公开(公告)号：US11169372B2

公开(公告)日：2021-11-09

申请号：US16782507

申请日：2020-02-05

申请人： Yuji Kimura

发明人： Yuji Kimura

IPC分类号： G02B26/08 ,  G02B26/10

摘要： A light scanning apparatus includes a light source configured to output laser light, and a mirror configured to reflect the laser light from the light source. The light scanning apparatus includes a mirror driving unit configured to resonantly drive the mirror in a first direction and non-resonantly drive the mirror in a second direction, the second direction being perpendicular to the first direction. The light scanning apparatus includes a first sensor configured to output a signal in accordance with a first deflection angle at which the mirror is oriented with respect to the first direction. The light scanning apparatus includes a second sensor configured to output a signal in accordance with a second deflection angle at which the mirror is oriented with respect to the second direction.

公开(公告)号：US10078259B2

公开(公告)日：2018-09-18

申请号：US15556333

申请日：2016-02-24

申请人： Yuji Kimura ,  Riichiro Hibiya

发明人： Yuji Kimura ,  Riichiro Hibiya

IPC分类号： G03B21/28 ,  G03B33/06 ,  G03B21/00 ,  H04N9/31 ,  G09G3/02

CPC分类号： G03B33/06 ,  G02B26/10 ,  G03B21/008 ,  G03B21/28 ,  G09G3/02 ,  G09G3/025 ,  H04N9/3129 ,  H04N9/3155 ,  H04N9/3164 ,  H04N9/3194

摘要： An optical scanning control device includes a scanner that scans light emitted from a laser in accordance with an image signal to form an image on a screen; a first optical detector that detects light scanned by the scanner; a second optical detector that detects light scanned by the scanner; and a controller that controls a deflection angle of the scanner based on a time difference between an output of the first optical detector and an output of the second optical detector.

公开(公告)号：US08558123B2

公开(公告)日：2013-10-15

申请号：US13026540

申请日：2011-02-14

申请人： Hiroki Horiguchi ,  Yuji Kimura

发明人： Hiroki Horiguchi ,  Yuji Kimura

IPC分类号： H01R13/46

CPC分类号： H05K13/00 ,  B23K1/0016 ,  B32B15/01 ,  B32B15/018 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49144 ,  H01L2924/00

摘要： An electronic component device having a first sealing frame formed on a main substrate and a second sealing frame formed on a cover substrate, the first and second sealing frames being composed of a Ni film. A bonding section constituted by a Ni—Bi alloy is formed between the first and second sealing frames. For example, a Bi layer is formed on the first sealing frame, and then the first sealing frame and the second sealing frame are heated at a temperature of 300° C. for at least 10 seconds while applying pressure in the direction in which the first sealing frame and the second sealing frame are in close contact with each other, and thus the bonding section, which bonds the first sealing frame to the second sealing frame, is formed.

摘要翻译： 一种电子部件装置，其具有形成在主基板上的第一密封框架和形成在盖基板上的第二密封框架，所述第一密封框架和第二密封框架由Ni膜构成。 在第一和第二密封框架之间形成由Ni-Bi合金构成的接合部。 例如，在第一密封框架上形成Bi层，然后将第一密封框架和第二密封框架在300℃的温度下加热至少10秒，同时沿着第一密封框架 密封框架和第二密封框架彼此紧密接触，从而形成将第一密封框架结合到第二密封框架的接合部分。

公开(公告)号：US20120249283A1

公开(公告)日：2012-10-04

申请号：US13145455

申请日：2010-01-14

申请人： Yuji Kimura ,  Takahiro Asada ,  Kazuaki Suzuki

发明人： Yuji Kimura ,  Takahiro Asada ,  Kazuaki Suzuki

IPC分类号： H01H37/76

CPC分类号： H01H37/761 ,  H01H1/5805 ,  H01H2037/768

摘要： A protection element is provided which is capable of stably retaining a flux on a soluble conductor at a predetermined position, enabling a speedy and precise blowout of the soluble conductor in the event of an abnormality. This protection element includes: a soluble conductor 13 which is disposed on an insulation baseboard 11 and is connected to a power supply path of a device targeted to be protected, to cause a blowout by means of a predetermined abnormal electric power; a flux 19 which is coated onto a surface of the soluble conductor 13; and an insulation cover 14 which is mounted on the baseboard 11 with the soluble conductor 13 being covered therewith. In addition, the protection element is provided with a protrusive stripe portion 20 which is formed on an interior face of the insulation cover 14 in opposite to the soluble conductor 13 and in which a stepped portion 20a for retaining the flux 19 is formed at a predetermined position while in contact with the flux 19. The soluble conductor 13 has a hole portion 13a at which the flux 19 is retained.

