公开(公告)号：US20120056202A1

公开(公告)日：2012-03-08

申请号：US13320247

申请日：2010-04-27

申请人： Keiji Wada ,  Shin Harada ,  Takeyoshi Masuda ,  Misako Honaga ,  Makoto Sasaki ,  Taro Nishiguchi ,  Yasuo Namikawa ,  Shinsuke Fujiwara

发明人： Keiji Wada ,  Shin Harada ,  Takeyoshi Masuda ,  Misako Honaga ,  Makoto Sasaki ,  Taro Nishiguchi ,  Yasuo Namikawa ,  Shinsuke Fujiwara

IPC分类号： H01L29/24

CPC分类号： H01L29/7802 ,  C30B23/00 ,  C30B29/36 ,  C30B33/06 ,  H01L21/02378 ,  H01L21/02529 ,  H01L21/2007 ,  H01L29/045 ,  H01L29/0878 ,  H01L29/1608 ,  H01L29/66068 ,  H01L29/7395

摘要： A MOSFET, which is a semiconductor device allowing for reduced on-resistance while restraining stacking faults from being produced due to heat treatment in a device manufacturing process, includes: a silicon carbide substrate; an active layer made of single-crystal silicon carbide and disposed on one main surface of the silicon carbide substrate; a source contact electrode disposed on the active layer; and a drain electrode formed on the other main surface of the silicon carbide substrate. The silicon carbide substrate includes: a base layer made of silicon carbide; and a SiC layer made of single-crystal silicon carbide and disposed on the base layer. Further, the base layer has an impurity concentration greater than 2×1019 cm−3, and the SiC layer has an impurity concentration greater than 5×1018 cm−3 and smaller than 2×1019 cm−3.

摘要翻译： 一种MOSFET，其是在器件制造工艺中由于热处理而允许抑制堆垛层错而产生降低的导通电阻的半导体器件，包括：碳化硅衬底; 由单晶碳化硅构成的有源层，设置在碳化硅基板的一个主面上; 设置在有源层上的源极接触电极; 以及形成在碳化硅衬底的另一个主表面上的漏电极。 碳化硅基板包括：由碳化硅制成的基层; 以及由单晶碳化硅制成并设置在基底层上的SiC层。 此外，基底层的杂质浓度大于2×1019cm-3，并且SiC层的杂质浓度大于5×1018cm-3且小于2×1019cm-3。

公开(公告)号：US20110175110A1

公开(公告)日：2011-07-21

申请号：US13120890

申请日：2010-03-23

申请人： Keiji Wada ,  Shin Harada ,  Takeyoshi Masuda ,  Misako Honaga

发明人： Keiji Wada ,  Shin Harada ,  Takeyoshi Masuda ,  Misako Honaga

IPC分类号： H01L29/24 ,  H01L21/336 ,  B82Y99/00 ,  B82Y40/00

CPC分类号： H01L29/045 ,  H01L29/1608 ,  H01L29/66068 ,  H01L29/78

摘要： A MOSFET includes a silicon carbide (SiC) substrate having a main surface having an off angle of not less than 50° and not more than 65° relative to a {0001} plane; a semiconductor layer formed on the main surface of the SiC substrate; and an insulating film formed in contact with a surface of the semiconductor layer. When the insulating film has a thickness of not less than 30 nm and not more than 46 nm, the threshold voltage thereof is not more than 2.3V. When the insulating film has a thickness of more than 46 nm and not more than 100 nm, the threshold voltage thereof is more than 2.3 V and not more than 4.9 V.

摘要翻译： MOSFET包括碳化硅（SiC）基板，其具有相对于{0001}面具有不小于50°且不大于65°的偏离角的主表面; 形成在所述SiC衬底的主表面上的半导体层; 以及与半导体层的表面接触形成的绝缘膜。 当绝缘膜的厚度不小于30nm且不大于46nm时，其阈值电压不大于2.3V。 当绝缘膜的厚度大于46nm且不大于100nm时，其阈值电压大于2.3V且不大于4.9V。

公开(公告)号：US20120228640A1

公开(公告)日：2012-09-13

申请号：US13512456

申请日：2011-07-14

申请人： Takeyoshi Masuda ,  Shin Harada ,  Misako Honaga ,  Keiji Wada ,  Toru Hiyoshi

