公开(公告)号：US06552475B2

公开(公告)日：2003-04-22

申请号：US09892231

申请日：2001-06-27

申请人： Yoshitsugu Hori ,  Yuji Kimura ,  Kazunobu Shimoe ,  Shigeto Taga ,  Toshiyuki Fuyutsume

发明人： Yoshitsugu Hori ,  Yuji Kimura ,  Kazunobu Shimoe ,  Shigeto Taga ,  Toshiyuki Fuyutsume

IPC分类号： H01L4108

CPC分类号： H03H3/08 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11 ,  H01L2224/05624 ,  H01L2924/00014 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05124 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05171

摘要： A surface acoustic wave device includes a surface acoustic wave substrate having two IDT electrodes including wiring electrode portions made of aluminum disposed thereon. First, second and third metal films are laminated on each of the wiring electrode portions. The first metal film has superior bondability to aluminum, and the third metal film has superior bondability to bumps. In addition, the second metal film has an ability to suppress the diffusion of the metal defining the first metal film.

公开(公告)号：US06349870B1

公开(公告)日：2002-02-26

申请号：US09537381

申请日：2000-03-29

申请人： Yuji Kimura ,  Shigeto Taga

发明人： Yuji Kimura ,  Shigeto Taga

IPC分类号： B23K106

CPC分类号： H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/81801 ,  H01L2224/8182 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15787 ,  H01L2924/16195 ,  H03H3/02 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/05624 ,  H01L2224/05644

摘要： A method of manufacturing an electronic component includes bonding an electronic component via a bump to electrically and mechanically connect the electronic component to a base member and bonding a cap member to the base member in such a manner that the cap member covers the electronic component element. High temperature aging is performed after bonding the electronic component to the base member via the bump.

摘要翻译： 一种制造电子部件的方法包括：经由凸块接合电子部件，将电子部件电连接并机械地连接于基部部件，并且以将帽部件覆盖电子部件元件的方式将盖部件接合于基座部件。 通过凸块将电子部件接合到基底部件之后进行高温老化。

公开(公告)号：US08803652B2

公开(公告)日：2014-08-12

申请号：US13145455

申请日：2010-01-14

申请人： Yuji Kimura ,  Takahiro Asada ,  Kazuaki Suzuki

发明人： Yuji Kimura ,  Takahiro Asada ,  Kazuaki Suzuki

IPC分类号： H01H37/76 ,  H01H37/04 ,  H01H85/20 ,  H01H85/04

CPC分类号： H01H37/761 ,  H01H1/5805 ,  H01H2037/768

摘要： A protection element is provided which is capable of stably retaining a flux on a soluble conductor at a predetermined position, enabling a speedy and precise blowout of the soluble conductor in the event of an abnormality. This protection element includes: a soluble conductor 13 which is disposed on an insulation baseboard 11 and is connected to a power supply path of a device targeted to be protected, to cause a blowout by means of a predetermined abnormal electric power; a flux 19 which is coated onto a surface of the soluble conductor 13; and an insulation cover 14 which is mounted on the baseboard 11 with the soluble conductor 13 being covered therewith. In addition, the protection element is provided with a protrusive stripe portion 20 which is formed on an interior face of the insulation cover 14 in opposite to the soluble conductor 13 and in which a stepped portion 20a for retaining the flux 19 is formed at a predetermined position while in contact with the flux 19. The soluble conductor 13 has a hole portion 13a at which the flux 19 is retained.

摘要翻译： 提供一种保护元件，其能够在预定位置上稳定地保持可溶性导体上的助熔剂，从而能够在异常情况下快速且精确地喷出可溶性导体。 该保护元件包括：可溶性导体13，其设置在绝缘基板11上并连接到被保护的装置的电源路径，以通过预定的异常电力引起井喷; 焊剂19，其涂覆在可溶性导体13的表面上; 以及绝缘盖14，其被安装在基板11上，可溶性导体13被覆盖。 此外，保护元件设置有突出条形部分20，其形成在绝缘盖14的与可溶性导体13相对的内表面上，并且其中用于保持焊剂19的阶梯部分20a形成在预定的 位置，同时与焊剂19接触。可溶性导体13具有孔部分13a，焊剂19保持在该孔部分13a。

