摘要:
A semiconductor device suitable for applications in an electrostatic discharge (ESD) protection circuit, including a semiconductor substrate, a first well formed in the substrate, a second well formed in the substrate, and a first doped region formed in the second well, wherein the first well, the second well, and the first doped region collectively form a parasitic bipolar junction transistor (BJT), and wherein the first well is the collector of the BJT, the second well is the base of the BJT, and the first doped region is the emitter of the BJT.
摘要:
An integrated circuit device for converting an incident optical signal into an electrical signal comprises a semiconductor substrate, a well region formed inside the semiconductor substrate, a dielectric layer formed over the well region, and a layer of polysilicon for receiving the incident optical signal, formed over the dielectric layer, including a p-type portion, an n-type portion and an undoped portion disposed between the p-type and n-type portions, wherein the well region is biased to control the layer of polysilicon for providing the electrical signal.
摘要:
An ESD protection circuit with impedance matching for radio frequency integrated circuits is provided. Nodes at the ends of a transmission line, respectively have at least one ESD component coupled between each and one of the power rails. The ESD components discharge ESD currents and the transmission lines provide RF matching.
摘要:
An ESD protection device with thicker polysilicon film, an electronic apparatus having the same, and a method for manufacturing the same are provided. The ESD protection device can be a diode or a MOS transistor with a thicker polysilicon film employed in an ESD protection circuit to protect an electronic apparatus. The electronic apparatus includes a substrate having a device area and an ESD protection circuit area. A first polysilicon film of a first thickness is formed on the device area of the substrate, so as to form an electronic device. A second polysilicon film of a second thickness is formed on the ESD protection circuit area, so as to form an ESD protection device. The second thickness, which is preferably about in the range of 100 to 500 nanometers, is thicker than the first thickness.
摘要:
An ESD protection circuit with tunable gate-bias coupled between a first and second pads for receiving power supply voltages. The ESD protection circuit includes a diode, a resistor coupled between the cathode of the diode and the first pad, a capacitor coupled between the cathode of the diode and the second pad, a first transistor of a first conductivity type having a gate coupled to the cathode of the diode, a drain coupled to the anode of the diode and a source coupled to the second pad, a second transistor of a second conductivity type having a gate coupled to the cathode of the diode, a drain coupled to the anode of the diode and a source coupled to the first pad, and a third transistor of the first conductivity type having a gate coupled to the anode of the diode, a drain coupled to the first pad and a source coupled to the second pad.
摘要:
An output buffer circuit with low-voltage devices to driver high-voltage signals for PCI-X applications is proposed. Because power supply voltage of PCI-X is at 3.3V, the high-voltage gate-oxide stress is a serious problem to design PCI-X I/O circuit in a 0.13 μm 1V/2.5V CMOS process with only low-voltage gate oxide. This proposed output buffer circuit can be operated at 133 MHz in 3.3V PCI-X environment without causing high-voltage gate-oxide reliability problem. In this design, the circuit is implemented in a 0.13 μm 1V/2.5V CMOS process and the output signal swing can be 3.3V. Besides, a level converter that converts 0V˜1V voltage swing to 1V˜3.3V voltage swing is also presented.
摘要:
A thin-film transistor (TFT) with body contacts is disclosed. It is used in polysilicon TFT LCD's. A body contact region for separating the gate electrode, a source region, and a drain region is made in the TFT. Through the dopants in the body contact region and different impurities in the source region and the drain region, a body-trigger bias is imposed on the body of the TFT. This method reduces the threshold voltage of the TFT driving circuit, thereby increasing the driving current.
摘要:
Diode strings and electrostatic discharge circuits characterized by low current leakage. Each diode region provides a diode and has first and second regions. The first region is of a first conductive type and formed on a substrate, acting as a first electrode of a diode. The second region is of a second conductive type opposite to the first conductive type, formed in the first region and acting as a second electrode of a corresponding diode. The diodes are forward connected in series to form major anode and cathode of the diode string. An isolation region is of the second conductive type to isolate those diode regions. A bias resistor is connected between the isolation region and a first power line. During normal operation, the voltage of the first power line is not within the range between the voltages of the major anode and cathode.
摘要:
A method of manufacturing a semiconductor device having a first and second transistor of an ESD protection and internal circuit respectively. The method includes the steps of providing a substrate, forming gates of the first and second transistor on the substrate, depositing a mask layer and patterning the mask layer using one single mask to remove the mask layer on the gates, a portion of a drain region of the first transistor, and a source and drain region of the second transistor, implementing ESD implantation under the regions without the patterned mask layer, removing the mask layer and forming sidewall spacers of the gates, and implementing drain diffusion.
摘要:
The present invention relates to an SCR (Silicon Controlled Rectifier) for the ESD (electrostatic discharge) protection comprising two terminal electrodes of a first electrode and a second electrode, a PMOS, an NMOS and an SCR structure. By utilizing an embedded SCR, a whole-chip ESD protection circuit design can be obtained. The present invention is suitable for IC products, and for applications by IC design industries and IC foundry industries.