发明人： Takeyoshi Masuda ,  Shin Harada ,  Misako Honaga ,  Keiji Wada ,  Toru Hiyoshi

IPC分类号： H01L29/24 ,  H01L21/04

CPC分类号： H01L29/66068 ,  H01L21/046 ,  H01L21/0475 ,  H01L21/3065 ,  H01L29/045 ,  H01L29/0615 ,  H01L29/0619 ,  H01L29/0623 ,  H01L29/0657 ,  H01L29/0661 ,  H01L29/0696 ,  H01L29/1608 ,  H01L29/4236 ,  H01L29/6606 ,  H01L29/7397 ,  H01L29/7813 ,  H01L29/8613 ,  H01L29/868

摘要： There are provided a high-quality semiconductor device having stable characteristics and a method for manufacturing such a semiconductor device. The semiconductor device includes: a substrate having a main surface; and a silicon carbide layer formed on the main surface of the substrate and including a side surface inclined relative to the main surface. The side surface substantially includes a {03-3-8} plane. The side surface includes a channel region.

摘要翻译： 提供了具有稳定特性的高质量半导体器件和制造这种半导体器件的方法。 半导体器件包括：具有主表面的衬底; 以及形成在所述基板的主表面上并且包括相对于所述主表面倾斜的侧表面的碳化硅层。 侧表面基本上包括{03-3-8}平面。 侧面包括通道区域。

公开(公告)号：US08513673B2

公开(公告)日：2013-08-20

申请号：US13120890

申请日：2010-03-23

申请人： Keiji Wada ,  Shin Harada ,  Takeyoshi Masuda ,  Misako Honaga

发明人： Keiji Wada ,  Shin Harada ,  Takeyoshi Masuda ,  Misako Honaga

IPC分类号： H01L29/15 ,  H01L31/0312

CPC分类号： H01L29/045 ,  H01L29/1608 ,  H01L29/66068 ,  H01L29/78

摘要： A MOSFET includes a silicon carbide (SiC) substrate having a main surface having an off angle of not less than 50° and not more than 65° relative to a {0001} plane; a semiconductor layer formed on the main surface of the SiC substrate; and an insulating film formed in contact with a surface of the semiconductor layer. When the insulating film has a thickness of not less than 30 nm and not more than 46 nm, the threshold voltage thereof is not more than 2.3V. When the insulating film has a thickness of more than 46 nm and not more than 100 nm, the threshold voltage thereof is more than 2.3 V and not more than 4.9 V.

摘要翻译： MOSFET包括碳化硅（SiC）基板，其具有相对于{0001}面具有不小于50°且不大于65°的偏离角的主表面; 形成在所述SiC衬底的主表面上的半导体层; 以及与半导体层的表面接触形成的绝缘膜。 当绝缘膜的厚度不小于30nm且不大于46nm时，其阈值电压不大于2.3V。 当绝缘膜的厚度大于46nm且不大于100nm时，其阈值电压大于2.3V且不大于4.9V。

公开(公告)号：US20110169016A1

公开(公告)日：2011-07-14

申请号：US13063298

申请日：2010-03-23

申请人： Keiji Wada ,  Shin Harada ,  Takeyoshi Masuda ,  Misako Honaga

发明人： Keiji Wada ,  Shin Harada ,  Takeyoshi Masuda ,  Misako Honaga

IPC分类号： H01L29/78 ,  H01L29/161 ,  H01L21/316

CPC分类号： H01L29/7802 ,  H01L29/045 ,  H01L29/0878 ,  H01L29/1095 ,  H01L29/1608 ,  H01L29/6606 ,  H01L29/66068 ,  H01L29/78 ,  H01L29/94

摘要： A MOSFET includes: a silicon carbide (SiC) substrate having a main surface having an off angle of not less than 50° and not more than 65° relative to a {0001} plane; a semiconductor layer formed on the main surface of the SiC substrate; and an insulating film formed in contact with a surface of the semiconductor layer. The MOSFET has a sub-threshold slope of not more than 0.4 V/Decade.