公开(公告)号：US08794498B2

公开(公告)日：2014-08-05

申请号：US13181614

申请日：2011-07-13

申请人： Yuji Kimura ,  Hiroki Horiguchi

发明人： Yuji Kimura ,  Hiroki Horiguchi

IPC分类号： B23K31/02 ,  H01L21/44 ,  H01L21/441 ,  B81C3/00 ,  B81C1/00 ,  H01L23/00

CPC分类号： B81C3/001 ,  B81C1/00269 ,  B81C2203/0109 ,  B81C2203/019 ,  B81C2203/036 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/166 ,  H01L2924/3025 ,  Y10T428/31678 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： In a method for producing an electronic component device, a heat bonding step is performed in a state in which low melting point metal layers including low melting point metals including, for example, Sn as the main component, are arranged to sandwich, in the thickness direction, a high melting point metal layer including a high melting point metal including, for example, Cu as the main component, which is the same or substantially the same as high melting point metals defining first and second conductor films to be bonded. In order to generate an intermetallic compound of the high melting point metal and the low melting point metal, the distance in which the high melting point metal is to be diffused in each of the low melting point metal layers is reduced. Thus, the time required for the diffusion is reduced, and the time required for the bonding is reduced.

摘要翻译： 在电子部件装置的制造方法中，以包含例如以Sn为主要成分的低熔点金属的低熔点金属层配置成将厚度夹层的状态进行热粘合工序 方向，包括例如以Cu为主要成分的高熔点金属的高熔点金属层，其与限定要结合的第一和第二导体膜的高熔点金属相同或基本相同。 为了产生高熔点金属和低熔点金属的金属间化合物，降低了在每个低熔点金属层中高熔点金属扩散的距离。 因此，扩散所需的时间减少，并且键合所需的时间减少。

公开(公告)号：US20110291050A1

公开(公告)日：2011-12-01

申请号：US13147933

申请日：2010-02-26

申请人： Yuji Kimura ,  Yasushi Takai ,  Hirofumi Kawazoe

发明人： Yuji Kimura ,  Yasushi Takai ,  Hirofumi Kawazoe

IPC分类号： C09K11/78 ,  C04B35/64

CPC分类号： C09K11/7792 ,  C04B35/44 ,  C04B35/6268 ,  C04B35/62685 ,  C04B2235/3206 ,  C04B2235/3208 ,  C04B2235/3213 ,  C04B2235/3215 ,  C04B2235/3222 ,  C04B2235/3224 ,  C04B2235/3262 ,  C04B2235/3409 ,  C04B2235/5436 ,  C04B2235/604 ,  C04B2235/763 ,  C09K11/01 ,  Y02W30/72

摘要： Provided is a method for manufacturing MAl2O4:Eu,RE type long-lasting phosphor ceramics capable of producing the ceramics at a reduced raw material cost. In addition, provided is a sintered product of a long-lasting phosphor having no yellow body color. More specifically, provided are the method for manufacturing MAl2O4:Eu,RE type long-lasting phosphor ceramics in which M is an alkaline earth element and RE is a rare earth element other than europium, comprising mixing a BAM (alkaline earth aluminate) phosphor, an alkaline earth compound, an aluminum compound and a rare earth compound to form a mixture, and then firing the mixture; and a white MAl2O4:Eu,RE type long-lasting phosphor.

摘要翻译： 提供一种制造能够以降低的原材料成本制造陶瓷的MAl 2 O 4：Eu，RE型长效荧光体陶瓷的方法。 此外，提供了不具有黄色体色的长效荧光体的烧结体。 更具体地说，提供了制造Ml 2 O 4：Eu，RE型长效荧光体陶瓷的方法，其中M是碱土金属元素，RE是铕以外的稀土元素，包括混合BAM（碱土金属铝酸盐）荧光体， 碱土金属化合物，铝化合物和稀土化合物，形成混合物，然后烧结混合物; 和白色MAl2O4：Eu，RE型持久荧光粉。

公开(公告)号：US20110017253A1

公开(公告)日：2011-01-27

申请号：US12805153

申请日：2010-07-15

申请人： Mitsuhiro Kataoka ,  Yuji Kimura ,  Eiichi Okuno

发明人： Mitsuhiro Kataoka ,  Yuji Kimura ,  Eiichi Okuno

IPC分类号： H01L35/30

CPC分类号： H01J45/00

摘要： A thermionic converter includes an emitter electrode and a collector electrode. The emitter electrode includes a P-type diamond semiconductor layer doped with a P-type impurity. The emitter electrode is configured to emit a thermion from the P-type diamond semiconductor layer when heat is applied from an external power source. The collector electrode includes an N-type diamond semiconductor layer doped with an N-type impurity. The N-type diamond semiconductor layer opposes the P-type diamond semiconductor layer and is located at a predetermined distance from the P-type diamond semiconductor layer. The collector electrode is configured to receive the thermion emitted from the emitter electrode at the N-type diamond semiconductor layer.

