Abstract:
Embodiments of the disclosed subject matter provide systems and methods of depositing a film on a selective area of a substrate. A first jet of a first material may be ejected from a first nozzle assembly of a jet head having a plurality of nozzle assemblies to form a first portion of a film deposition on the substrate. A second jet of a second material may be ejected from a second nozzle assembly of the plurality of nozzle assemblies, the second nozzle assembly being aligned with the first nozzle assembly parallel to a direction of motion between the plurality of nozzle assemblies and the substrate, and the second material being different than the first material. The second material may react with the first portion of the film deposition to form a composite film deposition on the substrate when using reactive gas precursors.
Abstract:
Embodiments of the disclosed subject matter provide a method of modifying the surface energy of a substrate is provided. A first hydrophobic material may be directly printed, using a vapor ejected from a first nozzle, onto a hydrophilic substrate to surround at least a first area of the substrate, where the first material has a vapor pressure of at least 1 Pa at 300° C. A second material may be deposited, from a second nozzle, onto the first area of the substrate.
Abstract:
Implementations of the disclosed subject matter provide a print bar for organic vapor jet (OVJP) deposition is provided that includes a plurality of n print head segments, where each of the plurality of print head segments may have an OVJP print head. The print bar may include a plurality of distance sensors, where each of the plurality of distance sensors may be configured to measure a distance between a substrate disposed below the print bar and a portion of at least one of the print head segments. The print bar may include a plurality of not more than n+1 actuators configured to adjust at least one of a position and an orientation of one or more of the plurality of print head segments based upon one or more distances between the substrate and the print bar measured by one or more of the plurality of distance sensors.
Abstract:
OVJP depositors and techniques for using the same are provided, in which the in-substrate plane velocity of the delivery and confinement flows are both nonzero and parallel to each other across the boundary between the two. These configurations provide improved material utilization efficiency and relaxed fly height tolerances, while achieving acceptable printing resolution and feature uniformity.
Abstract:
Devices and techniques that include use of a capacitive sensor to permit an OVJP print head to orient itself relative to conductive or dielectric traces on a printing substrate are disclosed. Such a sensor enables real-time measurement and closed-loop control of print head position with respect to substrate traces. This enables, for example, micron scale resolution in a dimension transverse to printing while permitting both the substrate and movement of the OVJP tool to scale to larger sizes than are achievable using conventional techniques and systems.
Abstract:
OVJP print bars are provided that include multiple print head segments, each of which includes a print head and which can be positioned relative to the substrate independently of each other print head segment. Accordingly, a more consistent head-to-substrate distance can be maintained even for substrates that are not uniformly planar.
Abstract:
Systems and techniques for depositing organic material on a substrate are provided, in which one or more shield gas flows prevents contamination of the substrate by the chamber ambient. Thus, multiple layers of the same or different materials may be deposited in a single deposition chamber, without the need for movement between different deposition chambers, and with reduced chance of cross-contamination between layers.
Abstract:
Plasma deposition systems and techniques are provided that use plasma generating units having one horizontal dimension at least three times as long as the other horizontal dimension. Plasma sources as disclosed herein thus have non-uniformly scaled dimensions in the x and y directions, to facilitate uniform deposition. Sources as disclosed herein may reduce heating of the substrate due to substrate cooling between plasma sources. They also may provide improved particle coverage when the film deposited is a barrier film due to plasma and gas flow divergence at the edges of the plasma source.
Abstract:
Embodiments of the disclosed subject matter provide a nozzle assembly and method of making the same, the nozzle assembly including a first aperture formed on a first aperture plate to eject a carrier gas flow having organic vapor onto a substrate in a deposition chamber, second apertures formed on a second aperture plate disposed adjacent to the first aperture to form a vacuum aperture, where the first aperture plate and the second aperture plate are separated by a first separator plate, third apertures formed on a third aperture plate to eject purge gas that are disposed adjacent to the second aperture plate, where the second aperture plate and the third aperture plate are separated by second separator plate, and a third separator plate is disposed adjacent to the one or more third aperture plates to form a gas channel in the one or more third aperture plates.
Abstract:
Embodiments of the disclosed subject matter provide a device including a nozzle, a source of material to be deposited on a substrate in fluid communication with the nozzle, a delivery gas source in fluid communication with the source of material to be deposited with the nozzle, an exhaust channel disposed adjacent to the nozzle, and a confinement gas source in fluid communication with the nozzle and the exhaust channel, and disposed adjacent to the exhaust channel.