公开(公告)号：US07965509B2

公开(公告)日：2011-06-21

申请号：US12418973

申请日：2009-04-06

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Maurice F. Holahan ,  Madhusudan K. Iyengar ,  Robert E. Simons ,  Rebecca N. Wagner

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Maurice F. Holahan ,  Madhusudan K. Iyengar ,  Robert E. Simons ,  Rebecca N. Wagner

IPC分类号： H05K7/20

CPC分类号： H01L23/473 ,  F28F9/0275 ,  H01L2924/0002 ,  H05K7/20772 ,  H05K7/20781 ,  H01L2924/00

摘要： A method and associated assembly for cooling electronic heat generating components of a computer including dual-in-line memory (DIMM) array(s) is provided. The assembly comprises a cooling component having a plate with a first and a second (reverse) side, thermally coupling to the heat generating components including the DIMM array(s). The first plate side has a coolant conduit connected at one end to a supply manifold via flexible tubing and at another end to a return manifold via another flexible tubing such that when coolant is supplied, the coolant circulates from the supply manifold to the return manifold by passing through said first plate's conduit.

摘要翻译： 提供了一种用于冷却包括双列直插存储器（DIMM）阵列的计算机的电子发热部件的方法和相关组件。 组件包括具有第一和第二（反向）侧的板的冷却部件，热耦合到包括DIMM阵列的发热部件。 第一板侧具有冷却剂导管，其一端通过柔性管连接到供应歧管，另一端通过另一柔性管连接到回流歧管，使得当供应冷却剂时，冷却剂通过供应歧管循环到回流歧管 穿过所述第一板的导管。

公开(公告)号：US07963119B2

公开(公告)日：2011-06-21

申请号：US11944680

申请日：2007-11-26

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： F25D23/12

CPC分类号： H05K7/2079 ,  G06F1/20 ,  G06F2200/201

摘要： A hybrid air and liquid coolant conditioning unit is provided for facilitating cooling of electronics rack(s) of a data center. The unit includes a first heat exchange assembly, including a liquid-to-liquid heat exchanger, a system coolant loop and a facility coolant loop, and a second heat exchange assembly, including an air-to-liquid heat exchanger, an air-moving device, and the facility coolant loop. The system coolant loop provides cooled system coolant to the electronics rack(s), and expels heat in the liquid-to-liquid heat exchanger from the electronics rack(s) to the facility coolant. The air-to-liquid heat exchanger extracts heat from the air of the data center and expels the heat to the facility coolant of the facility coolant loop. The facility coolant loop provides chilled facility coolant in parallel to the liquid-to-liquid heat exchanger and the air-to-liquid heat exchanger. In one implementation, the hybrid coolant conditioning unit includes a vapor-compression heat exchange assembly.

摘要翻译： 提供混合式空气和液体冷却剂调节单元以便于数据中心的电子机架的冷却。 该单元包括第一热交换组件，其包括液体 - 液体热交换器，系统冷却剂回路和设备冷却剂回路，以及第二热交换组件，其包括空气 - 液体热交换器，空气移动 设备和设备冷却液回路。 系统冷却剂回路将冷却的系统冷却剂提供给电子机架，并将液体 - 液体热交换器中的热量从电子机架排出到设备冷却剂。 空气 - 液体热交换器从数据中心的空气中提取热量，并将热量排出到设备冷却剂回路的设备冷却剂中。 设备冷却液回路提供与液体 - 液体热交换器和空气 - 液体热交换器并联的冷却设备冷却剂。 在一个实施方案中，混合冷却剂调节单元包括蒸汽压缩热交换组件。

公开(公告)号：US07948757B2

公开(公告)日：2011-05-24

申请号：US12850099

申请日：2010-08-04

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20 ,  F28F7/00 ,  H01B9/06 ,  F25D23/12 ,  B05B7/06

CPC分类号： H01L23/4735 ,  H01L23/427 ,  H01L2924/0002 ,  Y10S165/908 ,  Y10T29/49002 ,  H01L2924/00

摘要： A method of fabricating a multi-fluid cooling system is provided for removing heat from one or more electronic devices. The cooling system includes a multi-fluid manifold structure with at least one first fluid inlet orifice and at least one second fluid inlet orifice for concurrently, separately injecting a first fluid and a second fluid onto a surface to be cooled when the cooling system is employed to cool one or more electronic devices, wherein the first fluid and the second fluid are immiscible, and the first fluid has a lower boiling point temperature than the second fluid. When the cooling system is employed to cool one or more electronic devices and the first fluid boils, evolving first fluid vapor condenses in situ by direct contact with the second fluid of higher boiling point temperature.