摘要翻译： 提供一种保护元件，其能够在预定位置上稳定地保持可溶性导体上的助熔剂，从而能够在异常情况下快速且精确地喷出可溶性导体。 该保护元件包括：可溶性导体13，其设置在绝缘基板11上并连接到被保护的装置的电源路径，以通过预定的异常电力引起井喷; 焊剂19，其涂覆在可溶性导体13的表面上; 以及绝缘盖14，其被安装在基板11上，可溶性导体13被覆盖。 此外，保护元件设置有突出条形部分20，其形成在绝缘盖14的与可溶性导体13相对的内表面上，并且其中用于保持焊剂19的阶梯部分20a形成在预定的 位置，同时与焊剂19接触。可溶性导体13具有孔部分13a，焊剂19保持在该孔部分13a。

公开(公告)号：US20120001720A1

公开(公告)日：2012-01-05

申请号：US13145611

申请日：2010-01-14

申请人： Yuji Kimura ,  Youzo Ohashi ,  Takahiro Asada

发明人： Yuji Kimura ,  Youzo Ohashi ,  Takahiro Asada

IPC分类号： H01H85/50

CPC分类号： H01H37/761 ,  H01H1/5805 ,  H01H85/046 ,  H01H2037/768 ,  H01H2085/0414

摘要： A protective device is provided that allows a fusible conductor to be fused off quickly in stability at the time of protective operation against over-current or the like. The protective device includes a fusible conductor 13 and an insulation cover 14 mounted on a base substrate 11 to overlie the fusible conductor 13. The fusible conductor, arranged on an insulating base substrate 11 and connected to a power delivery path of equipment to be protected, is fused off by a preset unusual power. The protective device also includes a flux 19 coated on the fusible conductor 13 and provided within the insulation cover 14. The fusible conductor 13 is immobilized on pair electrodes 12 and a conductor layer 17 on the base substrate 11 via a solder paste 20 containing a metal component exhibiting sufficient wettability against the fusible conductor 13 in a fused state. The solder paste 20, arranged on the pair electrodes 12 and the conductor layer 17, is spread more outwardly than the rim of the fusible conductor 13.

摘要翻译： 提供一种保护装置，其允许在对过电流等进行保护操作时稳定地熔断易熔体。 保护装置包括可熔导体13和安装在基底基板11上以覆盖可熔导体13的绝缘盖14.可熔体导体布置在基底绝缘基板11上，并连接到被保护设备的电力输送路径上， 被预设的异常电源熔断。 该保护装置还包括涂覆在熔断体13上并设置在绝缘罩14内的焊剂19.该熔丝13通过含有金属的焊膏20固定在基底12上的一对电极12和导体层17上。 在融合状态下对熔断体13表现出足够的润湿性的组分。 布置在对电极12和导体层17上的焊膏20比可熔导体13的边缘更向外扩展。

公开(公告)号：US20110132655A1

公开(公告)日：2011-06-09

申请号：US13023055

申请日：2011-02-08

申请人： Hiroki Horiguchi ,  Yuji Kimura

发明人： Hiroki Horiguchi ,  Yuji Kimura

IPC分类号： H01R13/46 ,  H05K3/00 ,  B32B15/01

CPC分类号： H03H9/105 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  H03H9/1014 ,  Y10T29/49124 ,  Y10T428/12889 ,  Y10T428/12986 ,  H01L2924/00

摘要： An electronic component device having a first sealing frame formed on a main substrate and a second sealing frame formed on a cover substrate, both of which are composed of a Ni film. A bonding section bonds the first sealing frame to the second sealing frame. For example, a Bi layer is formed on the first sealing frame and an Au layer is formed on the second sealing frame, and then the first sealing frame and the second sealing frame are heated at a temperature of 300° C. for 10 seconds while applying pressure in the direction in which the first sealing frame and the second sealing frame are close contact with each other to form the bonding section. The bonding section is constituted by a mixed layer predominantly composed of a mixed alloy of a Ni—Bi—Au ternary alloy and Au2Bi.

摘要翻译： 一种电子部件装置，其具有形成在主基板上的第一密封框架和形成在盖基板上的第二密封框架，两者均由Ni膜构成。 接合部将第一密封框架结合到第二密封框架。 例如，在第一密封框架上形成Bi层，在第二密封框架上形成Au层，然后将第一密封框架和第二密封框架在300℃的温度下加热10秒，同时 在第一密封框架和第二密封框架彼此紧密接触的方向上施加压力以形成接合部分。 接合部由主要由Ni-Bi-Au三元合金和Au2Bi的混合合金构成的混合层构成。

公开(公告)号：US20090125583A1

公开(公告)日：2009-05-14

申请号：US12266963

申请日：2008-11-07

申请人： Shinichi HAYASHI ,  Hiroshi Saito ,  Yukio Ogawa ,  Nobuyuki Fujieda ,  Yuji Kimura

发明人： Shinichi HAYASHI ,  Hiroshi Saito ,  Yukio Ogawa ,  Nobuyuki Fujieda ,  Yuji Kimura

IPC分类号： G06F15/16

CPC分类号： H04L67/322 ,  H04L67/08

摘要： A priority control system includes a terminal, and a processing server coupled over a network. The processing server has an operation processing sections each of which executes a predetermined process, a communications device, a priority determination section, and a priority assignment section. The processing server also has priority information about priorities to be assigned according to a type of operation processing section. Each of the operation processing sections executes the predetermined process based on a packet, provided by the terminal, and generates screen information with a result of the predetermined process. The communications device transmits screen information with an assigned priority. The terminal receives the screen information transferred by a network device on the network in accordance with the priority, and displays the screen information.

