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公开(公告)号:US11074382B2
公开(公告)日:2021-07-27
申请号:US15883652
申请日:2018-01-30
Applicant: International Business Machines Corporation
Inventor: Hanhee Paik , Firat Solgun , Salvatore Bernardo Olivadese , Martin O. Sandberg , Jay M. Gambetta
IPC: G06N10/00 , G06F30/3323 , G06F30/367 , G06N7/04
Abstract: Techniques and a system for quantum computing device modeling and design are provided. In one example, a system includes a modeling component and a simulation component. The modeling component models a quantum device element of a quantum computing device as an electromagnetic circuit element to generate electromagnetic circuit data for the quantum computing device. The simulation component simulates the quantum computing device using the electromagnetic circuit data to generate response function data indicative of a response function for the quantum computing device. Additionally or alternatively, a Hamiltonian is constructed based on the response function.
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公开(公告)号:US20210143309A1
公开(公告)日:2021-05-13
申请号:US16681295
申请日:2019-11-12
Applicant: International Business Machines Corporation
Inventor: Richard Alan Haight , Ali Afzali-Ardakani , Vivekananda P. Adiga , Martin O. Sandberg , Hanhee Paik
Abstract: Techniques regarding encapsulating one or more superconducting devices of a quantum processor are provided. For example, one or more embodiments described herein can regard a method that can comprise depositing an adhesion layer onto a superconducting resonator and a silicon substrate that are comprised within a quantum processor. The superconducting resonator can be positioned on the silicon substrate. Also, the adhesion layer can comprise a chemical compound having a thiol functional group.
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公开(公告)号:US20200168782A1
公开(公告)日:2020-05-28
申请号:US16202828
申请日:2018-11-28
Applicant: International Business Machines Corporation
Inventor: Vivekananda P. Adiga , Martin O. Sandberg , Jerry M. Chow
Abstract: Techniques for forming quantum circuits, including connections between components of quantum circuits, are presented. A trench can be formed in a dielectric material, by removing a portion of the dielectric material and a portion of conductive material layered on top of the dielectric material, to enable creation of circuit components of a circuit. The trench can define a regular nub or compensated nub to facilitate creating electrical leads connected to the circuit components on a nub. The compensated nub can comprise recessed regions to facilitate depositing material during evaporation to form the leads. For compensated nub implementation, material can be evaporated in two directions, with oxidation performed in between such evaporations, to contact leads and form a Josephson junction. For regular nub implementation, material can be evaporated in four directions, with oxidation performed in between the third and fourth evaporations, to contact leads and form a Josephson junction.
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公开(公告)号:US20200083424A1
公开(公告)日:2020-03-12
申请号:US16125098
申请日:2018-09-07
Applicant: International Business Machines Corporation
Inventor: Martin O. Sandberg , Vivekananda P. Adiga , Hanhee Paik
IPC: H01L39/24 , H01L39/06 , H01L39/08 , G01R33/035 , G01R33/022
Abstract: Techniques regarding parallel gradiometric SQUIDs and the manufacturing thereof are provided. For example, one or more embodiments described herein can comprise an apparatus, which can comprise a first pattern of superconducting material located on a substrate. Also, the apparatus can comprise a second pattern of superconducting material that can extend across the first pattern of superconducting material at a position. Further, the apparatus can comprise a Josephson junction located at the position, which can comprise an insulating barrier that can connect the first pattern of superconductor material and the second pattern of superconductor material.
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公开(公告)号:US20190236218A1
公开(公告)日:2019-08-01
申请号:US15883652
申请日:2018-01-30
Applicant: International Business Machines Corporation
Inventor: Hanhee Paik , Firat Solgun , Salvatore Bernardo Olivadese , Martin O. Sandberg , Jay M. Gambetta
CPC classification number: G06F17/504 , G06F17/5036 , G06N10/00
Abstract: Techniques and a system for quantum computing device modeling and design are provided. In one example, a system includes a modeling component and a simulation component. The modeling component models a quantum device element of a quantum computing device as an electromagnetic circuit element to generate electromagnetic circuit data for the quantum computing device. The simulation component simulates the quantum computing device using the electromagnetic circuit data to generate response function data indicative of a response function for the quantum computing device. Additionally or alternatively, a Hamiltonian is constructed based on the response function.
