公开(公告)号：US20190325127A1

公开(公告)日：2019-10-24

申请号：US16503070

申请日：2019-07-03

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Maryam Ashoori ,  Benjamin D. Briggs ,  Justin A. Canaperi ,  Lawrence A. Clevenger ,  Leigh Anne H. Clevenger ,  Michael Rizzolo ,  Spyridon Skordas

IPC: G06F21/35 ,  G06F3/044 ,  G06K19/07 ,  G06K19/077

Abstract: A system for a touch screen interface that includes a coating including a plurality of a touch activated microchips; and a projector for projecting a light image onto the coating that is applied to a touch screen substrate. The system also includes an image calibrator that calibrates touch activated microchips in the coating to features of the light image projected onto the coating. The system further includes a receiver for receiving signal from the touch activated microchips when said feature of the light image is activated.

公开(公告)号：US20190325126A1

公开(公告)日：2019-10-24

申请号：US16502979

申请日：2019-07-03

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Maryam Ashoori ,  Benjamin D. Briggs ,  Justin A. Canaperi ,  Lawrence A. Clevenger ,  Leigh Anne H. Clevenger ,  Michael Rizzolo ,  Spyridon Skordas

IPC: G06F21/35 ,  G06F3/044 ,  G06K19/07 ,  G06K19/077

Abstract: A system for a touch screen interface that includes a coating including a plurality of a touch activated microchips; and a projector for projecting a light image onto the coating that is applied to a touch screen substrate. The system also includes an image calibrator that calibrates touch activated microchips in the coating to features of the light image projected onto the coating. The system further includes a receiver for receiving signal from the touch activated microchips when said feature of the light image is activated.

公开(公告)号：US10431116B2

公开(公告)日：2019-10-01

申请号：US14965667

申请日：2015-12-10

Applicant: International Business Machines Corporation

Inventor： Benjamin D. Briggs ,  Lawrence A. Clevenger ,  Leigh Anne H. Clevenger ,  Jonathan H. Connell, II ,  Nalini K. Ratha ,  Michael Rizzolo

IPC: G09B19/04 ,  G09B5/06 ,  G09B5/12 ,  G10L25/63

Abstract: Techniques for leveraging the capabilities of wearable mobile technology to collect data and to provide real-time feedback to an orator about his/her performance and/or audience interaction are provided. In one aspect, a method for providing real-time feedback to a speaker making a presentation to an audience includes the steps of: collecting real-time data from the speaker during the presentation, wherein the data is collected via a mobile device worn by the speaker; analyzing the real-time data collected from the speaker to determine whether corrective action is needed to improve performance; and generating a real-time alert to the speaker suggesting the corrective action if the real-time data indicates that corrective action is needed to improve performance, otherwise continuing to collect data from the speaker in real-time. Real-time data may also be collected from members of the audience and/or from other speakers (if present) via wearable mobile devices.

公开(公告)号：US10424456B2

公开(公告)日：2019-09-24

申请号：US15833394

申请日：2017-12-06

Applicant: International Business Machines Corporation

Inventor： Benjamin D. Briggs ,  Lawrence A. Clevenger ,  Michael Rizzolo

IPC: H01L21/00 ,  H01J21/10 ,  H01J19/24 ,  H01J9/02 ,  G06F17/50

Abstract: A field emission transistor includes a gate, a fold over emitter, and fold over collector. The emitter and the collector are separated from the gate by a void and are separated from a gate contact by gate contact dielectric. The void may be a vacuum, ambient air, or a gas. Respective ends of the emitter and the collector are separated by a gap. Electrons are drawn across gap from the emitter to the collector by an electrostatic field created when a voltage is applied to the gate. The emitter and collector include a first conductive portion substantially parallel with gate and a second conductive portion substantially perpendicular with gate. The second conductive portion may be formed by bending a segment of the first conductive portion. The second conductive portion is folded inward from the first conductive portion towards the gate. Respective second conductive portions are generally aligned.

公开(公告)号：US10395986B1

公开(公告)日：2019-08-27

申请号：US15992685

申请日：2018-05-30

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Benjamin D. Briggs ,  James J. Kelly ,  Donald F. Canaperi ,  Michael Rizzolo ,  Lawrence A. Clevenger

IPC: H01L23/52 ,  H01L21/768 ,  H01L23/522 ,  H01L23/528 ,  H01L21/321 ,  H01L21/027

Abstract: A method is presented for creating a fully-aligned via (FAV) by employing selective metal deposition. The method includes forming metal lines within a first inter-layer dielectric (ILD) layer, forming a second ILD layer over the first ILD layer, forming a lithographic stack over the second ILD layer to define areas where via growth is prevented, recessing the lithographic stack to expose a top surface of the metal lines where via growth is permitted by the lithographic stack, and performing metal growth over the exposed top surface of the metal lines where via growth is permitted.

