公开(公告)号：US06841921B2

公开(公告)日：2005-01-11

申请号：US10287310

申请日：2002-11-04

Applicant: Norman R. Stegelmann

Inventor： Norman R. Stegelmann

IPC: B06B3/02 ,  B23K20/10 ,  H01L41/08 ,  B29C65/08

CPC classification number: B06B3/00 ,  B06B3/02 ,  B23K20/106 ,  B29C65/085 ,  B29C65/087 ,  B29C66/41 ,  B29C66/73921 ,  B29C66/8167 ,  B29C66/83411 ,  B29C66/83413 ,  B29C66/951 ,  B29C66/9513 ,  B29C66/9517 ,  B29K2101/12 ,  B29L2031/4878

Abstract: An ultrasonic horn assembly for applying ultrasonic energy at an operating location which assembly includes a connector between horn assembly components which provides uniform clamping pressure between transfer faces of the components.

Abstract translation: 一种用于在操作位置施加超声波能量的超声波喇叭组件，该组件包括喇叭组件部件之间的连接器，其在部件的传送面之间提供均匀的夹紧压力。

公开(公告)号：US06743331B2

公开(公告)日：2004-06-01

申请号：US10347271

申请日：2003-01-21

Applicant: Seiji Takahashi ,  Masafumi Hizukuri

Inventor： Seiji Takahashi ,  Masafumi Hizukuri

IPC: B29C6508

CPC classification number: H01L24/81 ,  B23K20/10 ,  B23K20/106 ,  B23K2101/40 ,  H01L24/75 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75355 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/12042 ,  H01L2924/00

Abstract: A bonding tool for bonding electronic components by ultrasonic vibration. The bonding tool includes a horn supported by two ribs from both sides, and a transducer is attached to an end of this horn. A protrusion protruding downward from the center between the ribs is provided on the horn, and a tip of the protrusion is a bonding portion which contacts the electronic component. The transducer is driven to apply vertical vibration to the horn. A phase of vertical expansion and compression vibration on the horn generated by this vertical vibration is set to have the same phase as that of bending vibration on the protrusion. Accordingly, displacement by expansion and vertical vibration at side ends of the bonding portion is canceled out by displacement caused by bending vibration.

Abstract translation: 一种用于通过超声波振动接合电子部件的接合工具。 接合工具包括由两侧由两个肋支撑的喇叭，并且换能器附接到该喇叭的一端。 在喇叭上设置有从肋之间的中心向下突出的突起，突起的前端是与电子部件接触的接合部。 传感器被驱动以对喇叭施加垂直振动。 通过该垂直振动产生的喇叭上的垂直膨胀和压缩振动的相位被设定为与突起上的弯曲振动相同的相位。 因此，通过由弯曲振动引起的位移来抵消接合部的侧端的膨胀位移和垂直振动。

公开(公告)号：US06691909B2

公开(公告)日：2004-02-17

申请号：US09682727

申请日：2001-10-10

Applicant: Jan Birger Skogsmo ,  Larry Van Reatherford ,  Oludele Olusegun Popoola ,  Ray Jahn ,  Vijitha Senaka Kiridena

Inventor： Jan Birger Skogsmo ,  Larry Van Reatherford ,  Oludele Olusegun Popoola ,  Ray Jahn ,  Vijitha Senaka Kiridena

IPC: B23K106

CPC classification number: B23K20/106

Abstract: An apparatus and method for ultrasonically welding workpieces that reduces sonotrode adhesion during the ultrasonic welding process. The sonotrode includes a contact surface wherein a fluid is deposited on the contact surface prior to the welding process. The fluid may be applied in different ways, including providing an aperture in the contact surface of the sonotrode. In addition, the sonotrode may be cooled below the dew point of the surrounding atmosphere thus causing moisture to form on the contact surface of the sonotrode. Cooling the sonotrode to a temperature above the dew point also reduces sonotrode adhesion during the ultrasonic welding process.

Abstract translation: 一种用于在超声波焊接过程中超声波焊接工件的装置和方法，其减少超声焊接粘附。 超声波发生器包括接触表面，其中在焊接过程之前将流体沉积在接触表面上。 流体可以以不同的方式施加，包括在超声波发生器的接触表面中提供孔。 此外，超声波发生器可以被冷却到低于周围大气的露点，从而在超声波发生器的接触表面上形成水分。 将超声波发生器冷却到高于露点的温度，也可以在超声波焊接过程中降低超声焊丝粘附。

公开(公告)号：US06669074B2

公开(公告)日：2003-12-30

申请号：US10187957

申请日：2002-07-03

Applicant: Shigeru Sato

Inventor： Shigeru Sato

IPC: B23K106

CPC classification number: H01L24/78 ,  B23K20/106 ,  H01L24/45 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48 ,  H01L2224/78301 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The bonding position between a bonding wire and an electrode is maintained accurately, an ultrasonic horn is mounted to a bonding machine by the attachment portions of support portions situated at minimum vibration amplitude points equally distant from a capillary in opposite directions in such a manner that it is supported on both sides, and the ultrasonic horn, capillary and bonding work portion are vibrated by ultrasonic waves to bond the end portion of the bonding wire.

