公开(公告)号：US09025332B2

公开(公告)日：2015-05-05

申请号：US13782020

申请日：2013-03-01

Applicant: International Business Machines Corporation

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Roger R. Schmidt ,  Robert E. Simons ,  Daniel E. Zambrano

IPC: H05K7/20 ,  F28D15/00 ,  F28F9/00

CPC classification number: F28D15/00 ,  F28F9/00 ,  H05K7/2079 ,  H05K7/20827

Abstract: A method is provided which includes providing a cooling apparatus for an electronics rack which includes a door assembly configured to couple to an air inlet side of the electronics rack. The door assembly includes: one or more airflow openings facilitating passage of airflow through the door assembly and into the electronics rack; one or more air-to-coolant heat exchangers disposed so that airflow through the airflow opening(s) passes across the heat exchanger(s), which is configured to extract heat from airflow passing thereacross; and one or more airflow redistributors disposed in a direction of airflow through the airflow opening(s) downstream of, and at least partially aligned to, the heat exchanger(s). The airflow redistributor(s) facilitates redistribution of the airflow passing across the air-to-liquid heat exchanger(s) to a desired airflow pattern at the air inlet side of the electronics rack, such as a uniform airflow distribution across the air inlet side of the rack.

Abstract translation: 提供了一种方法，其包括提供用于电子机架的冷却装置，其包括构造成耦合到电子机架的空气入口侧的门组件。 门组件包括：一个或多个气流开口，便于气流通过门组件并进入电子机架; 一个或多个空气冷却剂热交换器被设置成使得通过气流开口的气流穿过热交换器，该热交换器被配置为从穿过其的气流中提取热量; 以及一个或多个气流再分布器，其布置在气流通过热交换器的下游并且至少部分对准的气流开口的方向上。 气流再分布器有助于通过空气 - 液体热交换器的气流再次分布到电子机架的空气入口侧的所需气流图案，例如穿过空气入口侧的均匀气流分布 的架子。

公开(公告)号：US09013872B2

公开(公告)日：2015-04-21

申请号：US13692235

申请日：2012-12-03

Applicant: International Business Machines Corporation ,  Kevin P. Radigan

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC: F28F9/00 ,  F25B1/00 ,  H05K7/20

CPC classification number: F28F9/00 ,  F25B1/00 ,  H05K7/20772 ,  H05K7/2079 ,  Y10T29/4935

Abstract: A method of fabricating a cooling unit is provided to facilitate cooling coolant passing through a coolant loop. The cooling unit includes one or more heat rejection units and an elevated coolant tank. The heat rejection unit(s) rejects heat from coolant passing through the coolant loop to air passing across the heat rejection unit. The heat rejection unit(s) includes one or more heat exchange assemblies coupled to the coolant loop for at least a portion of coolant to pass through the one or more heat exchange assemblies. The elevated coolant tank, which is elevated above at least a portion of the coolant loop, is coupled in fluid communication with the one or more heat exchange assemblies of the heat rejection unit(s), and facilitates return of coolant to the coolant loop at a substantially constant pressure.

Abstract translation: 提供了一种制造冷却单元的方法，以便冷却通过冷却剂回路的冷却剂。 冷却单元包括一个或多个散热单元和升高的冷却剂箱。 散热单元将通过冷却剂回路的冷却剂的热量排除通过散热单元的空气。 散热单元包括联接到冷却剂回路的一个或多个热交换组件，用于至少一部分冷却剂通过一个或多个热交换组件。 在冷却剂回路的至少一部分上方升高的升高的冷却剂箱与散热单元的一个或多个热交换组件流体连通地联接，并且便于冷却剂返回到冷却剂回路 基本恒定的压力。

公开(公告)号：US08827547B2

公开(公告)日：2014-09-09

申请号：US13795030

申请日：2013-03-12

Applicant: International Business Machines Corporation

Inventor： Matthew R. Archibald ,  Richard C. Chu ,  Hendrik Hamann ,  Madhusudan K. Iyengar ,  Roger R. Schmidt

IPC: G01K1/12 ,  G01K1/16 ,  G01K13/10 ,  G01K17/06

CPC classification number: G06F17/5009 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20609 ,  H05K7/20745

Abstract: Apparatus and method are provided for facilitating simulation of heated airflow exhaust of an electronics subsystem, electronics rack or row of electronics racks. The apparatus includes a thermal simulator, which includes an air-moving device and a fluid-to-air heat exchanger. The air-moving device establishes airflow from an air inlet to air outlet side of the thermal simulator tailored to correlate to heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The fluid-to-air heat exchanger heats airflow through the thermal simulator, with temperature of airflow exhausting from the simulator being tailored to correlate to temperature of the heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The apparatus further includes a fluid distribution apparatus, which includes a fluid distribution unit disposed separate from the fluid simulator and providing hot fluid to the fluid-to-air heat exchanger of the thermal simulator.

