Delivery capsules
    61.
    发明申请
    Delivery capsules 审中-公开
    送胶囊

    公开(公告)号:US20050191346A1

    公开(公告)日:2005-09-01

    申请号:US10701293

    申请日:2003-11-03

    CPC分类号: A61J3/07 A61K9/4808

    摘要: A delivery capsule, designed to retain and protect its contents until an intended site of delivery or conditions of delivery are encountered, has at least two separate chambers (18, 20), the chambers usually containing different materials. The capsule is preferably internally divided by a dividing wall or septum (16), conveniently in the form of a median wall symmetrically arranged to form two chambers of similar size and shape. Also disclosed are a method of encapsulation and encapsulation apparatus.

    摘要翻译: 设计用于保持和保护其内容物直到出现预定的运送地点或运送条件的运送胶囊具有至少两个单独的腔室(18,20),该腔室通常包含不同的材料。 胶囊优选由分隔壁或隔膜(16)内部分开,方便地以对称布置的中间壁的形式形成两个具有相似尺寸和形状的室。 还公开了一种封装和封装装置的方法。

    HIGH-DENSITY SPLIT-GATE FINFET
    62.
    发明申请
    HIGH-DENSITY SPLIT-GATE FINFET 失效
    高密度分离栅FINFET

    公开(公告)号:US20050073005A1

    公开(公告)日:2005-04-07

    申请号:US10605544

    申请日:2003-10-07

    摘要: Disclosed is a method and structure for forming a split-gate fin-type field effect transistor (FinFET). The invention produces a split-gate fin-type field effect transistor (FinFET) that has parallel fin structures. Each of the fin structures has a source region at one end, a drain region at the other end, and a channel region in the middle portion. Back gate conductors are positioned between channel regions of alternating pairs of the fin structures and front gate conductors are positioned between channel regions of opposite alternating pairs of the fin structures. Thus, the back gate conductors and the front gate conductors are alternatively inter-digitated between channel regions of the fin structures.

    摘要翻译: 公开了用于形成分裂栅极鳍型场效应晶体管(FinFET)的方法和结构。 本发明产生具有平行翅片结构的分裂栅极鳍型场效应晶体管(FinFET)。 每个翅片结构的一端具有源极区域,另一端处的漏极区域和中间部分中的沟道区域。 背栅导体定位在翅片结构的交替对的通道区域之间,并且前栅极导体位于翅片结构的相对交替对的通道区域之间。 因此,背栅极导体和前栅极导体在散热片结构的沟道区域之间被交替地数位化。

    DEVICES FOR ACCESSORY INTEGRATION
    63.
    发明申请
    DEVICES FOR ACCESSORY INTEGRATION 审中-公开
    配件集成设备

    公开(公告)号:US20130215589A1

    公开(公告)日:2013-08-22

    申请号:US13400485

    申请日:2012-02-20

    IPC分类号: H05K7/02

    CPC分类号: A47B21/06

    摘要: The invention provides devices for integration of accessory devices, and systems employing such devices. In particular embodiments, devices described herein provide structural support for and/or electrical power to accessory devices.

    摘要翻译: 本发明提供了用于集成附件装置的装置以及采用这种装置的系统。 在具体实施例中,本文所述的装置为附件装置提供和/或电力的结构支持。

    Drainage Bag
    64.
    发明申请
    Drainage Bag 审中-公开
    排水袋

    公开(公告)号:US20080119805A1

    公开(公告)日:2008-05-22

    申请号:US12013112

    申请日:2008-01-11

    IPC分类号: A61F5/445

    CPC分类号: A61L28/0034

    摘要: A drainage bag for receiving bodily waste, such as an ostomy bag, comprises an outer bag of material soluble in cold water, e.g. polyvinyl alcohol, and an inner bag of material insoluble in water at ambient temperature and body temperature but soluble in organic solvent, e.g. 2-oxepanone polymer (polycaprolactone). When the bag (and contents) are to be disposed of, appropriate organic solvent (e.g. benzyl alcohol) is applied to the inner bag. The bag can then be placed in a WC bowl and is flushable after about 1-2 minutes.

    摘要翻译: 用于接收身体废物的排水袋,例如造口袋,包括可溶于冷水的外部材料袋,例如, 聚乙烯醇和在环境温度和体温下不溶于水的材料的内袋,但是可溶于有机溶剂,例如, 2-氧杂环戊酮聚合物(聚己内酯)。 当要处理袋子(和内容物)时,将合适的有机溶剂(例如苄醇)施加到内袋上。 然后将袋子放置在WC碗中,并在约1-2分钟后可冲洗。

    QUASI SELF-ALIGNED SOURCE/DRAIN FinFET PROCESS
    65.
    发明申请
    QUASI SELF-ALIGNED SOURCE/DRAIN FinFET PROCESS 审中-公开
    QUASI自对准源/漏极FinFET工艺

    公开(公告)号:US20080042202A1

    公开(公告)日:2008-02-21

    申请号:US11874753

    申请日:2007-10-18

    IPC分类号: H01L27/12

    摘要: A method of forming a semiconductor structure including a plurality of finFFET devices in which crossing masks are employed in providing a rectangular patterns to define relatively thin Fins along with a chemical oxide removal (COR) process is provided. The present method further includes a step of merging adjacent Fins by the use of a selective silicon-containing material. The present invention also relates to the resultant semiconductor structure that is formed utilizing the method of the present invention.