摘要翻译： 提供了一种制造多流体冷却系统的方法，用于从一个或多个电子设备去除热量。 冷却系统包括具有至少一个第一流体入口孔口和至少一个第二流体入口孔口的多流体歧管结构，用于在采用冷却系统时同时单独地将第一流体和第二流体注入待冷却的表面上 以冷却一个或多个电子设备，其中所述第一流体和所述第二流体是不混溶的，并且所述第一流体具有比所述第二流体低的沸点温度。 当冷却系统用于冷却一个或多个电子装置和第一流体沸腾时，放出的第一流体蒸汽通过与较高沸点温度的第二流体直接接触而原位冷凝。

公开(公告)号：US07898076B2

公开(公告)日：2011-03-01

申请号：US11742161

申请日：2007-04-30

申请人： Bruce Furman ,  Madhusudan K. Iyengar ,  Paul A. Lauro ,  Yves Martin ,  Roger R. Schmidt ,  Da-Yuan Shih ,  Theodore G. Van Kessel ,  Wei Zou

发明人： Bruce Furman ,  Madhusudan K. Iyengar ,  Paul A. Lauro ,  Yves Martin ,  Roger R. Schmidt ,  Da-Yuan Shih ,  Theodore G. Van Kessel ,  Wei Zou

IPC分类号： H01L23/10

CPC分类号： H01L23/42 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2224/0401

摘要： Assemblies for dissipating heat from integrated circuits and circuit chips are disclosed. The assemblies include a low melt solder as a thermal interface material (TIM) for the transfer of heat from a chip to a heat sink (HS), wherein the low melt solder has a melting point below the maximum operating temperature of the chip. Methods for making the assemblies are also disclosed.

摘要翻译： 公开了用于从集成电路和电路芯片散热的组件。 组件包括作为用于将热从芯片传递到散热器（HS）的热界面材料（TIM）的低熔点焊料，其中低熔点焊料的熔点低于芯片的最大工作温度。 还公开了制造组件的方法。

公开(公告)号：US07878007B2

公开(公告)日：2011-02-01

申请号：US12031982

申请日：2008-02-15

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： F25B49/00 ,  G01K13/00

CPC分类号： F24F11/0001 ,  G06F1/20 ,  H05K7/20836

摘要： Monitoring method and system are provided for dynamically determining airflow rate through and heat removal rate of an air-conditioning unit, such as a computer room air-conditioning unit. The method includes: sensing inlet and outlet temperatures of fluid passing through a heat exchanger associated with the air-conditioning unit; sensing air temperature at an air inlet side of the heat exchanger; automatically determining at least one of airflow rate through or heat removal rate of the air-conditioning unit, the automatically determining employing the sensed inlet temperature and outlet temperature of fluid passing through the heat exchanger, and the sensed air temperature at the air inlet side of the heat exchanger; and outputting the determined airflow rate through or heat removal rate of the air-conditioning unit. In one embodiment, the heat exchanger is an auxiliary air-to-air heat exchanger, and in another embodiment, the heat exchanger is the air-to-liquid heat exchanger of the air-conditioner.