摘要翻译： 热离子转换器包括发射极和集电极。 发射极包括掺杂有P型杂质的P型金刚石半导体层。 发射电极被配置为当从外部电源施加热时从P型金刚石半导体层发射热离子。 集电极包括掺杂有N型杂质的N型金刚石半导体层。 N型金刚石半导体层与P型金刚石半导体层相对，并且位于距离P型金刚石半导体层预定距离处。 集电极配置为接收在N型金刚石半导体层处从发射极发射的热电离。

公开(公告)号：US20070127741A1

公开(公告)日：2007-06-07

申请号：US11599354

申请日：2006-11-15

申请人： Yuji Kimura ,  Yoshitaka Yoshino ,  Koichi Mukai ,  Chisato Komori

发明人： Yuji Kimura ,  Yoshitaka Yoshino ,  Koichi Mukai ,  Chisato Komori

IPC分类号： H04R3/00

CPC分类号： H04H40/18 ,  H01Q1/242 ,  H01Q1/46 ,  H04B1/034 ,  H04M1/05

摘要： The present invention provides a receiver for making an earphone cord of an earphone function as an earphone antenna. The receiver includes a receiver circuit for receiving a broadcast wave signal received at the earphone code of the earphone and outputting an audio signal, an earphone jack into which a earphone plug is inserted, a first detector circuit for detecting whether the earphone is one of stereo and monaural functionalities, and a second detector circuit for the earphone is connected to the receiver. The earphone jack has an antenna terminal, left channel audio terminal and right channel audio terminal, a first detection terminal and a second detection terminal, and a ground terminal.

摘要翻译： 本发明提供一种用于制造耳机的耳机线作为耳机天线的接收机。 接收机包括接收电路，用于接收在耳机的耳机码处接收的广播波信号并输出​​音频信号，插入耳机插头的耳机插孔，用于检测耳机是否是立体声的第一检测器电路 和单声道功能，并且用于耳机的第二检测器电路连接到接收器。 耳机插孔具有天线端子，左声道音频端子和右声道音频端子，第一检测端子和第二检测端子以及接地端子。

公开(公告)号：US07178157B1

公开(公告)日：2007-02-13

申请号：US09708256

申请日：2000-11-07

申请人： Yuji Kimura ,  Kazue Sadanaka ,  Satoshi Kobayashi ,  Hiroshi Utsunomiya ,  Futoshi Kaibuki ,  Kazuhiro Suzuki ,  Kenji Matsuoka ,  Masahiko Sato ,  Makoto Sato

发明人： Yuji Kimura ,  Kazue Sadanaka ,  Satoshi Kobayashi ,  Hiroshi Utsunomiya ,  Futoshi Kaibuki ,  Kazuhiro Suzuki ,  Kenji Matsuoka ,  Masahiko Sato ,  Makoto Sato

IPC分类号： H04N5/445 ,  G06F3/00 ,  G06F13/00

CPC分类号： H04L12/40117 ,  H04H60/80 ,  H04L12/6418 ,  H04N5/4401 ,  H04N5/44513 ,  H04N5/60 ,  H04N5/765 ,  H04N5/775 ,  H04N7/088 ,  H04N21/4312 ,  H04N21/4314 ,  H04N21/43615 ,  H04N21/44227 ,  H04N21/485

摘要： A control section of an IRD sends an identification start request to a digital bus via a digital input/output terminal. The control section generates an identification display message by controlling an identification display message generation section, makes a superimposition section superimpose the identification display message on an analog video signal, and outputs a resulting signal via an analog output terminal. An information input apparatus allows a user to identify an input terminal connected to the output terminal of the IRD among a plurality of input terminals of the self apparatus by reproducing the identification display message and presenting it to the user.