    摘要翻译: 提供了一种形成包括多个finFFET器件的半导体结构的方法,其中使用交叉掩模提供矩形图案以限定相对薄的金属丝以及化学氧化物去除(COR)工艺。 本方法还包括通过使用选择性含硅材料来合并相邻的金属丝的步骤。 本发明还涉及利用本发明的方法形成的所得半导体结构。

    MULTIPLE-GATE DEVICE WITH FLOATING BACK GATE
    66.
    发明申请
    MULTIPLE-GATE DEVICE WITH FLOATING BACK GATE 有权
    具有浮动后盖的多门装置

    公开(公告)号:US20070212834A1

    公开(公告)日:2007-09-13

    申请号:US11748576

    申请日:2007-05-15

    IPC分类号: H01L21/336

    摘要: Disclosed is a multiple-gate transistor that includes a channel region and source and drain regions at ends of the channel region. A gate oxide is positioned between a logic gate and the channel region and a first insulator is formed between a floating gate and the channel region. The first insulator is thicker than the gate oxide. The floating gate is electrically insulated from other structures. Also, a second insulator is positioned between a programming gate and the floating gate. Voltage in the logic gate causes the transistor to switch on and off, while stored charge in the floating gate adjusts the threshold voltage of the transistor. The transistor can comprise a fin-type field effect transistor (FinFET), where the channel region comprises the middle portion of a fin structure and the source and drain regions comprise end portions of the fin structure.

    摘要翻译: 公开了一种多栅极晶体管,其在沟道区的端部包括沟道区和源极和漏极区。 栅极氧化物位于逻辑栅极和沟道区之间,并且在浮置栅极和沟道区域之间形成第一绝缘体。 第一绝缘体比栅极氧化物厚。 浮动栅极与其他结构电绝缘。 此外,第二绝缘体位于编程门和浮动栅极之间。 逻辑门中的电压导致晶体管导通和截止,而浮置栅极中的存储电荷调节晶体管的阈值电压。 晶体管可以包括鳍式场效应晶体管(FinFET),其中沟道区域包括鳍结构的中间部分,并且源区和漏区包括鳍结构的端部。

    CMOS STRUCTURE AND METHOD INCLUDING MULTIPLE CRYSTALLOGRAPHIC PLANES
    67.
    发明申请
    CMOS STRUCTURE AND METHOD INCLUDING MULTIPLE CRYSTALLOGRAPHIC PLANES 有权
    CMOS结构和方法,包括多个水晶平面图

    公开(公告)号:US20070194373A1

    公开(公告)日:2007-08-23

    申请号:US11276274

    申请日:2006-02-22

    IPC分类号: H01L29/94

    摘要: A complementary metal oxide semiconductor (CMOS) structure includes a semiconductor substrate having first mesa having a first ratio of channel effective horizontal surface area to channel effective vertical surface area. The CMOS structure also includes a second mesa having a second ratio of the same surface areas that is greater than the first ratio. A first device having a first polarity uses the first mesa as a channel and benefits from the enhanced vertical crystallographic orientation. A second device having a second polarity different from the first polarity uses the second mesa as a channel and benefits from the enhanced horizontal crystallographic orientation.

    摘要翻译: 互补金属氧化物半导体(CMOS)结构包括具有第一台面的半导体衬底,其具有沟道有效水平表面积与沟道有效垂直表面面积的第一比率。 CMOS结构还包括具有大于第一比率的相同表面积的第二比率的第二台面。 具有第一极性的第一器件使用第一台面作为通道,并且受益于增强的垂直结晶取向。 具有与第一极性不同的第二极性的第二装置使用第二台面作为通道,并且受益于增强的水平晶体取向。

    SCHOTTKY BARRIER DIODE AND METHOD OF FORMING A SCHOTTKY BARRIER DIODE
    68.
    发明申请
    SCHOTTKY BARRIER DIODE AND METHOD OF FORMING A SCHOTTKY BARRIER DIODE 有权
    肖特基阻挡二极管和形成肖特基二极管二极管的方法

    公开(公告)号:US20070184594A1

    公开(公告)日:2007-08-09

    申请号:US11736599

    申请日:2007-04-18

    申请人: Edward Nowak

    发明人: Edward Nowak

    IPC分类号: H01L21/338

    CPC分类号: H01L29/872 H01L29/66143

    摘要: Disclosed is a silicon-on-insulator-based Schottky barrier diode with a low forward voltage that can be manufactured according to standard SOI process flow. An active silicon island is formed using an SOI wafer. One area of the island is heavily-doped with an n-type or p-type dopant, one area is lightly-doped with the same dopant, and an isolation structure is formed on the top surface above a junction between the two areas. A metal silicide region contacts the lightly-doped side of the island forming a Schottky barrier. Another discrete metal silicide region contacts the heavily-doped area of the island forming an electrode to the Schottky barrier (i.e., a Schottky barrier contact). The two metal silicide regions are isolated from each other by the isolation structure. Contacts to each of the discrete metal silicide regions allow a forward and/or a reverse bias to be applied to the Schottky barrier.

