摘要:
A delivery capsule, designed to retain and protect its contents until an intended site of delivery or conditions of delivery are encountered, has at least two separate chambers (18, 20), the chambers usually containing different materials. The capsule is preferably internally divided by a dividing wall or septum (16), conveniently in the form of a median wall symmetrically arranged to form two chambers of similar size and shape. Also disclosed are a method of encapsulation and encapsulation apparatus.
摘要:
Disclosed is a method and structure for forming a split-gate fin-type field effect transistor (FinFET). The invention produces a split-gate fin-type field effect transistor (FinFET) that has parallel fin structures. Each of the fin structures has a source region at one end, a drain region at the other end, and a channel region in the middle portion. Back gate conductors are positioned between channel regions of alternating pairs of the fin structures and front gate conductors are positioned between channel regions of opposite alternating pairs of the fin structures. Thus, the back gate conductors and the front gate conductors are alternatively inter-digitated between channel regions of the fin structures.
摘要:
The invention provides devices for integration of accessory devices, and systems employing such devices. In particular embodiments, devices described herein provide structural support for and/or electrical power to accessory devices.
摘要:
A drainage bag for receiving bodily waste, such as an ostomy bag, comprises an outer bag of material soluble in cold water, e.g. polyvinyl alcohol, and an inner bag of material insoluble in water at ambient temperature and body temperature but soluble in organic solvent, e.g. 2-oxepanone polymer (polycaprolactone). When the bag (and contents) are to be disposed of, appropriate organic solvent (e.g. benzyl alcohol) is applied to the inner bag. The bag can then be placed in a WC bowl and is flushable after about 1-2 minutes.
摘要:
A method of forming a semiconductor structure including a plurality of finFFET devices in which crossing masks are employed in providing a rectangular patterns to define relatively thin Fins along with a chemical oxide removal (COR) process is provided. The present method further includes a step of merging adjacent Fins by the use of a selective silicon-containing material. The present invention also relates to the resultant semiconductor structure that is formed utilizing the method of the present invention.
摘要:
Disclosed is a multiple-gate transistor that includes a channel region and source and drain regions at ends of the channel region. A gate oxide is positioned between a logic gate and the channel region and a first insulator is formed between a floating gate and the channel region. The first insulator is thicker than the gate oxide. The floating gate is electrically insulated from other structures. Also, a second insulator is positioned between a programming gate and the floating gate. Voltage in the logic gate causes the transistor to switch on and off, while stored charge in the floating gate adjusts the threshold voltage of the transistor. The transistor can comprise a fin-type field effect transistor (FinFET), where the channel region comprises the middle portion of a fin structure and the source and drain regions comprise end portions of the fin structure.
摘要:
A complementary metal oxide semiconductor (CMOS) structure includes a semiconductor substrate having first mesa having a first ratio of channel effective horizontal surface area to channel effective vertical surface area. The CMOS structure also includes a second mesa having a second ratio of the same surface areas that is greater than the first ratio. A first device having a first polarity uses the first mesa as a channel and benefits from the enhanced vertical crystallographic orientation. A second device having a second polarity different from the first polarity uses the second mesa as a channel and benefits from the enhanced horizontal crystallographic orientation.
摘要:
Disclosed is a silicon-on-insulator-based Schottky barrier diode with a low forward voltage that can be manufactured according to standard SOI process flow. An active silicon island is formed using an SOI wafer. One area of the island is heavily-doped with an n-type or p-type dopant, one area is lightly-doped with the same dopant, and an isolation structure is formed on the top surface above a junction between the two areas. A metal silicide region contacts the lightly-doped side of the island forming a Schottky barrier. Another discrete metal silicide region contacts the heavily-doped area of the island forming an electrode to the Schottky barrier (i.e., a Schottky barrier contact). The two metal silicide regions are isolated from each other by the isolation structure. Contacts to each of the discrete metal silicide regions allow a forward and/or a reverse bias to be applied to the Schottky barrier.
摘要:
A semiconductor transistor with an expanded top portion of a gate and a method for forming the same. The semiconductor transistor with an expanded top portion of a gate includes (a) a semiconductor region which includes a channel region and first and second source/drain regions; the channel region is disposed between the first and second source/drain regions, (b) a gate dielectric region in direct physical contact with the channel region, and (c) a gate electrode region which includes a top portion and a bottom portion. The bottom portion is in direct physical contact with the gate dielectric region. A first width of the top portion is greater than a second width of the bottom portion. The gate electrode region is electrically insulated from the channel region by the gate dielectric region.
摘要:
An integrated circuit structure has a buried oxide (BOX) layer above a substrate, and a first-type fin-type field effect transistor (FinFET) and a second-type FinFET above the BOX layer. The second region of the BOX layer includes a seed opening to the substrate. The top of the first-type FinFET and the second-type FinFET are planar with each other. A first region of the BOX layer below the first FinFET fin is thicker above the substrate when compared to a second region of the BOX layer below the second FinFET fin. Also, the second FinFET fin is taller than the first FinFET fin. The height difference between the first fin and the second fin permits the first-type FinFET to have the same drive strength as the second-type FinFET.