摘要翻译： MOSFET包括：碳化硅（SiC）基板，其具有相对于{0001}面具有不小于50°且不大于65°的偏离角的主表面; 形成在所述SiC衬底的主表面上的半导体层; 以及与半导体层的表面接触形成的绝缘膜。 MOSFET的子阈值斜率不超过0.4 V /十年。

公开(公告)号：US08536583B2

公开(公告)日：2013-09-17

申请号：US13063298

申请日：2010-03-23

申请人： Keiji Wada ,  Shin Harada ,  Takeyoshi Masuda ,  Misako Honaga

发明人： Keiji Wada ,  Shin Harada ,  Takeyoshi Masuda ,  Misako Honaga

IPC分类号： H01L29/15 ,  H01L31/0312

CPC分类号： H01L29/7802 ,  H01L29/045 ,  H01L29/0878 ,  H01L29/1095 ,  H01L29/1608 ,  H01L29/6606 ,  H01L29/66068 ,  H01L29/78 ,  H01L29/94

摘要： A MOSFET includes: a silicon carbide (SiC) substrate having a main surface having an off angle of not less than 50° and not more than 65° relative to a {0001} plane; a semiconductor layer formed on the main surface of the SiC substrate; and an insulating film formed in contact with a surface of the semiconductor layer. The MOSFET has a sub-threshold slope of not more than 0.4 V/Decade.

摘要翻译： MOSFET包括：碳化硅（SiC）基板，其具有相对于{0001}面具有不小于50°且不大于65°的偏离角的主表面; 形成在所述SiC衬底的主表面上的半导体层; 以及与半导体层的表面接触形成的绝缘膜。 MOSFET的子阈值斜率不超过0.4 V /十年。

公开(公告)号：US20120056201A1

公开(公告)日：2012-03-08

申请号：US13320243

申请日：2010-04-27

申请人： Keiji Wada ,  Shin Harada ,  Takeyoshi Masuda ,  Misako Honaga ,  Taro Nishiguchi ,  Makoto Sasaki ,  Shinsuke Fujiwara ,  Yasuo Namikawa

发明人： Keiji Wada ,  Shin Harada ,  Takeyoshi Masuda ,  Misako Honaga ,  Taro Nishiguchi ,  Makoto Sasaki ,  Shinsuke Fujiwara ,  Yasuo Namikawa

IPC分类号： H01L29/739

CPC分类号： H01L29/7802 ,  C30B23/00 ,  C30B29/36 ,  C30B33/06 ,  H01L21/02378 ,  H01L21/02529 ,  H01L21/2007 ,  H01L29/045 ,  H01L29/0878 ,  H01L29/1608 ,  H01L29/66068 ,  H01L29/7395

摘要： An IGBT, which is a vertical type IGBT allowing for reduced on-resistance while restraining defects from being produced, includes: a silicon carbide substrate, a drift layer, a well region, an n+ region, an emitter contact electrode, a gate oxide film, a gate electrode, and a collector electrode. The silicon carbide substrate includes: a base layer made of silicon carbide and having p type conductivity; and a SiC layer made of single-crystal silicon carbide and disposed on the base layer. The base layer has a p type impurity concentration exceeding 1×1018 cm−3.

摘要翻译： IGBT是一种允许在抑制缺陷产生的同时降低导通电阻的垂直型IGBT，包括：碳化硅衬底，漂移层，阱区，n +区，发射极接触电极，栅极氧化膜 ，栅电极和集电极。 碳化硅基板包括：由碳化硅制成并具有p型导电性的基底层; 以及由单晶碳化硅制成并设置在基底层上的SiC层。 基极层的p型杂质浓度超过1×1018cm-3。

公开(公告)号：US20120171850A1

公开(公告)日：2012-07-05

申请号：US13394770

申请日：2010-08-24

申请人： Misako Honaga ,  Takeyoshi Masuda ,  Shin Harada

发明人： Misako Honaga ,  Takeyoshi Masuda ,  Shin Harada

IPC分类号： H01L21/311

CPC分类号： H01L29/7802 ,  H01L23/544 ,  H01L29/1608 ,  H01L29/66068 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of manufacturing a semiconductor device includes the steps of forming a semiconductor layer made of SiC on an SiC substrate, forming a film on the semiconductor layer, and forming a groove in the film. The semiconductor device including a chip having an interlayer insulating film includes a groove formed in the interlayer insulating film to cross the chip.