Abstract translation: 提供了设备和方法，以便于模拟电子子系统，电子机架或电子机架行的热气流排气。 该装置包括热模拟器，其包括空气移动装置和流体对空气热交换器。 空气移动装置建立从热模拟器的空气入口到空气出口侧的气流，其被定制成与要模拟的电子子系统，机架或行架排的加热气流排气相关联。 流体对空气热交换器通过热模拟器加热气流，使来自模拟器的气流的温度被调整为与正在模拟的电子子系统，机架或行架的加热气流排气的温度相关。 该装置还包括流体分配装置，其包括与流体模拟器分离设置的流体分配单元，并向热模拟器的流体对空气热交换器提供热流体。

公开(公告)号：US09357682B2

公开(公告)日：2016-05-31

申请号：US13758143

申请日：2013-02-04

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons ,  Prabjit Singh ,  Jing Zhang

IPC: F28F13/00 ,  H05K7/20

CPC classification number: H05K7/20836 ,  F28F2265/14

Abstract: An automated multi-fluid cooling method is provided for cooling an electronic component(s). The method includes obtaining a coolant loop, and providing a coolant tank, multiple valves, and a controller. The coolant loop is at least partially exposed to outdoor ambient air temperature(s) during normal operation, and the coolant tank includes first and second reservoirs containing first and second fluids, respectively. The first fluid freezes at a lower temperature than the second, the second fluid has superior cooling properties compared with the first, and the two fluids are soluble. The multiple valves are controllable to selectively couple the first or second fluid into the coolant in the coolant loop, wherein the coolant includes at least the second fluid. The controller automatically controls the valves to vary first fluid concentration level in the coolant loop based on historical, current, or anticipated outdoor air ambient temperature(s) for a time of year.

Abstract translation: 提供了用于冷却电子部件的自动多流体冷却方法。 该方法包括获得冷却剂回路，以及提供冷却剂箱，多个阀和控制器。 在正常操作期间，冷却剂回路至少部分地暴露于室外环境空气温度，并且冷却剂箱分别包括容纳第一和第二流体的第一和第二储存器。 第一流体在比第二流体低的温度下冻结，第二流体与第一流体相比具有优异的冷却性能，并且两种流体是可溶的。 多个阀是可控制的，以选择性地将第一或第二流体耦合到冷却剂回路中的冷却剂中，其中冷却剂至少包括第二流体。 控制器根据一年中的历史，当前或预期的室外空气环境温度，自动控制阀门改变冷却剂回路中的第一个液体浓度水平。

公开(公告)号：US09357674B2

公开(公告)日：2016-05-31

申请号：US14132230

申请日：2013-12-18

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC: H05K7/20

CPC classification number: H05K7/20218 ,  H05K7/2039 ,  H05K7/20772 ,  Y10T29/4935

Abstract: Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from an electronic component(s). The cooling apparatus includes a liquid-cooled heat sink with a thermally conductive structure having a coolant-carrying compartment including a region of reduced cross-sectional coolant flow area. The heat sink includes a coolant inlet and outlet in fluid communication with the compartment, and the region of reduced cross-sectional coolant flow area provides an increased effective heat transfer coefficient between a main heat transfer surface of the conductive structure and the coolant. The cooling apparatus further includes a coolant loop coupled to the coolant inlet and outlet to facilitate flow of coolant through the coolant-carrying compartment, and a coolant filter positioned to filter contaminants from the coolant passing through the heat sink. The coolant filter has a larger cross-sectional coolant flow area than the region of reduced cross-sectional coolant flow area.

Abstract translation: 提供冷却装置，冷却的电子模块和制造方法，其促进从电子部件的热传递。 冷却装置包括具有导热结构的液冷式散热器，该导热结构具有包括减小横截面冷却剂流动面积的区域的冷却剂输送室。 散热器包括与隔室流体连通的冷却剂入口和出口，并且减小的横截面冷却剂流动区域的区域提供了导电结构的主传热表面与冷却剂之间增加的有效传热系数。 冷却装置还包括联接到冷却剂入口和出口的冷却剂回路，以便于冷却剂流过冷却剂携带室，以及冷却剂过滤器，其被定位成过滤来自穿过散热器的冷却剂的污染物。 冷却剂过滤器具有比截面冷却剂流动面积减小的区域更大的横截面冷却剂流动面积。