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公开(公告)号:US20190165241A1
公开(公告)日:2019-05-30
申请号:US16251569
申请日:2019-01-18
Applicant: International Business Machines Corporation
Inventor: Sami Rosenblatt , Jason S. Orcutt , Martin O. Sandberg , Markus Brink , Vivekananda P. Adiga , Nicholas T. Bronn
Abstract: A quantum bit (qubit) flip chip assembly may be formed when a qubit it formed on a first chip and an optically transmissive path is formed on a second chip. The two chips may be bonded. The optically transmissive path may provide optical access to the qubit on the first chip.
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公开(公告)号:US12048254B2
公开(公告)日:2024-07-23
申请号:US17071528
申请日:2020-10-15
Applicant: International Business Machines Corporation
Inventor: Vivekananda P. Adiga , Martin O. Sandberg , Jeng-Bang Yau , David L. Rath , John Bruley , Cihan Kurter , Kenneth P. Rodbell , Hongwen Yan
CPC classification number: H10N60/0912 , H10N60/805 , H10N60/83 , H10N60/85
Abstract: Devices, systems, methods, and/or computer-implemented methods that can facilitate protection of a substrate in a qubit device using sacrificial material are provided. According to an embodiment, a device can comprise a superconducting lead provided on a pillar of a sacrificial material provided on a substrate. The device can further comprise a collapsed superconducting junction provided on the substrate and coupled to the superconducting lead.
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公开(公告)号:US12022749B2
公开(公告)日:2024-06-25
申请号:US16808991
申请日:2020-03-04
Applicant: International Business Machines Corporation
Inventor: Rasit Onur Topaloglu , Vivekananda P. Adiga , Martin O. Sandberg
CPC classification number: H10N69/00 , H10N60/12 , H10N60/805 , H10N60/30 , H10N60/84
Abstract: Devices, systems, and/or methods that can facilitate local heating of a superconducting flux biasing loop are provided. According to an embodiment, a device can comprise a substrate having a superconducting flux bias circuit comprising a biasing loop coupled to a flux controlled qubit device. The device can further comprise a heating device coupled to the biasing loop.
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69.
公开(公告)号:US20240127096A1
公开(公告)日:2024-04-18
申请号:US18046468
申请日:2022-10-13
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor: Martin O. Sandberg , Abram L. Falk , Karthik Balakrishnan , Jason S. Orcutt
IPC: G06N10/40
CPC classification number: G06N10/40
Abstract: Methods and systems for mitigating the effects of defects in a quantum processor are provided. A mitigation system includes a quantum processor having multiple qubits. The system includes an array of light emitting sources. Each light emitting source is aligned with a qubit on the quantum processor. The system includes a controller configured to receive a selection of a qubit and to enable a light emitting source from the array of light emitting sources to emit light to the selected qubit. The light is use to scramble strongly coupled two-level systems (TLSs) in the quantum processor.
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70.
公开(公告)号:US20240127095A1
公开(公告)日:2024-04-18
申请号:US18046467
申请日:2022-10-13
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor: Karthik Balakrishnan , Abram L. Falk , Martin O. Sandberg , Jason S. Orcutt
Abstract: Methods and systems for mitigating the effects of defects in a quantum processor are provided. A mitigation system includes a quantum processor comprising a plurality of qubits. The system includes a light emitting source that can be tuned to produce light pulses of different wavelengths. The system includes an array of bandpass filters. Each bandpass filter is aligned with a qubit on the quantum processor and has a unique pass band. The system may include a controller configured to receive a selection of a qubit and to tune the light emitting source to emit a light pulse having a wavelength that falls within a range of a bandpass filter that is aligned with the selected qubit. The light pulse is used to scramble an ensemble of strongly coupled two-level system (TLS) in the processor.
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