公开(公告)号：US08496845B2

公开(公告)日：2013-07-30

申请号：US13001847

申请日：2009-06-30

申请人： Tatsumi Tsuchiya ,  Katsuki Fujiwara ,  Masahiro Noguchi ,  Yasufu Yamada

发明人： Tatsumi Tsuchiya ,  Katsuki Fujiwara ,  Masahiro Noguchi ,  Yasufu Yamada

IPC分类号： C09K5/04

CPC分类号： C09K5/045 ,  C09K2205/126 ,  C09K2205/22

摘要： The present invention provides a refrigerant composition that is nonflammable, and ensures low LCCP and less burden on the environment. More specifically, the present invention relates a refrigerant composition containing difluoromethane (HFC32), pentafluoroethane (HFC125), and 2,3,3,3-tetrafluoropropene (HFO1234yf), the ratio of HFC32/HFC125/HFO1234yf being in a range surrounded by points (0/21/79 mass %), (16.6/25.3/58.1 mass %), and (0/28.4/71.6 mass %) in a ternary diagram of a refrigerant composition containing HFC32, HFC125, and HFO1234yf, and the composition essentially containing HFC32.

摘要翻译： 本发明提供一种不易燃的制冷剂组合物，并且确保低的LCCP和较小的环境负担。 更具体地说，本发明涉及包含二氟甲烷（HFC32），五氟乙烷（HFC125）和2,3,3,3-四氟丙烯（HFO1234yf）的制冷剂组合物，HFC32 / HFC125 / HFO1234yf的比例在点 （0/21/79质量％），（16.6 / 25.3 / 58.1质量％）和含有HFC32，HFC125和HFO1234yf的制冷剂组合物的三元图中的（0 / 28.4 / 71.6质量％），组成基本上 含有HFC32。

公开(公告)号：US20110108757A1

公开(公告)日：2011-05-12

申请号：US13001867

申请日：2009-06-30

申请人： Takashi Shibanuma ,  Tatsumi Tsuchiya

发明人： Takashi Shibanuma ,  Tatsumi Tsuchiya

IPC分类号： C09K5/00

CPC分类号： C09K5/045 ,  C09K2205/126 ,  C09K2205/22

摘要： The present invention provides a non-flammable refrigerant, which is excellent in handleability while retaining the refrigerating capacity. Specifically, the present invention relates to a refrigerant composition comprising 36 to 50 mass % of 1,1,1,2-tetrafluoroethane (HFC134a) and 50 to 64 mass % of 2,3,3,3-tetrafluoropropene (HFO1234yf).

摘要翻译： 本发明提供了一种在保持制冷能力的同时处理性优异的不可燃性制冷剂。 具体地说，本发明涉及含有36〜50质量％的1,1,1,2-四氟乙烷（HFC134a）和50〜64质量％的2,3,3,3-四氟丙烯（HFO1234yf）的制冷剂组合物。

公开(公告)号：US07893534B2

公开(公告)日：2011-02-22

申请号：US11891530

申请日：2007-08-10

申请人： Toshiki Hirano ,  Haruhide Takahashi ,  Tatsumi Tsuchiya

发明人： Toshiki Hirano ,  Haruhide Takahashi ,  Tatsumi Tsuchiya

IPC分类号： H01L23/48

CPC分类号： H01L23/49816 ,  G11B5/4853 ,  G11B5/4873 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0201 ,  H05K1/111 ,  H05K3/3442 ,  H05K3/3494 ,  H05K2201/062 ,  H05K2201/10727 ,  H05K2203/041 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/49028 ,  Y10T29/4903 ,  Y10T29/49032 ,  H01L2924/00

摘要： A thermally insulating bonding pad for solder reflow is described. The bonding pad includes a structure. The structure forms the bonding pad. The bonding pad further includes an insulator formed on the structure. The insulator is configured to be interposed between the structure and a substrate of a component onto which said bonding pad is to be disposed. The bonding pad provides thermal insulation for said substrate when said bonding pad is subject to a solder reflow process being performed thereon.

