摘要:
A substrate achieving suppressed deterioration of processing accuracy of a semiconductor device due to bending of the substrate, a substrate with a thin film and a semiconductor device formed with the substrate above, and a method of manufacturing the semiconductor device above are obtained. A substrate according to the present invention has a main surface having a diameter of 2 inches or greater, a value for bow at the main surface being not smaller than −40 μm and not greater than −5 μm, and a value for warp at the main surface being not smaller than 5 μm and not greater than 40 μm. Preferably, a value for surface roughness Ra of the main surface of the substrate is not greater than 1 nm and a value for surface roughness Ra of a main surface is not greater than 100 nm.
摘要:
A silicon carbide substrate is made of silicon carbide. In the silicon carbide substrate, a normal line of one main surface of the silicon carbide substrate and a normal line of a {03-38} plane form an angle of 0.5° or smaller in an orthogonal projection to a plane including a direction and a direction. In this way, there can be provided the silicon carbide substrate allowing for both improvement of channel mobility of a semiconductor device and stable characteristics thereof.
摘要:
An IGBT, which is capable of reducing on resistance by reducing channel mobility, includes: an n type substrate made of SiC and having a main surface with an off angle of not less than 50° and not more than 65° relative to a plane orientation of {0001}; a p type reverse breakdown voltage holding layer made of SiC and formed on the main surface of the substrate; an n type well region formed to include a second main surface of the reverse breakdown voltage holding layer; an emitter region formed in the well region to include the second main surface and including a p type impurity at a concentration higher than that of the reverse breakdown voltage holding layer; a gate oxide film formed on the reverse breakdown voltage holding layer; and a gate electrode formed on the gate oxide film. In a region including an interface between the well region and the gate oxide film, a high-concentration nitrogen region is formed to have a nitrogen concentration higher than those of the well region and the gate oxide film.
摘要:
A MOSFET includes a silicon carbide (SiC) substrate having a main surface having an off angle of not less than 50° and not more than 65° relative to a {0001} plane; a semiconductor layer formed on the main surface of the SiC substrate; and an insulating film formed in contact with a surface of the semiconductor layer. When the insulating film has a thickness of not less than 30 nm and not more than 46 nm, the threshold voltage thereof is not more than 2.3V. When the insulating film has a thickness of more than 46 nm and not more than 100 nm, the threshold voltage thereof is more than 2.3 V and not more than 4.9 V.
摘要:
A silicon carbide semiconductor device having an active layer with reduced defect density which is formed on a substrate made of silicon carbide, and a method of manufacturing the same are provided. A semiconductor device includes a substrate made of silicon carbide and having an off angle of not less than 50° and not more than 65° with respect to a plane orientation; a buffer layer, and an epitaxial layer, a p-type layer and an n+ region each serving as an active layer. The buffer layer is made of silicon carbide and formed on the substrate. The active layer is made of silicon carbide and formed on the buffer layer. The micropipe density is lower in the active layer than in the substrate. The density of dislocations in which the direction of a Burgers vector corresponds to is higher in the active layer than in the substrate.On the film forming conditions in the step of forming the buffer layer, the composition and the flow rate of the material gas is determined such that the value of the C/Si ratio representing a ratio of carbon atoms to silicon atoms in the material gas used for forming the buffer layer is smaller than the value of the C/Si ratio in the step of forming the active layer.
摘要:
A JFET is a semiconductor device allowing more reliable implementation of the characteristics essentially achievable by employing SiC as a material and includes a wafer having at least an upper surface made of silicon carbide, and a gate contact electrode formed on the upper surface. The wafer includes a first p-type region serving as an ion implantation region formed so as to include the upper surface. The first p-type region includes a base region disposed so as to include the upper surface, and a protruding region. The base region has a width (w1) in the direction along the upper surface greater than a width (w2) of the protruding region. The gate contact electrode is disposed in contact with the first p-type region such that the gate contact electrode is entirely located on the first p-type region as seen in plan view.
摘要:
An information distribution system which can distribute information efficiently. The information distribution apparatus (300) identifies an intermediary (200) for distributing information to the terminal (100) of the party to whom the information is to be distributed. Subsequently, a request to distribute information to the terminal (100) of the party to whom the information is to be distributed is submitted to the terminal (200) of the identified intermediary. Therein, the information distribution apparatus (300) selects a party who has a relationship with the party to whom the information is to be distributed as the intermediary (200).An information distribution system capable of performing an efficient information distribution is provided.
摘要:
A vertical JFET 1a according to the present invention has an n+ type drain semiconductor portion 2, an n-type drift semiconductor portion 3, a p+ type gate semiconductor portion 4, an n-type channel semiconductor portion 5, an n+ type source semiconductor portion 7, and a p+ type gate semiconductor portion 8. The n-type drift semiconductor portion 3 is placed on a principal surface of the n+ type drain semiconductor portion 2 and has first to fourth regions 3a to 3d extending in a direction intersecting with the principal surface. The p+ type gate semiconductor portion 4 is placed on the first to third regions 3a to 3c of the n-type drift semiconductor portion 3. The n-type channel semiconductor portion 5 is placed along the p+ type gate semiconductor portion 4 and is electrically connected to the fourth region 3d of the n-type drift semiconductor portion 3.
摘要:
The present invention provides a communication system, a control apparatus, a program and a recording medium that controls participation in a session using presence information on participation member and information of the session itself. A communication system in which a plurality of communication terminals are connected to each other through a network to establish communication between the communication terminals has a presence information registering section that registers presence information of the communication terminals, a participation condition setting section that sets a participation condition for participating in the communication, a communication information managing section that manages communication information related to a state of the communication, and a communication control section that controls participation in and separation from the communication of the communication terminals.
摘要:
A substrate has a surface made of a semiconductor having a hexagonal single-crystal structure of polytype 4H. The surface of the substrate is constructed by alternately providing a first plane having a plane orientation of (0-33-8), and a second plane connected to the first plane and having a plane orientation different from the plane orientation of the first plane. A gate insulating film is provided on the surface of the substrate. A gate electrode is provided on the gate insulating film.