公开(公告)号：US09332674B2

公开(公告)日：2016-05-03

申请号：US14058581

申请日：2013-10-21

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/203 ,  H05K7/20 ,  H05K7/20236 ,  H05K7/20336 ,  H05K7/20781

Abstract: A cooled electronic system and cooling method are provided, wherein a field-replaceable bank of electronic components is cooled by an apparatus which includes an enclosure at least partially surrounding and forming a compartment about the electronic components, a fluid disposed within the compartment, and a heat sink associated with the enclosure. The field-replaceable bank extends, in part, through the enclosure to facilitate operative docking of the electronic components into one or more respective receiving sockets of the electronic system. The electronic components of the field-replaceable bank are, at least partially, immersed within the fluid to facilitate immersion-cooling of the components, and the heat sink facilitates rejection of heat from the fluid disposed within the compartment. In one embodiment, multiple thermal conductors project from an inner surface of the enclosure into the compartment to facilitate transfer of heat from the fluid to the heat sink.

Abstract translation: 提供一种冷却的电子系统和冷却方法，其中一个现场可替换的电子部件组由一种装置冷却，所述装置包括至少部分围绕电子部件周围并形成隔室的外壳，设置在隔间内的流体 与外壳相关的散热器。 现场可更换组件部分地延伸通过外壳以便于将电子部件与电子系统的一个或多个相应的接收插座的操作对接。 现场可更换组的电子部件至少部分地浸没在流体内以便于部件的浸入冷却，并且散热器有助于排除设置在隔室内的流体的热量。 在一个实施例中，多个热导体从壳体的内表面突出到隔室中以便于将热量从流体传递到散热器。

公开(公告)号：US09313920B2

公开(公告)日：2016-04-12

申请号：US14058546

申请日：2013-10-21

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Dustin W. Demetriou ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC: H02B1/00 ,  H02B1/56 ,  H05K7/20 ,  G06F1/20 ,  H05K5/00 ,  F28D15/00 ,  F28F7/00 ,  F28B3/04 ,  F28D15/02 ,  F25B23/00

CPC classification number: H05K7/203 ,  F25B23/006 ,  F28B3/04 ,  F28D15/0266 ,  H05K7/20809 ,  Y10T29/4935

Abstract: Cooling apparatuses and methods are provided facilitating transfer of heat from a working fluid to a coolant. The cooling apparatus includes a vapor condenser which includes a condenser housing with a condensing chamber accommodating the working fluid and coolant, which are in direct contact within the condensing chamber and are immiscible fluids. The condensing chamber includes a working fluid vapor layer and a working fluid liquid layer; and a working fluid vapor inlet facilitates flow of fluid vapor into the condensing chamber, and a working fluid vapor outlet facilitates egress of working fluid liquid from the condensing chamber. A coolant inlet structure facilitates ingress of coolant into the working fluid vapor layer of the condensing chamber in direct contact with the working fluid vapor to facilitate condensing the vapor into working fluid liquid, and the coolant outlet structure facilitates subsequent egress of coolant from the condensing chamber.

Abstract translation: 提供了冷却装置和方法，便于将热量从工作流体传递到冷却剂。 冷却装置包括蒸气冷凝器，其包括具有容纳工作流体和冷却剂的冷凝室的冷凝器壳体，其在冷凝室内直接接触并且是不混溶的流体。 冷凝室包括工作流体蒸汽层和工作流体液体层; 并且工作流体蒸气入口促进流体蒸汽流入冷凝室，并且工作流体蒸气出口便于从冷凝室排出工作流体液体。 冷却剂入口结构有助于将冷却剂进入冷凝室的工作流体蒸汽层，与工作流体蒸汽直接接触，以便于将蒸汽冷凝成工作流体液体，并且冷却剂出口结构便于后续从冷凝室排出冷却剂 。

公开(公告)号：US09303926B2

公开(公告)日：2016-04-05

申请号：US13785236

申请日：2013-03-05

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC: F28D15/00 ,  F28D15/02 ,  F28F3/02 ,  F28F3/12 ,  H05K7/20

CPC classification number: F28D15/02 ,  F28F3/022 ,  F28F3/12 ,  H05K7/20654 ,  H05K7/20809

Abstract: Vapor condensers and cooling apparatuses facilitating vapor condensation cooling of a coolant employed in cooling an electronic device or electronic subsystem. The vapor condenser includes a thermally conductive base structure having an operational orientation when the condenser is facilitating vapor condensate formation, and a plurality of thermally conductive condenser fins extending from the thermally conductive base structure. The plurality of thermally conductive condenser fins have a varying cross-sectional perimeter along at least a portion of their length. The cross-sectional perimeters of the plurality of thermally conductive condenser fins are configured to increase in a direction of condensate travel through the thermally conductive base structure.