摘要翻译： 提供监测方法和系统，用于动态地确定诸如计算机室空调单元之类的空调单元的空气流量和排热率。 该方法包括：检测通过与空调单元相关联的热交换器的流体的入口和出口温度; 感测热交换器的空气入口侧的空气温度; 自动确定空气调节单元的气流速率或排热速率中的至少一个，使用感测到的通过热交换器的流体的入口温度和出口温度以及感测到的空气入口侧的空气温度的自动确定 热交换器; 并输出所确定的空气流量通过或所述空调单元的除热率。 在一个实施例中，热交换器是辅助空气 - 空气热交换器，在另一个实施例中，热交换器是空调器的空气 - 液体热交换器。

公开(公告)号：US20100118494A1

公开(公告)日：2010-05-13

申请号：US12269156

申请日：2008-11-12

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, JR. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, JR. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： H05K7/20

CPC分类号： H05K7/20772

摘要： A hybrid immersion cooling apparatus and method is provided for cooling of electronic components housed in a computing environment. The components are divided into primary and secondary heat generating components and are housed in a liquid sealed enclosure. The primary heat generating components are cooled by indirect liquid cooling provided by at least one cold plate having fins. The cold plate is coupled to a first coolant conduit that circulates a first coolant in the enclosure and supplies the cold plate. Immersion cooling is provided for secondary heat generating components through a second coolant that will be disposed inside the enclosure such as to partially submerge the cold plate and the first coolant conduit as well as the heat generating components.

摘要翻译： 提供一种用于冷却容纳在计算环境中的电子部件的混合浸没式冷却装置和方法。 这些部件分为一级和二级发热部件，并被容纳在液体密封的外壳中。 通过由具有翅片的至少一个冷板提供的间接液体冷却来冷却主要发热部件。 冷板联接到第一冷却剂导管，该第一冷却剂管使第一冷却剂循环在外壳中并供应冷板。 通过第二冷却剂为二次发热部件提供浸入式冷却，第二冷却剂将设置在外壳内部，以便部分地淹没冷板和第一冷却剂管道以及发热部件。

公开(公告)号：US07707880B2

公开(公告)日：2010-05-04

申请号：US12031976

申请日：2008-02-15

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： G01F1/68

CPC分类号： G01F1/68 ,  G01F1/34 ,  G01F25/0007 ,  H05K7/20836

摘要： Monitoring method and system are provided for dynamically determining rack airflow rate and rack power consumption employing a heat exchanger disposed at an air outlet side of the electronics rack. The method includes: sensing air temperature at the air outlet side of the electronics rack, sensing coolant temperature at a coolant inlet and coolant temperature at a coolant outlet of the heat exchanger, and determining airflow rate through the electronics rack; and outputting the determined airflow rate through the electronics rack. The determining employs the sensed air temperature at the air outlet side of the rack and the sensed coolant temperatures at the coolant inlet and outlet of the heat exchanger. In one embodiment, the heat exchanger is an air-to-air heat exchanger, and in another embodiment, the heat exchanger is an air-to-liquid heat exchanger.

摘要翻译： 提供监测方法和系统，用于使用布置在电子机架的空气出口侧的热交换器动态地确定机架气流速率和机架功率消耗。 该方法包括：感测电子机架的空气出口侧的空气温度，感测冷却剂入口处的冷却剂温度和在热交换器的冷却剂出口处的冷却剂温度，以及确定通过电子机架的气流速率; 并且通过电子机架输出确定的气流速率。 该确定采用在机架的空气出口侧处的感测到的空气温度和在热交换器的冷却剂入口和出口处感测到的冷却剂温度。 在一个实施例中，热交换器是空气 - 空气热交换器，在另一个实施例中，热交换器是空气 - 液体热交换器。

公开(公告)号：US07665325B2

公开(公告)日：2010-02-23

申请号：US11530992

申请日：2006-09-12

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： F25D11/00 ,  F25B45/00 ,  H05K7/20

CPC分类号： F25B23/00 ,  F25B9/006 ,  H05K7/20281

摘要： A multi-fluid cooling system and method for cooling an electronic device are provided which employ freeze protection when in a shipping state. The cooling system includes a coolant loop having an expansion tank containing first and second fluids, which are immiscible and of different densities, and the second fluid freezes at a lower temperature than the first. The coolant loop further includes a first valve for facilitating coupling of the first fluid into the coolant loop and a second valve for facilitating coupling of the second fluid into the coolant loop, the first and second valves being independently controllable. Control logic electronically controls actuation of the first and second valves to automatically pass the first fluid through the coolant loop when the system is in an operational state and to automatically maintain the second fluid in the coolant loop when the system is in a shipping state.