    摘要翻译: 公开了可以根据标准SOI工艺流程制造的具有低正向电压的基于硅绝缘体的肖特基势垒二极管。 使用SOI晶片形成活性硅岛。 该岛的一个区域被n型或p型掺杂物重掺杂,一个区域用相同的掺杂剂轻掺杂,并且在两个区域之间的结点上方的顶表面上形成隔离结构。 金属硅化物区域接触形成肖特基势垒的岛的轻掺杂侧。 另一个分立的金属硅化物区域接触形成与肖特基势垒(即,肖特基势垒接触)的电极的岛的重掺杂区域。 两个金属硅化物区域通过隔离结构彼此隔离。 与离散的金属硅化物区域中的每一个的接触允许将正向和/或反向偏压施加到肖特基势垒。

    SEMICONDUCTOR TRANSISTORS WITH EXPANDED TOP PORTIONS OF GATES
    69.
    发明申请
    SEMICONDUCTOR TRANSISTORS WITH EXPANDED TOP PORTIONS OF GATES 有权
    具有膨胀的顶部顶部的半导体晶体管

    公开(公告)号:US20070158763A1

    公开(公告)日:2007-07-12

    申请号:US11275514

    申请日:2006-01-11

    IPC分类号: H01L29/76 H01L21/3205

    摘要: A semiconductor transistor with an expanded top portion of a gate and a method for forming the same. The semiconductor transistor with an expanded top portion of a gate includes (a) a semiconductor region which includes a channel region and first and second source/drain regions; the channel region is disposed between the first and second source/drain regions, (b) a gate dielectric region in direct physical contact with the channel region, and (c) a gate electrode region which includes a top portion and a bottom portion. The bottom portion is in direct physical contact with the gate dielectric region. A first width of the top portion is greater than a second width of the bottom portion. The gate electrode region is electrically insulated from the channel region by the gate dielectric region.

    摘要翻译: 具有扩大的栅极顶部的半导体晶体管及其形成方法。 具有扩大的栅极顶部的半导体晶体管包括:(a)包括沟道区和第一和第二源极/漏极区的半导体区; 沟道区域设置在第一和第二源极/漏极区域之间,(b)与沟道区域直接物理接触的栅极电介质区域,以及(c)包括顶部和底部的栅电极区域。 底部部分与栅介质区域直接物理接触。 顶部的第一宽度大于底部的第二宽度。 栅电极区域通过栅极电介质区域与沟道区域电绝缘。

    HIGH MOBILITY PLANE FINFETS WITH EQUAL DRIVE STRENGTH
    70.
    发明申请
    HIGH MOBILITY PLANE FINFETS WITH EQUAL DRIVE STRENGTH 失效
    具有均匀驱动强度的高移动平面结构

    公开(公告)号:US20070111410A1

    公开(公告)日:2007-05-17

    申请号:US11622169

    申请日:2007-01-11

    IPC分类号: H01L21/84 H01L21/00

    摘要: An integrated circuit structure has a buried oxide (BOX) layer above a substrate, and a first-type fin-type field effect transistor (FinFET) and a second-type FinFET above the BOX layer. The second region of the BOX layer includes a seed opening to the substrate. The top of the first-type FinFET and the second-type FinFET are planar with each other. A first region of the BOX layer below the first FinFET fin is thicker above the substrate when compared to a second region of the BOX layer below the second FinFET fin. Also, the second FinFET fin is taller than the first FinFET fin. The height difference between the first fin and the second fin permits the first-type FinFET to have the same drive strength as the second-type FinFET.

    摘要翻译: 集成电路结构在衬底上方具有掩埋氧化物(BOX)层,以及在BOX层上方的第一型鳍型场效应晶体管(FinFET)和第二类型FinFET。 BOX层的第二区域包括到基板的种子开口。 第一型FinFET和第二型FinFET的顶部彼此平坦。 当与第二FinFET鳍片下面的BOX层的第二区域相比时,第一FinFET鳍片下面的BOX层的第一区域比衬底上方更厚。 此外,第二个FinFET鳍片比第一个FinFET鳍片高。 第一鳍片和第二鳍片之间的高度差允许第一类型的FinFET具有与第二类型FinFET相同的驱动强度。