摘要翻译： 一种制造半导体器件的方法包括以下步骤：在SiC衬底上形成由SiC制成的半导体层，在半导体层上形成膜，并在膜中形成沟槽。 包括具有层间绝缘膜的芯片的半导体器件包括形成在层间绝缘膜中以跨越芯片的沟槽。

公开(公告)号：US20120326166A1

公开(公告)日：2012-12-27

申请号：US13529602

申请日：2012-06-21

申请人： Takeyoshi Masuda ,  Shin Harada ,  Keiji Wada ,  Toru Hiyoshi

发明人： Takeyoshi Masuda ,  Shin Harada ,  Keiji Wada ,  Toru Hiyoshi

IPC分类号： H01L29/24 ,  H01L21/336 ,  H01L29/78

CPC分类号： H01L29/7802 ,  H01L21/049 ,  H01L21/3065 ,  H01L29/045 ,  H01L29/0623 ,  H01L29/0696 ,  H01L29/1608 ,  H01L29/66068 ,  H01L29/7395 ,  H01L29/7397 ,  H01L29/7813

摘要： A substrate has a surface made of a semiconductor having a hexagonal single-crystal structure of polytype 4H. The surface of the substrate is constructed by alternately providing a first plane having a plane orientation of (0-33-8), and a second plane connected to the first plane and having a plane orientation different from the plane orientation of the first plane. A gate insulating film is provided on the surface of the substrate. A gate electrode is provided on the gate insulating film.

摘要翻译： 衬底具有由具有多晶型4H的六方晶单晶结构的半导体制成的表面。 基板的表面通过交替地提供具有（0-33-8）的平面取向的第一平面和连接到第一平面并具有不同于第一平面的平面取向的平面取向的第二平面来构造。 栅极绝缘膜设置在基板的表面上。 在栅极绝缘膜上设置栅电极。

公开(公告)号：US20110186862A1

公开(公告)日：2011-08-04

申请号：US13063083

申请日：2009-02-03

申请人： Shin Harada ,  Takeyoshi Masuda ,  Keiji Wada ,  Masato Tsumori

发明人： Shin Harada ,  Takeyoshi Masuda ,  Keiji Wada ,  Masato Tsumori

IPC分类号： H01L29/24 ,  H01L21/20 ,  B82Y99/00 ,  B82Y40/00

CPC分类号： H01L29/1608 ,  H01L21/02378 ,  H01L21/02433 ,  H01L21/02447 ,  H01L21/02529 ,  H01L21/3003 ,  H01L21/324 ,  H01L29/045 ,  H01L29/0878 ,  H01L29/36 ,  H01L29/6606 ,  H01L29/66068 ,  H01L29/7802 ,  H01L29/94

摘要： There is provided a silicon carbide semiconductor device having excellent electrical characteristics such as channel mobility, and a method for manufacturing the same. A semiconductor device includes a substrate made of silicon carbide and having an off-angle of greater than or equal to 50° and less than or equal to 65° with respect to a surface orientation of {0001}, a p-type layer serving as a semiconductor layer, and an oxide film serving as an insulating film. The p-type layer is formed on the substrate and is made of silicon carbide. The oxide film is formed to contact with a surface of the p-type layer. A maximum value of the concentration of nitrogen atoms in a region within 10 nm of an interface between the semiconductor layer and the insulating film (interface between a channel region and the oxide film) is greater than or equal to 1×1021 cm−3.

摘要翻译： 提供了具有优异的电特性如沟道迁移率的碳化硅半导体器件及其制造方法。 半导体器件包括相对于{0001}的表面取向具有大于或等于50°且小于或等于65°的偏角度的碳化硅制成的衬底，用作 半导体层和用作绝缘膜的氧化膜。 p型层形成在基板上，由碳化硅制成。 氧化膜形成为与p型层的表面接触。 半导体层与绝缘膜（沟道区域和氧化物膜之间的界面）的界面的10nm以内的区域的氮原子的浓度的最大值为1×1021cm-3以上。