摘要翻译： 描述了用于焊料回流的隔热焊盘。 接合焊盘包括结构。 该结构形成接合垫。 接合焊盘还包括形成在结构上的绝缘体。 绝缘体被配置为插入在结构和要布置所述接合焊盘的部件的基板之间。 当所述接合焊盘经受在其上进行的焊料回流工艺时，所述接合焊盘为所述衬底提供热绝缘。

公开(公告)号：US07859793B2

公开(公告)日：2010-12-28

申请号：US11804035

申请日：2007-05-15

申请人： Yoshio Uematsu ,  Kenjirou Watanabe ,  Tatsumi Tsuchiya ,  Yukihiro Nakamura

发明人： Yoshio Uematsu ,  Kenjirou Watanabe ,  Tatsumi Tsuchiya ,  Yukihiro Nakamura

IPC分类号： G11B5/60

CPC分类号： G11B5/4826 ,  G11B5/6011

摘要： A magnetic head assembly in which a slider can be removed with deformation of a suspension suppressed and the posture angle of a magnetic head can be maintained stably and a magnetic disk drive mounted with the magnetic head assembly. A head gimbal assembly (HGA) according to an embodiment includes a suspension, a magnetic head slider provided with a magnetic head element section, and a gimbal retaining the slider and connected to the suspension. The gimbal includes a spacer formed around a conductive adhesive application area. A nonconductive adhesive application area having a planar dimension not larger than that of the conductive adhesive application area is formed outside the spacer. The gimbal and the slider are brought into conduction through a conductive adhesive applied to the conductive adhesive application area and are adhered to each other with a nonconductive adhesive applied to the nonconductive adhesive application area.

摘要翻译： 一种磁头组件，其中滑块可以被抑制的悬架的变形移除，并且可以稳定地保持磁头的姿态角度以及安装有磁头组件的磁盘驱动器。 根据实施例的头万向架组件（HGA）包括悬架，设置有磁头元件部分的磁头滑动器和保持滑块并连接到悬架的万向架。 万向节包括在导电粘合剂施加区域周围形成的间隔物。 在间隔物的外侧形成具有不大于导电性粘合剂涂布区域的平面尺寸的非导电性粘合剂涂敷区域。 万向架和滑块通过施加到导电粘合剂施加区域上的导电粘合剂导通，并且用施加到非导电粘合剂施加区域的非导电粘合剂彼此粘合。

公开(公告)号：US20100089981A1

公开(公告)日：2010-04-15

申请号：US12576715

申请日：2009-10-09

申请人： Yohsuke Matsumoto ,  Tatsumi Tsuchiya ,  Eiki Oosawa ,  Tatsushi Yoshida

发明人： Yohsuke Matsumoto ,  Tatsumi Tsuchiya ,  Eiki Oosawa ,  Tatsushi Yoshida

IPC分类号： B23K1/00

CPC分类号： B23K1/0016 ,  B23K1/0056 ,  B23K3/0623 ,  B23K26/03 ,  B23K26/1476 ,  B23K2101/42 ,  H05K3/3442 ,  H05K3/3478 ,  H05K3/3494 ,  H05K2201/10727 ,  H05K2203/0195 ,  H05K2203/041 ,  H05K2203/107

摘要： An apparatus for interconnecting two connection pads in a head-gimbal assembly. The apparatus includes a conveyer for conveying a metallic slug, and a nozzle for ejecting the metallic slug toward the two connection pads. The nozzle includes a receiving portion for receiving the metallic slug from the conveyer, and a straight guide disposed downstream of the receiving portion. The straight guide has a maximum inner diameter that is smaller than a minimum inner diameter of the receiving portion. The apparatus also includes a laser for applying a laser beam from an inlet side of the nozzle to the metallic slug as the metallic slug passes along a path that includes a first portion through said straight guide and a second portion between the straight guide and the two connection pads. The laser is configured to melt the metallic slug for attaching the metallic slug to the two connection pads.

