申请号：US09717927

申请日：2000-11-20

申请人： Robert W. Batz, Jr. ,  John M. Pedersen ,  John L. Klocke ,  LinLin Chen

发明人： Robert W. Batz, Jr. ,  John M. Pedersen ,  John L. Klocke ,  LinLin Chen

IPC分类号： C25D1716

CPC分类号： H01L21/2885 ,  A61K35/12 ,  C12N2500/25 ,  C12N2500/32 ,  C12N2500/34 ,  C12N2500/40 ,  C12N2501/11 ,  C12N2501/39 ,  C12N2501/395 ,  C12N2506/22 ,  C25D5/08 ,  C25D7/123 ,  C25D17/001 ,  C25D17/06

摘要： Contact assemblies, electroplating machines with contact assemblies, and methods for making contact assemblies that are used in the fabrication of microelectronic workpieces. The contact assemblies can be wet-contact assemblies or dry-contact assemblies. A contact assembly for use in an electroplating system can comprise a support member and a contact system coupled to the support member. The support member, for example, can be a ring or another structure that has an inner wall defining an opening configured to allow the workpiece to move through the support member along an access path. In one embodiment, the support member is a conductive ring having a plurality of posts depending from the ring that are spaced apart from one another by gaps. The contact system can be coupled to the posts of the support member. The contact system can have a plurality of contact members projecting inwardly into the opening relative to the support member and transversely with respect to the access path. The contact members can comprise electrically conductive biasing elements, such as fingers, that have a contact site and a dielectric coating covering at least a portion of the biasing elements. The contact members can also have a raised feature configured to engage the seed-layer on the workpiece for conducting the current to the seed-layer.

公开(公告)号：US06527926B2

公开(公告)日：2003-03-04

申请号：US09805502

申请日：2001-03-13

申请人： Daniel J. Woodruff ,  Kyle M. Hanson ,  Robert W. Batz, Jr. ,  James T. Kuechmann

发明人： Daniel J. Woodruff ,  Kyle M. Hanson ,  Robert W. Batz, Jr. ,  James T. Kuechmann

IPC分类号： C25B900

CPC分类号： H01L21/68728 ,  C25D17/001 ,  H01L21/68785

摘要： An apparatus for electroplating a workpiece is disclosed in which the apparatus includes a workpiece holding structure. The workpiece holding structure includes a workpiece support having at least one surface that is disposed to engage a front side of the workpiece and at least one electrical contact disposed for contact with at least one corresponding electrical contact on a back-side of the workpiece. The workpiece includes one or more electrically conductive paths between the at least one corresponding electrical contact and a front-side of the workpiece to facilitate electroplating of the front-side surface. An actuator is provided for driving the workpiece support between a first position in which the at least one electrical contact of the workpiece and the at least one contact of the workpiece holding structure are disengaged from one another, and a second position in which the at least one surface clamps the workpiece in a position in which the at least one electrical contact of the workpiece holding structure electrically engages the at least one electrical contact of the workpiece.

摘要翻译： 公开了一种用于电镀工件的设备，其中该设备包括工件保持结构。 工件保持结构包括具有至少一个表面的工件支撑件，所述至少一个表面设置成与工件的前侧相接合，以及至少一个电触点，该电触点设置成用于与工件的背面上的至少一个对应的电触点接触。 所述工件包括在所述至少一个对应的电触点和所述工件的前侧之间的一个或多个导电路径，以便于所述前侧表面的电镀。 提供致动器，用于在第一位置和第二位置之间驱动工件支撑件，在第一位置，工件的至少一个电触点与工件保持结构的至少一个触点彼此脱离，第二位置至少 一个表面将工件夹紧在其中工件保持结构的至少一个电接触与工件的至少一个电接触电接合的位置。

