公开(公告)号：US20190259527A1

公开(公告)日：2019-08-22

申请号：US16059747

申请日：2018-08-09

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chan YOON ,  Dong Hwan LEE ,  Young Ghyu AHN ,  Won Chul SIM

IPC: H01F27/29 ,  H01F17/00 ,  H01F17/04 ,  H01F3/00 ,  H01F5/04 ,  H05K1/18

Abstract: An inductor includes a body including a support member having a first through-hole, a second through-hole, a first via-hole and a second via-hole, the first and second via-holes being spaced apart from the first and second through-holes, a first coil unit and a second coil unit disposed on one surface of the support member, a third coil unit and a fourth coil unit facing the one surface of the support member, and an encapsulant encapsulating the support member and the first to fourth coil units and including a magnetic material, and a first external electrode to a fourth external electrode respectively connected to the first to fourth coil units on an external surface of the body. The encapsulant includes a first encapsulant and a second encapsulant having magnetic permeability different from each other.

公开(公告)号：US20160078986A1

公开(公告)日：2016-03-17

申请号：US14625297

申请日：2015-02-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chan YOON ,  Dong Hwan LEE ,  Young Ghyu AHN

IPC: H01F5/04 ,  H01F3/00

CPC classification number: H01F5/04 ,  H01F3/00 ,  H01F17/0013 ,  H01F27/292 ,  H01F2017/0066

Abstract: There are provided a coil component and a board having the same. The coil component includes: a magnetic body including a substrate having two cores, first and second coil parts disposed on one surface of the substrate and wound in the same direction, and third and fourth coil parts disposed on the other surface of the substrate to be spaced apart from each other; and first to fourth external electrodes disposed on outer surfaces of the magnetic body and connected to the first to fourth coil parts.

Abstract translation: 提供了线圈部件和具有该线圈部件的板。 线圈部件包括：包括具有两个芯的基板的磁体，设置在基板的一个表面上并沿相同方向缠绕的第一和第二线圈部分，以及设置在基板的另一个表面上的第三和第四线圈部分 彼此间隔开; 以及第一至第四外部电极，其设置在所述磁性体的外表面上并与所述第一至第四线圈部连接。

公开(公告)号：US20160042859A1

公开(公告)日：2016-02-11

申请号：US14692696

申请日：2015-04-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Moon Soo PARK ,  Jong Ho LEE ,  Dong Hwan LEE ,  Jin Ok HAN ,  Tae Young KIM

IPC: H01F27/28 ,  H01F27/255

CPC classification number: H01F17/04 ,  H01F17/0013 ,  H01F27/02 ,  H01F2003/106 ,  H01F2017/048

Abstract: There is provided a chip electronic component including: a magnetic body having an internal coil part embedded therein, wherein the magnetic body includes: a central portion provided inside of the internal coil part and including a core; and an outer peripheral portion provided outside of the central portion, the central portion and the outer peripheral portion having different magnetic permeabilities.

Abstract translation: 提供了一种芯片电子部件，包括：具有嵌入其中的内部线圈部分的磁体，其中所述磁体包括：设置在所述内部线圈部分内部并包括芯的中心部分; 以及设置在中央部外侧的外周部，中央部和外周部具有不同的磁导率。

公开(公告)号：US20150102891A1

公开(公告)日：2015-04-16

申请号：US14505012

申请日：2014-10-02

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chan YOON ,  Dong Hwan LEE ,  Jin Woo HAN

IPC: H01F27/28

CPC classification number: H01F27/2804 ,  H01F2027/2819

Abstract: A chip electronic component may include: a magnetic body having first and second main surfaces opposing each other in a thickness direction, first and second side surfaces opposing each other in a width direction, and first and second end surfaces opposing each other in a length direction, a thickness of the magnetic body being greater than a width thereof; internal coil pattern parts disposed in the magnetic body; and external electrodes disposed on at least one surface of the magnetic body. The internal coil pattern parts may be disposed to be perpendicular with respect to the first and second main surfaces of the magnetic body.