公开(公告)号：US20190237402A1

公开(公告)日：2019-08-01

申请号：US15882301

申请日：2018-01-29

Applicant: International Business Machines Corporation

Inventor： Benjamin D. Briggs ,  Michael Rizzolo ,  Christopher J. Penny ,  Huai Huang ,  Lawrence A. Clevenger ,  Hosadurga Shobha

IPC: H01L23/528 ,  H01L23/522 ,  H01L21/768 ,  H01L21/3105 ,  H01L21/3213 ,  H01L21/311

Abstract: A method for manufacturing a semiconductor device includes forming a plurality of trenches in a dielectric layer, wherein the plurality of trenches each comprise a rounded surface, depositing a liner layer on the rounded surface of each of plurality of trenches, and depositing a conductive layer on the liner layer in each of the plurality of trenches, wherein the conductive layer and the liner layer form a plurality of interconnects, and each of the plurality of interconnects has a cylindrical shape.

公开(公告)号：US10361157B2

公开(公告)日：2019-07-23

申请号：US15650344

申请日：2017-07-14

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Benjamin D. Briggs ,  Lawrence A. Clevenger ,  Christopher J. Penny ,  Michael Rizzolo

IPC: H01L21/02 ,  H01L21/311 ,  H01L21/764 ,  H01L21/768 ,  H01L23/522 ,  H01L23/528 ,  H01L23/532 ,  H01L21/3213

Abstract: A method of forming an interconnect to an electrical device is provided. The structure produced by the method may include a plurality of metal lines in a region of a substrate positioned in an array of metal lines all having parallel lengths; and a plurality of air gaps between the metal lines in a same level as the metal lines, wherein an air gap is present between each set of adjacent metal lines. A plurality of interconnects may be present in electrical communication with said plurality of metal lines, wherein an exclusion zone for said plurality of interconnects is not present in said array of metal lines.

公开(公告)号：US20190172783A1

公开(公告)日：2019-06-06

申请号：US15829435

申请日：2017-12-01

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Benjamin D. Briggs ,  Lawrence A. Clevenger ,  Huai Huang ,  Christopher J. Penny ,  Michael Rizzolo ,  Hosadurga Shobha

IPC: H01L23/522 ,  H01L23/532 ,  H01L21/768

Abstract: A semiconductor interconnect structure and a method of fabricating the same are provided. The semiconductor interconnect structure includes a sea of interconnect lines including metal lines and neighboring dummy lines. The semiconductor interconnect structure further includes a dielectric layer arranged between the sea of lines.

公开(公告)号：US10312434B2

公开(公告)日：2019-06-04

申请号：US15805882

申请日：2017-11-07

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Benjamin D. Briggs ,  Joe Lee ,  Christopher J. Penny ,  Michael Rizzolo ,  Chih-Chao Yang

IPC: H01L27/22 ,  H01L43/12 ,  H01L43/08

Abstract: A method is presented for forming a semiconductor structure. The method includes depositing an insulating layer over a semiconductor substrate, etching the insulating layer to form trenches for receiving a metal, depositing one or more sacrificial layers, and etching portions of the one or more sacrificial layers to expose a top surface of the metal of one or more of the trenches. The method further includes selectively depositing an electrode over the top surface of the exposed metal and nitridizing the electrode to form a diffusion barrier between chip components and the metal.

公开(公告)号：US10276053B2

公开(公告)日：2019-04-30

申请号：US15008028

申请日：2016-01-27

Applicant: International Business Machines Corporation

Inventor： Benjamin D. Briggs ,  Lawrence A. Clevenger ,  Leigh Anne H. Clevenger ,  Jonathan H. Connell, II ,  Nalini K. Ratha ,  Michael Rizzolo

IPC: G09B5/12 ,  A61B5/11 ,  A61B5/00 ,  A61B5/0205 ,  G09B19/00

Abstract: Techniques for motivating a user during a workout using different coaching styles are provided. In one aspect, a method for motivational coaching of a user during workout sessions includes the steps of: selecting a coaching style for the user based on input from the user and from coaching styles used for at least one other user; determining, during a workout session, whether the coaching style should be changed to enhance performance of the user based on data obtained from the user via a mobile device worn by the user; changing the coaching style if it is determined that the coaching style should be changed to enhance performance of the user; continuing with a current coaching style if it is determined that the coaching style should not be changed; and providing feedback to the user during the workout session based on the coaching style.