Abstract translation: 接合线和电极之间的接合位置被保持得很好，超声波喇叭通过位于与毛细管相反的最小振动振幅点处的相反方向的支撑部分的安装部分安装到接合机上， 并且通过超声波使超声波喇叭，毛细管和接合工作部分振动，以结合接合线的端部。

公开(公告)号：US20030160084A1

公开(公告)日：2003-08-28

申请号：US10372372

申请日：2003-02-24

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yuzo Higashiyama

IPC: B23K001/06

CPC classification number: H05K13/046 ,  B06B3/00 ,  B23K20/106 ,  H01L21/67092 ,  H01L21/67121 ,  H01L21/67144 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75355 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01327

Abstract: An ultrasonic bonding apparatus for applying a pressing load and ultrasonic vibrations to multiple objects to be bonded comprises: an ultrasonic horn formed as a horizontally symmetrical inverse triangle having two apexes besides a lower apex facing downwards; a vibrator attached to at least one apex of the ultrasonic horn for inputting ultrasonic vibrations in a direction facing the lower apex; and a load applying device linked to a portion on the ultrasonic horn which is above the lower apex and near the symmetry axis thereof, for applying a downwards pressing load to the ultrasonic horn. An abutting member for applying a pressing load and ultrasonic vibrations to the objects to be bonded is provided at the lower apex of the horn. This provides an ultrasonic bonding apparatus wherein flexing does not occur at the ultrasonic horn due to the applied load, and a uniform load and ultrasonic vibrations are applied to the entire bonding face, yielding uniform and high-quality bonding.

Abstract translation: 一种用于对多个待粘合物体施加压力载荷和超声波振动的超声波接合装置包括：形成为具有两个顶点的水平对称的倒三角形的超声波喇叭，除了一个下顶点面向下; 振动器，其附接到所述超声波喇叭的至少一个顶点，用于在面向所述下顶点的方向上输入超声波振动; 以及负载施加装置，其连接到超声波喇叭上的在下顶点之上并靠近其对称轴线的部分，用于向超声波喇叭施加向下的按压负载。 在喇叭的下部顶点设置有用于对待接合物体施加按压负载和超声波振动的抵接构件。 这提供了一种超声波接合装置，其中由于施加的负载而在超声波喇叭处不发生弯曲，并且在整个接合面上施加均匀的载荷和超声波振动，产生均匀和高质量的接合。

公开(公告)号：US06592711B1

公开(公告)日：2003-07-15

申请号：US09665327

申请日：2000-09-19

Applicant: Klaus Kubik

Inventor： Klaus Kubik

IPC: B32B3120

CPC classification number: G10K11/025 ,  B06B3/00 ,  B23K20/106 ,  B29C65/086 ,  B29C66/1122 ,  B29C66/234 ,  B29C66/45 ,  B29C66/7294 ,  B29C66/73921 ,  B29C66/8242 ,  B29C66/83411 ,  B29C66/83415 ,  B29C66/92611 ,  D04H1/54 ,  D04H1/555

Abstract: A device for processing a continuously running material web includes a machine frame with an ultrasonic generator unit with a sonotrode. A counter tool lies opposite the sonotrode, affixed on the machine frame. The material web is passed through the gap between the sonotrode and the counter tool; as a drive activated by a fluid pressure medium, to press the sonotrode that is movably mounted on the machine frame against the counter tool. A damper for damping vibrations of the sonotrode in the contact pressure direction is provided. This damper is connected at one end with the sonotrode, and at its other end to the machine frame so that vibrations excited by the web or by the counter tool are damped to such an extent that they are no longer noticeable in the processing effect.

Abstract translation: 用于处理连续运行的材料幅材的装置包括具有超声波发生器单元的超声波发生器的机架。 对位工具位于超声波发生器对面，固定在机架上。 材料纤维网通过超声焊条和对位工具之间的间隙; 作为由流体压力介质激活的驱动器，将可移动地安装在机架上的超声波发生器压靠在对置工具上。 提供了用于阻尼超声焊盘在接触压力方向上的振动的阻尼器。 该阻尼器的一端与超声波发生器连接，并且在另一端与机架相连，使得由腹板或对向工具激发的振动被抑制到使得它们在处理效果中不再显着的程度。

公开(公告)号：US20030066869A1

公开(公告)日：2003-04-10

申请号：US09682726

申请日：2001-10-10

Inventor： Carl Frederick Johnson ,  Elizabeth Therese Hetrick ,  Oludele Olusegun Popoola ,  Ray Jahn

IPC: B23K001/018 ,  B23K028/00

CPC classification number: B23K31/00 ,  B23K1/018 ,  B23K1/06 ,  B23K20/10 ,  B23K20/106

Abstract: The present invention is a disassembly apparatus and method for disassembling a workpiece having at least two layers joined together by welding or other bonding processes at bonding points. The method includes the steps of securing the workpiece into a fixture to prevent movement of one of the layers. The apparatus includes a sonotrode and a holding device. The method further includes moving the sonotrode to contact the workpiece to apply a predetermined amount of contact pressure to the workpiece. The sonotrode in contact with the layer on a side opposite the anvil is then vibrated at a predetermined frequency until the layers become disassembled. An apparatus for performing the method is also disclosed.