摘要翻译： IRD的控制部分经由数字输入/输出终端向数字总线发送识别开始请求。 控制部通过控制识别显示消息生成部生成识别显示消息，使叠加部将识别显示消息叠加在模拟视频信号上，并通过模拟输出端输出结果信号。 信息输入装置允许用户通过再现识别显示消息并将其呈现给用户来识别连接到自身装置的多个输入端中的IRD的输出端子的输入端子。

公开(公告)号：US20050064627A1

公开(公告)日：2005-03-24

申请号：US10901750

申请日：2004-07-29

申请人： Yuji Kimura ,  Takenobu Maeda ,  Toru Yabe

发明人： Yuji Kimura ,  Takenobu Maeda ,  Toru Yabe

IPC分类号： H01L21/60 ,  H01L23/485 ,  H01L23/544 ,  H05K1/02 ,  H05K3/30 ,  H05K3/40 ,  H01L21/44 ,  H01L21/48

CPC分类号： H05K1/0269 ,  H01L23/544 ,  H01L24/11 ,  H01L2223/54473 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/1134 ,  H01L2224/1403 ,  H01L2224/16225 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/15787 ,  H05K3/303 ,  H05K3/4015 ,  H05K2201/0367 ,  H05K2201/09781 ,  H05K2201/10674 ,  H05K2203/166 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00014

摘要： A circuit element having electrodes on one main surface thereof and a substrate having connection bump electrodes and recognition bump electrodes provided on one main surface thereof are prepared. Connection bumps and recognition bumps are formed on the connection bump electrodes and the recognition bump electrodes by using a wire bonding method. Based on the images of the recognition bumps picked up by an optical device, the location of the recognition bumps is detected and, based on the detected location, the circuit element is connected to the substrate through the connection bumps. Since the upper portions of the recognition bumps are in a convex shape, a contrast with respect to the recognition bump electrodes is easily obtained and the location of the recognition bumps can be correctly detected.

摘要翻译： 制备在其一个主表面上具有电极的电路元件和设置在其一个主表面上的具有连接凸块电极和识别凸块电极的基板。 通过使用引线接合方法，在连接凸块电极和识别凸块电极上形成连接凸起和识别凸块。 基于由光学装置拾取的识别凸块的图像，检测识别凸块的位置，并且基于检测到的位置，电路元件通过连接凸块连接到基板。 由于识别凸块的上部是凸形的，因此容易获得相对于识别凸块电极的对比度，并且可以正确地检测识别凸块的位置。

公开(公告)号：US06654399B1

公开(公告)日：2003-11-25

申请号：US09511778

申请日：2000-02-23

申请人： Yuji Kimura ,  Katsunori Abe ,  Kinya Atsumi

发明人： Yuji Kimura ,  Katsunori Abe ,  Kinya Atsumi

IPC分类号： H01S500

CPC分类号： G01S17/936 ,  G01S7/4815 ,  G01S7/4817 ,  G01S7/484 ,  G01S17/42 ,  H01L2224/48091 ,  H01L2224/49111 ,  H01L2924/00014

摘要： In performing an light emitting operation using a plurality of semiconductor light-emitting devices, these semiconductor light-emitting devices are lighted up such that the driving current is lessened and the life time of the devices is prevented from being shortened and lights can be emitted to a remote site without reducing an amount of lights. Semiconductor laser devices 23a to 23c, which emit lights through independent lenses 25a to 25c, are connected in series to each other and connected to a signal generating circuit 24, serving as a power supply, so as to perform pulse lighting, whereby making it possible to light up three semiconductor laser devices simultaneously at a driving current corresponding to one semiconductor laser device. A package of semiconductor laser devices 23a to 23c comprises three lead terminals, and an electrical connection to two lead terminals, which are electrically insulated from a metallic base, is established. If a light collection point P is positioned in the midway of the detection distance range, the shifting quantity of the laser beams is minimized over substantially the entire area so that the amount of lights can be suppressed.

摘要翻译： 在使用多个半导体发光器件进行发光操作时，这些半导体发光器件点亮，使得驱动电流减小，并且防止器件的寿命被缩短，并且可以将光发射到 远程站点，而不减少灯光量。 通过独立透镜25a至25c发光的半导体激光器件23a至23c彼此串联连接并连接到用作电源的信号发生电路24，从而使其成为可能 以对应于一个半导体激光器装置的驱动电流同时点亮三个半导体激光器件。 半导体激光器件23a至23c的封装包括三个引线端子，并且与两个引线端子的电连接，其与金属基底电绝缘。 如果光收集点P位于检测距离范围的中间，则激光束的移动量在整个面积上最小化，从而可以抑制光量。