摘要:
Lands and Cu wirings are formed on surfaces of a glass epoxy substrate, and a solder mask is formed on the lands and the Cu wirings to form a chip-mounting substrate. A bottom surface of the chip-mounting substrate is made rough, and a semiconductor chip is mounted on a top surface of the chip-mounting substrate. Through holes communicating with the Cu wirings are formed on the solder mask to expose the Cu wirings. Solder balls are formed on the Cu wrings by thermal compression welding. Underfill material is injected into a clearance formed between the chip mounting substrate and a printed circuit board. Since the surface of the chip-mounting substrate is made rough, an area of a contact surface between the chip-mounting substrate and underfill material increases, hence an adhesive strength between the chip-mounting substrate and the printed circuit board is heightened.
摘要:
A terminal fitting (T) has a tube (10) formed by at least one plate (12). A locking hole (19) is formed in the plate (12) and is engageable by a lock (52) of a connector housing (50). The plate (12) is deformed into the tube (10) adjacent the locking hole (19) to form a retaining portion (22) that enlarges an area of engagement with the lock (52) for holding the terminal fitting (T) more securely in the connector housing (50).
摘要:
A front wall (50) is movable between a full locking position and a partial locking position on the front of a female housing (10). When the front wall (50) is at the full locking position, mating tabs (70) can enter main portions (41) of the female terminal fittings (40) through tab insertion holes (51) of the front wall (50) for contacting resilient contacts (45) and an unlocking jig can be inserted into a mold-removal hole (14) of the female housing (10) through a jig insertion hole (52) of the front wall (50) to disengage a lock (12). When the front wall (50) is at the partial locking position, detection probes (60) can be inserted into the jig insertion holes (52) of the front wall (50) for contacting detecting plates (46) offset from resilient contacts (45) in main portions of the female terminal fittings (40).
摘要:
A terminal fitting (T) has a rectangular tube (10) with a side plate (13R) and a receiving plate (35) that extends inwardly in a width direction from the front edge of the side plate (13R). A probe (P) can be brought into contact with this receiving plate (35). Thus, a contact area of the probe (P) along the width direction is wider than the thickness of the right side plate (13R). Thus, the probe (P) can be brought securely into contact with the rectangular tube (10) even if displaced along the width direction.
摘要:
A plug (20) has a base (22) in which a plurality of plug-side terminal fittings (50) are mounted and a lid portion (23) openably and closably mountable on the base (22). The base portion (22) includes a base-side shell (30) and a resin-made base-side housing (60) integrally formed with the base-side shell (30) by insert molding. Since the base-side housing (60) and the base-side shell (30) support each other while being held in close contact, a sufficient strength can be secured. Further, since it is not necessary to assemble the base-side housing (60) and the base-side shell (30), an assembling process can be simplified.
摘要:
A propylene-ethylene block copolymer composition having sufficient stiffness and mechanical strength required for the automobile exterior arts can be produced at low cost since no additional steps for blending other rubber components are required. The composition contains methylenebis(2,4-di-t-butylphenol) acid sodium phosphate which is blended with the propylene-ethylene block copolymer in an amount of 300 to 2,000 ppm and has (a) a melt flow rate of 10 to 18 g/10 min when measured at 230° C. under a load of 2.16 kg (21.2N); (b) an ordinary temperature xylene insoluble having a stereoregularity index fraction of 98.9% or higher when measured by 13C-NMR; and (c) an ordinary temperature xylene soluble having a content of 22 to 28% by weight has a single component with respect to a relaxation time T1 measured by pulse NMR and satisfies the following formula (I): y≦0.0014x3−0.0897x2−1.0593x+231.6 (I) where x is an ethylene content (% by weight) measured by 13C-NMR and y is the relaxation time T1 (msec) measured by pulse NMR.
摘要:
A connector has a plug-side housing and a plurality of concave core holding grooves into which cores of shielded electric wires of a flat cable are inserted individually. The core holding grooves are deeper than the outer diameter of each core. The cores are inserted into the core wire-holding grooves. Thus even if the plug-side housing deforms, the cores remain accommodated in the core holding grooves. The housing also has a retainer-mounting opening into which a retainer can be mounted. The retainer retains each core by sandwiching the core between the retainer and the housing.
摘要:
A lever-installed cover (50) is inserted into a lever accommodation space (404) disposed between a wall (41) of a female housing (21) and an accommodation wall (42). A reinforcing wall (43) connects a front end of the wall (41) and that of the accommodation wall (42) to each other. An opening (45) through which a follower pin (17) of a male connector (10) can pass is formed on the reinforcing wall (43). The opening (45) matches an entrance of a cam groove (74) of the lever (70) when the lever (70) is located at an initial position. Both connectors (10) and (20) are fitted on each other and removed from each other by rotating the lever (70), with the cam groove (74) of the lever (70) engaging the follower pin (17). The lever (70) can be rotated back to the initial position to separate the connectors (10) and (20) from each other. The follower pin (17) slides on the guide portion (81) formed at the rear edge of the open portion (45). Thus, the follower pin (17) can be guided smoothly to the open portion (45).
摘要:
Disclosed is an austenite stainless steel comprising: no more than 0.05% by weight of C; no more than 0.25% by weight of Si; no more than 0.40% by weight of Mn; no more than 0.040% by weight of P; no more than 0.003% by weight of S; 30.0 to 40.0% by weight of Ni; 20.0 to 26.0% by weight of Cr; 5.0 to 8.0% by weight of Mo; no more than 0.1% by weight of Al; 0.001 to 0.010% by weight of B; 0.15 to 0.30% by weight of N; and balance of Fe and inevitable impurity. The austenite stainless steel satisfying formula (1) and (2) mentioned below (wherein "Cr", "Mo", "N", "Si" and "Mn" mean content of each element).Cr+3.3Mo+20N.gtoreq.51 (1)5Si+Mn
摘要:
Herein disclosed is a semiconductor integrated circuit device comprising a SRAM having its memory cell composed of transfer MISFETs to be controlled through word lines and drive MISFETs. The gate electrodes of the drive MISFETs and the gate electrodes of the transfer MISFETs of the memory cell, and the word lines are individually formed of different conductive layers. The drive MISFETs and the transfer MISFETs are individually arranged to cross each other in the gate length direction. The word lines are extended in the gate length direction of the gate electrodes of the drive MISFETs and caused to cross the gate electrodes of the drive MISFETs partially. The two transfer MISFETs of the memory cell have their individual gate electrodes connected with two respective word lines spaced from each other and extended in an identical direction. The region defined by the two word lines is arranged therein with the two drive MISFETs and the source lines.The source line is formed of a conductive layer identical to that of the word line. The individual data lines of the complementary data line are formed of an identical conductive layer which is different from that of the word line and the source line. The identical conductive layer between the word line and source line and the complementary data line is formed with two word lines: a main word line extended in the first direction identical to that of the word line and source line and used by adopting the divided word line system: and a sub-word line used by adopting the double word line system.