Abstract translation: 本发明是一种拆卸装置和方法，用于通过在接合点处的焊接或其它接合工艺将具有至少两层的工件拆卸。 该方法包括以下步骤：将工件固定到固定装置中以防止其中一层移动。 该装置包括超声波发生器和保持装置。 该方法还包括使超声波发生器移动以接触工件以对工件施加预定量的接触压力。 然后在与砧座相对的一侧与层接触的超声波发生器以预定的频率振动，直到层被分解为止。 还公开了一种用于执行该方法的装置。

公开(公告)号：US20030066863A1

公开(公告)日：2003-04-10

申请号：US09682727

申请日：2001-10-10

Inventor： Jan Birger Skogsmo ,  Larry Van Reatherford ,  Oludele Olusegun Popoola ,  Ray Jahn ,  Vijitha Senaka Kiridena

IPC: B23K001/06 ,  B23K005/20 ,  B23K020/10 ,  B23K037/00

CPC classification number: B23K20/106

Abstract: An apparatus and method for ultrasonically welding workpieces that reduces sonotrode adhesion during the ultrasonic welding process. The sonotrode includes a contact surface wherein a fluid is deposited on the contact surface prior to the welding process. The fluid may be applied in different ways, including providing an aperture in the contact surface of the sonotrode. In addition, the sonotrode may be cooled below the dew point of the surrounding atmosphere thus causing moisture to form on the contact surface of the sonotrode. Cooling the sonotrode to a temperature above the dew point also reduces sonotrode adhesion during the ultrasonic welding process.

Abstract translation: 一种用于在超声波焊接过程中超声波焊接工件的装置和方法，其减少超声焊接粘附。 超声波发生器包括接触表面，其中在焊接过程之前将流体沉积在接触表面上。 流体可以以不同的方式施加，包括在超声波发生器的接触表面中提供孔。 此外，超声波发生器可以被冷却到低于周围大气的露点，从而在超声波发生器的接触表面上形成水分。 将超声波发生器冷却到高于露点的温度，也可以在超声波焊接过程中降低超声焊丝粘附。

公开(公告)号：US06523733B2

公开(公告)日：2003-02-25

申请号：US09795270

申请日：2001-02-28

Applicant: Amir Miller ,  Gil Perlberg

Inventor： Amir Miller ,  Gil Perlberg

IPC: B23K3700

CPC classification number: H01L24/85 ,  B23K20/005 ,  B23K20/106 ,  B23K2101/32 ,  H01L24/45 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/78302 ,  H01L2224/78308 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/20752 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/00015

Abstract: A controlled attenuation bonding tool for bonding a fine wire to a substrate. The bonding tool comprises a first cylindrical section having a substantially uniform first diameter; a second cylindrical section having a first end coupled to an end of the first cylindrical section, the second cylindrical section having a substantially uniform second diameter less than the first diameter; and a third section having a predetermined taper, a first end of the third section coupled to an end of the second cylindrical section.

Abstract translation: 一种用于将细线结合到基底的受控衰减结合工具。 接合工具包括具有基本均匀的第一直径的第一圆柱形部分; 第二圆柱形部分，其具有联接到所述第一圆柱形部分的端部的第一端，所述第二圆柱形部分具有小于所述第一直径的基本均匀的第二直径; 以及具有预定锥度的第三部分，所述第三部分的第一端联接到所述第二圆柱形部分的端部。

公开(公告)号：US06497356B2

公开(公告)日：2002-12-24

申请号：US09886560

申请日：2001-06-21

Applicant: Amir Miller ,  Gil Perlberg

Inventor： Amir Miller ,  Gil Perlberg

IPC: B23K3700

CPC classification number: H01L24/85 ,  B23K20/005 ,  B23K20/106 ,  B23K2101/32 ,  H01L24/45 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/78302 ,  H01L2224/78308 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/00015

Abstract: A controlled attenuation bonding tool for bonding a fine wire to a substrate. The bonding tool comprises a first cylindrical section having a substantially uniform first diameter and a second cylindrical section with a substantially uniform second diameter less than the first diameter. The second cylindrical section is coupled to an end of the first cylindrical section and has a planar area along at least a portion of a length of the second section.