摘要翻译： 优先级控制系统包括终端和通过网络耦合的处理服务器。 处理服务器具有执行预定处理的操作处理部分，通信设备，优先级确定部分和优先级分配部分。 处理服务器还具有关于根据操作处理部分的类型分配的优先级的优先级信息。 每个操作处理部分基于由终端提供的分组执行预定处理，并且生成具有预定处理结果的画面信息。 通信设备以分配的优先级发送屏幕信息。 终端根据优先级接收由网络设备在网络上传送的屏幕信息，并显示屏幕信息。

公开(公告)号：US20080122711A1

公开(公告)日：2008-05-29

申请号：US11732062

申请日：2007-04-02

申请人： Yuji Kimura ,  Yoshitaka Yoshino ,  Koichi Mukai ,  Chisato Komori

发明人： Yuji Kimura ,  Yoshitaka Yoshino ,  Koichi Mukai ,  Chisato Komori

IPC分类号： H01Q3/24 ,  H01Q1/00 ,  H01Q9/00

CPC分类号： H01Q1/46 ,  H01Q1/273 ,  H04R1/1033

摘要： Disclosed herein is an antenna device for receiving a broadcast wave in each of a first required frequency band and a second required frequency band, the antenna device including: an earphone cable including an audio signal line and a ground line; and an antenna element cable including a coaxial line formed by covering a core line with an insulator and further covering the insulator with an outer covering conductor, and an audio signal line, a leading end of the antenna element cable being connected to the earphone cable via a relay circuit, and a base end of the antenna element cable being connected to a device including a tuner via an antenna switching circuit.

摘要翻译： 本发明公开了一种用于在第一所需频带和第二所需频带中的每一个中接收广播波的天线装置，所述天线装置包括：包括音频信号线和接地线的耳机线; 以及天线元件电缆，包括通过用绝缘体覆盖芯线并且用外部覆盖导体进一步覆盖绝缘体而形成的同轴线，以及音频信号线，天线元件电缆的前端经由 继电器电路和天线元件电缆的基端通过天线切换电路连接到包括调谐器的装置。

公开(公告)号：US06673143B2

公开(公告)日：2004-01-06

申请号：US09809266

申请日：2001-03-16

申请人： Shigeru Sakai ,  Yuji Kimura

发明人： Shigeru Sakai ,  Yuji Kimura

IPC分类号： C04B1400

CPC分类号： C04B35/584

摘要： An aqueous slurry of rare earth hydroxide particles which is particularly suitable for use as a sintering aid of a ceramic powder such as silicon nitride. The aqueous slurry, which is characterized by the very small average diameter of the primary particles and a low electric conductivity as well as outstandingly high stability against settling of the particles, can be prepared by a process comprising the steps of: (a) precipitating rare earth hydroxide particles by mixing aqueous solutions of a rare earth compound, e.g., nitrate, and a basic compound, e.g., ammonia, preferably, in the presence of a surface active agent; (b) collecting the precipitates to give a cake; (c) washing the cake with deionized water until the electric conductivity of the washing has decreased to 3 mS/cm or lower; and (d) re-dispersing the thus washed cake in deionized water.

摘要翻译： 稀土氢氧化物颗粒的水性浆料，其特别适合用作陶瓷粉末如氮化硅的烧结助剂。 其特征在于初级颗粒的平均直径非常小，导电性低以及对颗粒沉降的极高稳定性的含水浆料可以通过包括以下步骤的方法制备：（a）将稀有的沉淀物 通过混合稀土化合物（例如硝酸盐）和碱性化合物（例如氨）的水溶液，优选在表面活性剂的存在下混合地球氢氧化物颗粒; （b）收集沉淀物以得到蛋糕; （c）用去离子水洗涤滤饼直到洗涤液的电导率降至3mS / cm以下; 和（d）将如此洗涤的滤饼重新分散在去离子水中。

公开(公告)号：US06552475B2

公开(公告)日：2003-04-22

申请号：US09892231

申请日：2001-06-27

申请人： Yoshitsugu Hori ,  Yuji Kimura ,  Kazunobu Shimoe ,  Shigeto Taga ,  Toshiyuki Fuyutsume

发明人： Yoshitsugu Hori ,  Yuji Kimura ,  Kazunobu Shimoe ,  Shigeto Taga ,  Toshiyuki Fuyutsume

IPC分类号： H01L4108

CPC分类号： H03H3/08 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11 ,  H01L2224/05624 ,  H01L2924/00014 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05124 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05171

摘要： A surface acoustic wave device includes a surface acoustic wave substrate having two IDT electrodes including wiring electrode portions made of aluminum disposed thereon. First, second and third metal films are laminated on each of the wiring electrode portions. The first metal film has superior bondability to aluminum, and the third metal film has superior bondability to bumps. In addition, the second metal film has an ability to suppress the diffusion of the metal defining the first metal film.