Abstract translation: 蒸气冷凝器和冷却装置促进用于冷却电子设备或电子子系统的冷却剂的蒸气冷凝冷却。 蒸汽冷凝器包括导热基体结构，当冷凝器促进蒸汽冷凝物形成时，具有工作方向，以及从导热基体结构延伸的多个导热冷凝器翅片。 多个导热冷凝器翅片沿其长度的至少一部分具有变化的横截面周长。 多个导热冷凝器翅片的横截面周长被配置为沿冷凝物行进通过导热基底结构的方向增加。

公开(公告)号：US09291281B2

公开(公告)日：2016-03-22

申请号：US13706557

申请日：2012-12-06

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC: F16K31/70 ,  F16K31/00 ,  F28F27/02 ,  F28F27/00 ,  F28F3/12 ,  H05K7/20

CPC classification number: F16K31/002 ,  F28F3/12 ,  F28F27/00 ,  F28F27/02 ,  H05K7/20781 ,  H05K7/20836

Abstract: Cooling apparatuses and methods are presented for facilitating dissipation of heat generated by one or more electronic components. The apparatuses include, for instance, a coolant-cooled heat sink and a thermostat-controlled valve. The heat sink includes one or more coolant-carrying channels and one or more valve wells intersecting the channels. The thermostat-controlled valve is disposed, at least partially, within a respective valve well so as to intersect a respective coolant-carrying channel, and includes a valve disk and a thermal-sensitive actuator mechanically coupled to rotate the valve disk. The valve disk is rotatable between an open position where coolant is allowed to flow through the respective coolant-carrying channel, and a closed position where coolant is blocked from flowing through the respective channel. The actuator rotates the valve disk between the open position and the closed position, dependent on heating of the thermal-sensitive actuator by the electronic component(s).

Abstract translation: 呈现冷却装置和方法，以便于散发由一个或多个电子部件产生的热量。 这些装置包括例如冷却剂冷却的散热器和恒温器控制的阀。 散热器包括一个或多个冷却剂承载通道和与通道相交的一个或多个阀井。 恒温控制阀至少部分地设置在相应的阀井内，以与相应的冷却剂承载通道相交，并且包括阀盘和机械耦合以旋转阀盘的热敏致动器。 阀盘可以在允许冷却剂流过相应的冷却剂输送通道的打开位置和阻止冷却剂流过相应通道的关闭位置之间旋转。 执行器根据电子部件对热敏致动器的加热，使阀盘在打开位置和关闭位置之间旋转。

公开(公告)号：US09101078B2

公开(公告)日：2015-08-04

申请号：US13676212

申请日：2012-11-14

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC: F28D15/00 ,  H02B1/00 ,  H05K7/00 ,  F24F7/00 ,  H05K7/20 ,  F28D1/047

CPC classification number: H05K7/20145 ,  F28D1/0477 ,  H05K7/203 ,  H05K7/20318 ,  H05K7/20772 ,  H05K7/20781 ,  H05K7/2079 ,  H05K7/20827 ,  H05K7/20836

Abstract: A cooling apparatus and method are provided for cooling an electronics rack. The cooling apparatus includes an air-cooled cooling station, which has a liquid-to-air heat exchanger and ducting for directing a cooling airflow across the heat exchanger. A cooling subsystem is associated with the electronics rack, and includes a liquid-cooled condenser facilitating immersion-cooling of electronic components of the electronics rack, a liquid-cooled structure providing conductive cooling to electronic components of the electronics rack, or an air-to-liquid heat exchanger associated with the rack and cooling airflow passing through the electronics rack. A coolant loop couples the cooling subsystem to the liquid-to-air heat exchanger. In operation, heat is transferred via circulating coolant from the electronics rack, and rejected in the liquid-to-air heat exchanger of the cooling station to the cooling airflow passing across the liquid-to-air heat exchanger. In one embodiment, the cooling airflow is outdoor air.

Abstract translation: 提供冷却装置和方法来冷却电子机架。 该冷却装置包括一个空气冷却站，该冷却站具有液体 - 空气热交换器和用于引导冷却气流穿过热交换器的管道。 冷却子系统与电子机架相关联，并且包括液冷式冷凝器，其有助于电子机架的电子部件的浸入冷却，为电子机架的电子部件提供导电冷却的液冷结构，或空气 - - 与机架相关联的液体热交换器和通过电子机架的冷却气流。 冷却剂回路将冷却子系统连接到液 - 空热交换器。 在操作中，通过循环冷却剂从电子机架转移热量，并且在冷却站的液体 - 空气热交换器中被排斥到穿过液体 - 空气热交换器的冷却气流。 在一个实施例中，冷却气流是室外空气。