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61.
公开(公告)号:US11853869B2
公开(公告)日:2023-12-26
申请号:US17987369
申请日:2022-11-15
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sungho Kim , Cheheung Kim , Jaeho Lee
Abstract: A neural network apparatus that is configured to process an operation includes neural network circuitry configured to receive a first input of an n-bit activation, store a second input of an m-bit weight, perform a determination whether to perform an operation on an ith bit of the first input and a jth bit of the second input, output an operation value of an operation performed on the ith bit of the first input and the jth bit of the second input based on the determination, and produce an operation value of the operation based on the determination.
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公开(公告)号:US11669202B2
公开(公告)日:2023-06-06
申请号:US17432275
申请日:2020-02-17
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sanghun Kwak , Daehyun Yoo , Bongjun Ko , Mansung Kim , Jaeho Lee , Junghoon Choi , Changjin Kim , Sangheon Park , Jongdae Park
CPC classification number: G06F3/0418 , G06F3/044
Abstract: According to an embodiment, an electronic device may include: a processor; and a touch circuit configured to output, to the processor, information associated with a touch on at least one surface of the electronic device. The touch circuit may be configured to: generate first raw data including a first value associated with capacitance for each of multiple channels of the touch circuit; generate a first baseline on the basis of the first raw data; identify whether the first raw data satisfies a designated condition; and identify whether the first baseline is reset, on the basis of whether the raw data satisfies the designated condition.
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公开(公告)号:US11663451B2
公开(公告)日:2023-05-30
申请号:US16274547
申请日:2019-02-13
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sungho Kim , Cheheung Kim , Jaeho Lee
CPC classification number: G06N3/063 , G06F7/50 , G06F7/523 , G06F2207/4824
Abstract: A 2D array-based neuromorphic processor includes: axon circuits each being configured to receive a first input corresponding to one bit from among bits indicating n-bit activation; first direction lines extending in a first direction from the axon circuits; second direction lines intersecting the first direction lines; synapse circuits disposed at intersections of the first direction lines and the second direction lines, and each being configured to store a second input corresponding to one bit from among bits indicating an m-bit weight and to output operation values of the first input and the second input; and neuron circuits connected to the second direction lines, each of the neuron circuits being configured to receive an operation value output from at least one of the synapse circuits, based on time information assigned individually to the synapse circuits, and to perform a multi-bit operation by using the operation values and the time information.
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公开(公告)号:US11626489B2
公开(公告)日:2023-04-11
申请号:US17541871
申请日:2021-12-03
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jaeho Lee , Hyeonjin Shin , Dongwook Lee , Seongjun Park , Kiyoung Lee , Eunkyu Lee , Sanghyun Jo , Jinseong Heo
IPC: H01L31/0352 , H01L29/16 , H01L31/09 , H01L31/028 , H01L31/101 , H01L51/05 , H01L51/00 , H01L27/144 , H01L27/146 , H01L27/15 , H01L29/12 , H01L27/30
Abstract: Provided are an optical sensor including graphene quantum dots and an image sensor including an optical sensing layer. The optical sensor may include a graphene quantum dot layer that includes a plurality of first graphene quantum dots bonded to a first functional group and a plurality of second graphene quantum dots bonded to a second functional group that is different from the first functional group. An absorption wavelength band of the optical sensor may be adjusted based on types of functional groups bonded to the respective graphene quantum dots and/or sizes of the graphene quantum dots.
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公开(公告)号:US11450396B2
公开(公告)日:2022-09-20
申请号:US17398434
申请日:2021-08-10
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kyungryun Kim , Yoonna Oh , Hohyun Shin , Jaeho Lee
Abstract: A semiconductor memory device comprises a memory cell array including segments disposed at corresponding intersections of row and column blocks, each row block including dynamic memory cells coupled to word-lines and bit-lines, a row decoder that activates a first word-line of a first row block in response to a row address, determines whether the first row block is a master block based on a first fuse information and a second row block is mapped as a slave to the master block, activates a second word-line of the second row block, and outputs a row block information signal, and a column decoder accessing a portion of first memory cells coupled to the first word-line or a portion of second memory cells coupled to the second word-line based on a column address, the row block information signal and a second fuse information.