摘要翻译： 一种用于互连头万向节组件中的两个连接焊盘的装置。 该装置包括用于输送金属块的输送机和用于朝向两个连接垫排出金属块的喷嘴。 喷嘴包括用于从传送器接收金属块的接收部分和设置在接收部分下游的直的引导件。 该直引导件的最大内径小于接收部分的最小内径。 该装置还包括一激光器，用于当金属芯块沿着包括通过所述直引导件的第一部分的路径和直引导件与两者之间的第二部分的路径通过时，将激光束从喷嘴的入口侧施加到金属块 连接垫 激光器被配置为熔化用于将金属块塞附接到两个连接焊盘的金属块。

公开(公告)号：US20050024777A1

公开(公告)日：2005-02-03

申请号：US10929507

申请日：2004-08-30

申请人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

发明人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

IPC分类号： G11B21/21 ,  G11B5/48 ,  G11B21/20

CPC分类号： G11B5/4826 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/4998 ,  Y10T29/5313 ,  Y10T29/53165 ,  Y10T29/53174 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53252 ,  Y10T29/5327

摘要： A base plate and load beam for an HG assembly are formed in series, stacked, and transferred by a transfer system in the form of the stacked-layer series to undergo the necessary assembly processes such as layer joining, slider attachment, and electrical connections between the terminals thereon. When uncompleted HG assemblies are transferred for each of the manufacturing processes, the uncompleted HG assembly is mounted on the assembly jig such as a tray or a block for transference. For this reason, assembling jigs, the number of which is at least equal to the number of the uncompleted HG assemblies remaining at the respective assembly processes would be needed. Accordingly, the efficiency of work space is reduced, and a rise in manufacturing cost is brought about by the need for the assembling jigs.

公开(公告)号：US20050022372A1

公开(公告)日：2005-02-03

申请号：US10929512

申请日：2004-08-30

申请人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

发明人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

IPC分类号： G11B21/21 ,  G11B5/48 ,  G11B21/20 ,  B23P19/00

CPC分类号： G11B5/4826 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/4998 ,  Y10T29/5313 ,  Y10T29/53165 ,  Y10T29/53174 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53252 ,  Y10T29/5327

摘要： A base plate and load beam for an HG assembly are formed in series, stacked, and transferred by a transfer system in the form of the stacked-layer series to undergo the necessary assembly processes such as layer joining, slider attachment, and electrical connections between the terminals thereon. When uncompleted HG assemblies are transferred for each of the manufacturing processes, the uncompleted HG assembly is mounted on the assembly jig such as a tray or a block for transference. For this reason, assembling jigs, the number of which is at least equal to the number of the uncompleted HG assemblies remaining at the respective assembly processes would be needed. Accordingly, the efficiency of work space is reduced, and a rise in manufacturing cost is brought about by the need for the assembling jigs.

摘要翻译： 用于HG组件的底板和负载梁通过堆叠层系列形式的传送系统串联，堆叠和传送，以进行必要的组装过程，例如层接合，滑块附接和电连接 其上的端子。 当为每个制造过程转移未完成的HG组件时，未完成的HG组件安装在组装夹具上，例如托盘或用于转移的块。 因此，需要组装夹具的数量至少等于在各个组装过程中保留的未完成的HG组件的数量。 因此，减少了工作空间的效率，并且由于需要组装夹具而引起制造成本的上升。

公开(公告)号：US06848167B2

公开(公告)日：2005-02-01

申请号：US09879514

申请日：2001-06-12

申请人： Yasuhiro Mita ,  Kohichiroh Naka ,  Takuya Satoh ,  Tatsumi Tsuchiya ,  Tatsushi Yoshida

发明人： Yasuhiro Mita ,  Kohichiroh Naka ,  Takuya Satoh ,  Tatsumi Tsuchiya ,  Tatsushi Yoshida

IPC分类号： G11B21/21 ,  B23K37/04 ,  G11B5/48 ,  G11B5/42

CPC分类号： G11B5/4853 ,  B23K37/0443 ,  B23K2101/38 ,  Y10T29/49023 ,  Y10T29/49027 ,  Y10T29/49815 ,  Y10T29/5397

摘要： A head gimbal assembly, which is a component of a hard disk drive, has a bending portion that has elasticity and is bent at a predetermined angle under an unloaded condition, and a slider is bonded to a holding portion thereof by mounting the head gimbal assembly on a bonding jig in a state in which the bending portion is stretched. When the head gimbal assembly is separated from the bonding jig after bonding, the bending portion is not restored freely, so that the head gimbal assembly is caught by the bonding jig during the separating process and a locked state is sometimes established.