摘要翻译： 提供一种用于冷却电子设备的多流体冷却系统和方法，其在运输状态下采用防冻保护。 冷却系统包括冷却剂回路，其具有包含第一和第二流体的膨胀罐，其不混溶并且具有不同的密度，并且第二流体在比第一流体低的温度下冻结。 冷却剂回路还包括用于促进第一流体耦合到冷却剂回路中的第一阀和用于促进第二流体耦合到冷却剂回路中的第二阀，第一和第二阀是可独立控制的。 当系统处于操作状态时，控制逻辑电子地控制第一和第二阀的致动，以自动地将第一流体通过冷却剂回路，并且当系统处于运输状态时，自动维持冷却剂回路中的第二流体。

公开(公告)号：US07653499B2

公开(公告)日：2010-01-26

申请号：US11956405

申请日：2007-12-14

申请人： Ronald P. Corrado ,  Madhusudan K. Iyengar ,  Jeffrey A. Newcomer ,  Roger R. Schmidt ,  Gerard V. Weber

发明人： Ronald P. Corrado ,  Madhusudan K. Iyengar ,  Jeffrey A. Newcomer ,  Roger R. Schmidt ,  Gerard V. Weber

IPC分类号： G01R21/00

CPC分类号： G06Q10/06 ,  G01R22/00 ,  G06Q50/00 ,  G06Q50/06 ,  Y02P90/82

摘要： An automated method and system are provided for facilitating monitoring of energy usage within a data center. The method includes automatically determining energy usage of one or more electronics racks of a data center by automatically ascertaining time-based energy usage of the electronics racks. The automatically ascertaining includes obtaining multiple measurements of instantaneous energy usage by each of the electronics racks in the data center over a period of time, and then separately averaging the multiple measurements for each electronics rack to obtain the time-based energy usage of each electronics racks. The method also includes outputting the time-based energy usage of the electronic(s) racks to facilitate monitoring of the data center.

摘要翻译： 提供了一种自动化方法和系统，用于便于监视数据中心内的能量使用。 该方法包括通过自动确定电子机架的基于时间的能量使用来自动确定数据中心的一个或多个电子机架的能量使用。 自动确定包括在一段时间内获得数据中心中每个电子机架的瞬时能量使用的多个测量值，然后分别平均每个电子机架的多个测量值，以获得每个电子机架的基于时间的能量使用 。 该方法还包括输出电子机架的基于时间的能量使用以便于监视数据中心。

公开(公告)号：US07651260B2

公开(公告)日：2010-01-26

申请号：US12048620

申请日：2008-03-14

申请人： Hendrik F. Hamann ,  Madhusudan K. Iyengar ,  James A. Lacey ,  Roger R. Schmidt

发明人： Hendrik F. Hamann ,  Madhusudan K. Iyengar ,  James A. Lacey ,  Roger R. Schmidt

IPC分类号： G01N25/72

CPC分类号： H01L23/34 ,  H01L2924/0002 ,  H01L2924/00

摘要： What is disclosed is an apparatus for determining the cooling characteristics of a cooling device used for transferring heat from an electronic device. The apparatus comprising a cooling device thermally coupled to a heat pipe. The heat pipe having an exposed surface for the selective application of heat thereon. A localized heat source is selectively applied to at least one region of the exposed surface. The heat source preferably capable of being varied both positionally relative to the exposed surface and in heat intensity. A heat shield is preferably positioned around the exposed surface of the heat pipe to isolate the operational cooling device from the localized heat source. A temperature detector repeatedly measures a temperature distribution across the exposed surface while the cooling device is in a heat transfer mode. The temperature distribution is then used to thermally characterize the cooling device.

摘要翻译： 所公开的是用于确定用于从电子设备传递热量的冷却装置的冷却特性的装置。 该装置包括热耦合到热管的冷却装置。 该热管具有用于选择性地在其上施加热量的暴露表面。 选择性地将局部热源施加到暴露表面的至少一个区域。 热源优选地能够相对于暴露的表面和热强度都在位置上变化。 优选地，隔热板围绕热管的暴露表面定位，以将操作冷却装置与局部热源隔离。 当冷却装置处于传热模式时，温度检测器重复测量暴露表面上的温度分布。 然后使用温度分布来热定形冷却装置。