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公开(公告)号:US20220020445A1
公开(公告)日:2022-01-20
申请号:US17398434
申请日:2021-08-10
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kyungryun Kim , Yoonna Oh , Hohyun Shin , Jaeho Lee
Abstract: A semiconductor memory device comprises a memory cell array including segments disposed at corresponding intersections of row and column blocks, each row block including dynamic memory cells coupled to word-lines and bit-lines, a row decoder that activates a first word-line of a first row block in response to a row address, determines whether the first row block is a master block based on a first fuse information and a second row block is mapped as a slave to the master block, activates a second word-line of the second row block, and outputs a row block information signal, and a column decoder accessing a portion of first memory cells coupled to the first word-line or a portion of second memory cells coupled to the second word-line based on a column address, the row block information signal and a second fuse information.
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公开(公告)号:US11018001B2
公开(公告)日:2021-05-25
申请号:US16922330
申请日:2020-07-07
Applicant: Samsung Electronics Co., Ltd.
Inventor: Haeryong Kim , Hyeonjin Shin , Jaeho Lee , Sanghyun Jo
IPC: H01L21/02 , H01L29/66 , H01L29/786 , H01L29/778 , H01L29/24
Abstract: A method of growing a two-dimensional transition metal dichalcogenide (TMD) thin film and a method of manufacturing a device including the two-dimensional TMD thin film are provided. The method of growing the two-dimensional TMD thin film may include a precursor supply operation and an evacuation operation, which are periodically and repeatedly performed in a reaction chamber provided with a substrate for thin film growth. The precursor supply operation may include supplying two or more kinds of precursors of a TMD material to the reaction chamber. The evacuation operation may include evacuating the two or more kinds of precursors and by-products generated therefrom from the reaction chamber.
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公开(公告)号:US20210012849A1
公开(公告)日:2021-01-14
申请号:US16795730
申请日:2020-02-20
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kyungryun Kim , Yoonna Oh , Hohyun Shin , Jaeho Lee
Abstract: A semiconductor memory device comprises a memory cell array including segments disposed at corresponding intersections of row and column blocks, each row block including dynamic memory cells coupled to word-lines and bit-lines, a row decoder that activates a first word-line of a first row block in response to a row address, determines whether the first row block is a master block based on a first fuse information and a second row block is mapped as a slave to the master block, activates a second word-line of the second row block, and outputs a row block information signal, and a column decoder accessing a portion of first memory cells coupled to the first word-line or a portion of second memory cells coupled to the second word-line based on a column address, the row block information signal and a second fuse information.
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公开(公告)号:US10727182B2
公开(公告)日:2020-07-28
申请号:US16257189
申请日:2019-01-25
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hyunjae Song , Seunggeol Nam , Yeonchoo Cho , Seongjun Park , Hyeonjin Shin , Jaeho Lee
IPC: H01L23/48 , H01L23/532 , H01L21/768 , H01L23/522
Abstract: Example embodiments relate to a layer structure having a diffusion barrier layer, and a method of manufacturing the same. The layer structure includes first and second material layers and a diffusion barrier layer therebetween. The diffusion barrier layer includes a nanocrystalline graphene (nc-G) layer. In the layer structure, the diffusion barrier layer may further include a non-graphene metal compound layer or a graphene layer together with the nc-G layer. One of the first and second material layers is an insulating layer, a metal layer, or a semiconductor layer, and the remaining layer may be a metal layer.
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公开(公告)号:US10269975B2
公开(公告)日:2019-04-23
申请号:US15054871
申请日:2016-02-26
Applicant: Samsung Electronics Co., Ltd.
Inventor: Seongjun Park , Jaeho Lee , Changho Ra , Wonjong Yoo , Faisal Ahmed , Zheng Yang , Xiaochi Liu
IPC: H01L29/18 , H01L29/786 , H01L29/24 , H01L21/467 , H01L29/66 , H01L29/04 , H01L29/06 , H01L29/16 , H01L29/778
Abstract: An electronic device includes a 2D material layer having a bandgap. The 2D material layer includes two multilayer 2D material regions and a channel region therebetween. A first electrode electrically contacts one of the multilayer 2D material regions, and a second electrode electrically contacts the other of the multilayer 2D material regions.
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