摘要翻译： 作为硬盘驱动器的组件的头万向架组件具有弯曲部分，该弯曲部分具有弹性并且在无负载条件下以预定角度弯曲，并且滑块通过安装头部万向架组件而结合到其保持部分 在弯曲部被拉伸的状态下的接合夹具上。 当磁头万向架组件在接合之后与接合夹具分离时，弯曲部分不能自由地恢复，使得头部万向节组件在分离过程中被接合夹具卡住，并且有时建立锁定状态。

公开(公告)号：US06823581B2

公开(公告)日：2004-11-30

申请号：US09989633

申请日：2001-11-20

申请人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

发明人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

IPC分类号： B23P1902

CPC分类号： G11B5/4826 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/4998 ,  Y10T29/5313 ,  Y10T29/53165 ,  Y10T29/53174 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53252 ,  Y10T29/5327

摘要： A base plate and load beam for an HG assembly are formed in series, stacked, and transferred by a transfer system in the form of the stacked-layer series to undergo the necessary assembly processes such as layer joining, slider attachment, and electrical connections between the terminals thereon. When uncompleted HG assemblies are transferred for each of the manufacturing processes, the uncompleted HG assembly is mounted on the assembly jig such as a tray or a block for transference. For this reason, assembling jigs, the number of which is at least equal to the number of the uncompleted HG assemblies remaining at the respective assembly processes would be needed. Accordingly, the efficiency of work space is reduced, and a rise in manufacturing cost is brought about by the need for the assembling jigs.

摘要翻译： 用于HG组件的底板和负载梁通过堆叠层系列形式的传送系统串联，堆叠和传送，以进行必要的组装过程，例如层接合，滑块附接和电连接 其上的端子。 当为每个制造过程转移未完成的HG组件时，未完成的HG组件安装在组装夹具上，例如托盘或用于转移的块。 因此，需要组装夹具的数量至少等于在各个组装过程中保留的未完成的HG组件的数量。 因此，减少了工作空间的效率，并且由于需要组装夹具而引起制造成本的上升。

公开(公告)号：US06543677B2

公开(公告)日：2003-04-08

申请号：US09872252

申请日：2001-05-31

申请人： Surya Pattanaik ,  Takuya Satoh ,  Tatsumi Tsuchiya ,  Tatsushi Yoshida

发明人： Surya Pattanaik ,  Takuya Satoh ,  Tatsumi Tsuchiya ,  Tatsushi Yoshida

IPC分类号： B23K3512

CPC分类号： H05K3/3478 ,  B23K3/0623 ,  G11B5/4853 ,  H05K3/3442 ,  H05K3/3494 ,  H05K2201/10727 ,  H05K2203/0195 ,  H05K2203/041 ,  H05K2203/082 ,  H05K2203/086 ,  H05K2203/107

摘要： In devices for solder-ball bonding of a bonding pad of a slider of a head gimbal assembly to a lead pad of a lead, although a device that can perform (1) the supply of solder balls, (2) the positioning of a solder ball, (3) the blowing of nitrogen gas N2, and (4) the melting of the solder ball by laser radiation in one device is available, there are various problems that cannot improve the efficiency of laser radiation, maintenance, or operation efficiency, due to spatial restriction, difficulty of weight reduction, or fixed operation procedures. A solder-ball holder and an optical device are configured separately, and a vacuum pad is provided. A solder ball held in a solder-ball holding hole of the solder-ball holder is transported by the vacuum pad to a connecting portion of a head gimbal assembly, and solder reflow is carried out by the optical device.