公开(公告)号：US06939448B2

公开(公告)日：2005-09-06

申请号：US10409690

申请日：2003-04-07

申请人： Robert W. Batz, Jr. ,  John M. Pedersen ,  John L. Klocke ,  LinLin Chen

发明人： Robert W. Batz, Jr. ,  John M. Pedersen ,  John L. Klocke ,  LinLin Chen

IPC分类号： C25D5/08 ,  C25D7/12 ,  C25D17/06 ,  H01L21/288 ,  C25D17/00

CPC分类号： C25D17/06 ,  C25D5/08 ,  C25D7/123 ,  C25D17/001 ,  H01L21/288 ,  H01L21/2885 ,  Y10T29/49002

摘要： Contact assemblies, electroplating machines with contact assemblies, and methods for making contact assemblies that are used in the fabrication of microelectronic workpieces. The contact assemblies can be wet-contact assemblies or dry-contact assemblies. A contact assembly for use in an electroplating system can comprise a support member and a contact system coupled to the support member. The support member, for example, can be a ring or another structure that has an inner wall defining an opening configured to allow the workpiece to move through the support member along an access path. In one embodiment, the support member is a conductive ring having a plurality of posts depending from the ring that are spaced apart from one another by gaps. The contact system can be coupled to the posts of the support member. The contact system can have a plurality of contact members projecting inwardly into the opening relative to the support member and transversely with respect to the access path. The contact members can comprise electrically conductive biasing elements, such as fingers, that have a contact site and a dielectric coating covering at least a portion of the biasing elements. The contact members can also have a raised feature configured to engage the seed-layer on the workpiece for conducting the current to the seed-layer.

公开(公告)号：US06911127B2

公开(公告)日：2005-06-28

申请号：US10353325

申请日：2003-01-28

申请人： Robert W. Batz, Jr. ,  John M. Pedersen ,  John L. Klocke ,  LinLin Chen

发明人： Robert W. Batz, Jr. ,  John M. Pedersen ,  John L. Klocke ,  LinLin Chen

IPC分类号： C23C18/16 ,  A61K35/12 ,  C23C28/00 ,  C25D5/08 ,  C25D7/12 ,  C25D17/06 ,  H01L21/288

CPC分类号： H01L21/2885 ,  A61K35/12 ,  C12N2500/25 ,  C12N2500/32 ,  C12N2500/34 ,  C12N2500/40 ,  C12N2501/11 ,  C12N2501/39 ,  C12N2501/395 ,  C12N2506/22 ,  C25D5/08 ,  C25D7/123 ,  C25D17/001 ,  C25D17/06

摘要： Contact assemblies, electroplating machines with contact assemblies, and methods for making contact assemblies that are used in the fabrication of microelectronic workpieces. The contact assemblies can be wet-contact assemblies or dry-contact assemblies. A contact assembly for use in an electroplating system can comprise a support member and a contact system coupled to the support member. The support member, for example, can be a ring or another structure that has an inner wall defining an opening configured to allow the workpiece to move through the support member along an access path. In one embodiment, the support member is a conductive ring having a plurality of posts depending from the ring that are spaced apart from one another by gaps. The contact system can be coupled to the posts of the support member. The contact system can have a plurality of contact members projecting inwardly into the opening relative to the support member and transversely with respect to the access path. The contact members can comprise electrically conductive biasing elements, such as fingers, that have a contact site and a dielectric coating covering at least a portion of the biasing elements. The contact members can also have a raised feature configured to engage the seed-layer on the workpiece for conducting the current to the seed-layer.

摘要翻译： 接触组件，具有接触组件的电镀机以及用于制造微电子工件的接触组件的方法。 接触组件可以是湿接触组件或干接触组件。 用于电镀系统的接触组件可以包括支撑构件和联接到支撑构件的接触系统。 例如，支撑构件可以是环或另一结构，其具有限定开口的内壁，所述开口被构造成允许工件沿着进入路径移动通过支撑构件。 在一个实施例中，支撑构件是导电环，其具有通过间隙彼此间隔开的从环环悬垂的多个柱。 接触系统可以联接到支撑构件的柱。 接触系统可以具有多个接触构件，其相对于支撑构件向内突出到开口中并且相对于进入路径横向地突出。 接触构件可以包括具有覆盖至少一部分偏置元件的接触位置和电介质涂层的导电偏置元件，例如手指。 接触构件还可以具有被配置为接合工件上的种子层的凸起特征，以将电流传导到种子层。