Abstract translation: 芯片电子部件可以包括：具有在厚度方向上彼此相对的第一和第二主表面的磁体，在宽度方向上彼此相对的第一和第二侧表面以及在长度方向上彼此相对的第一和第二端面 磁体的厚度大于其宽度; 设置在磁体内的内部线圈图形部分; 以及设置在所述磁性体的至少一个表面上的外部电极。 内部线圈图形部分可以相对于磁性体的第一和第二主表面垂直设置。

公开(公告)号：US20150047888A1

公开(公告)日：2015-02-19

申请号：US14256558

申请日：2014-04-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chan YOON ,  Dong Hwan LEE ,  Tae Young KIM

IPC: H01F27/30 ,  H01F27/29 ,  H05K1/18

CPC classification number: H01F27/292 ,  H01F17/0006 ,  H01F27/324 ,  H01F2017/0066 ,  H01F2017/0073 ,  H01F2017/048 ,  H05K3/3442 ,  H05K2201/1003

Abstract: A coil component may include: a magnetic body; and first and eighth external electrodes formed on one surface of the magnetic body, second and third external electrodes and sixth and seventh external electrodes that are formed on two surfaces adjacent to the one surface of the magnetic body, respectively, and fourth and fifth external electrodes formed on the other surface opposing the one surface of the magnetic body. The magnetic body includes upper and lower substrates and first to fourth coil parts disposed between the upper and lower substrates and enclosed by an insulation film, the first to fourth coil parts having coupled coils wound in parallel on the same plane, respectively, so that magnetic fluxes in the coupled coils are formed in directions opposite to each other, the coupled coils being composed of first to eighth coils.

Abstract translation: 线圈部件可以包括：磁体; 以及形成在磁体的一个表面上的第一和第八外部电极，分别形成在与磁体的一个表面相邻的两个表面上的第二和第三外部电极以及第六和第七外部电极，以及第四和第五外部电极 形成在与磁体的一个表面相对的另一表面上。 磁体包括上下基板和设置在上基板和下基板之间并由绝缘膜包围的第一至第四线圈部分，第一至第四线圈部分具有分别在同一平面上并联缠绕的线圈，使得磁 耦合线圈中的磁通在彼此相反的方向上形成，耦合的线圈由第一至第八线圈组成。

公开(公告)号：US20140104798A1

公开(公告)日：2014-04-17

申请号：US14055335

申请日：2013-10-16

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Seung Wook Park ,  Dong Hwan LEE ,  Romero CHRISTIAN ,  Young Do KWEON ,  Jin Gu KIM

IPC: H05K1/11

CPC classification number: H05K1/11 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/115 ,  H05K3/4673 ,  H05K2201/09509 ,  H05K2201/09727 ,  Y10T428/24802 ,  H01L2924/00

Abstract: Disclosed herein are a hybrid lamination substrate and a manufacturing method thereof. The hybrid lamination substrate includes: a core layer; at least one first insulating layer that is made of a photosensitive resin material and is formed on an upper portion, a lower portion, or upper and lower portions of the core layer; and at least one second insulating layer that is made of a non-photosensitive resin material and is formed on the upper portion, the lower portion, or the upper and lower portions of the core layer. Further, a package substrate including the same and a manufacturing method of a hybrid lamination substrate are proposed.

Abstract translation: 本文公开了混合层合基板及其制造方法。 混合层压基板包括：芯层; 至少一个第一绝缘层，由感光树脂材料制成并形成在芯层的上部，下部或上下部分上; 以及由非感光性树脂材料制成并且形成在芯层的上部，下部或上下部分上的至少一个第二绝缘层。 此外，提出了包括该封装基板的封装基板和混合层叠基板的制造方法。

公开(公告)号：US20140077896A1

公开(公告)日：2014-03-20

申请号：US14027835

申请日：2013-09-16

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Dong Hwan LEE ,  Seung Wook Park ,  Christian Romero ,  Young Do Kweon ,  Jin Gu Kim

IPC: H03H7/01

CPC classification number: H03H7/17 ,  H05K1/0251 ,  H05K1/116 ,  H05K2201/09381

Abstract: The present invention relates to a via structure having an open stub and a printed circuit board having the same. In accordance with an embodiment of the present invention, a via structure having an open stub including: a signal transmission via passing through an insulating layer; upper and lower via pads for connecting first and second transmission lines, which are respectively formed on and under the insulating layer, and the signal transmission via; and at least one open stub connected to an outer periphery of each via pad to have a shunt capacitance with each ground pattern formed on and under the insulating layer is provided. Further, a printed circuit board with a via having an open stub is provided.

Abstract translation: 本发明涉及具有开口短截线的通孔结构和具有该开口短路的印刷电路板。 根据本发明的实施例，具有开口短截线的通孔结构包括：通过绝缘层的信号传输; 用于连接分别形成在绝缘层上和下面的第一和第二传输线的上和下通孔焊盘和信号传输通孔; 并且提供连接到每个通孔焊盘的外周的至少一个开放短截线以具有形成在绝缘层上和下面的每个接地图案的分流电容。 此外，提供了具有开口短路的通孔的印刷电路板。