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公开(公告)号：US20180016686A1
公开(公告)日：2018-01-18
申请号：US15640650
申请日：2017-07-03
Inventor： Pierry VUILLE , Yoann MOSTEIRO VAZQUEZ , Pascal GROSSENBACHER
CPC classification number: C25D1/003 , B81C99/008 , B81C2201/032 , C23C16/48 , G04B19/042 , G04D3/0069 , G04D3/0074 , G04D3/0092
Abstract: A method for fabrication of a piece including, superposing an electrically insulating layer including a first orifice, an additional layer including a first aperture, an intermediate layer including a first hole, and a base layer surmounted by a base motif, depositing a metal layer, so that at the end of this step, the metal layer forms a shell covering electrically conductive walls of the base motif, of the first orifice, of the first aperture and of the first hole, and includes a lateral area resting on the insulating layer, dissolving the insulating layer, coating the metal or alloy layer with a volume formed by a base material of the piece, so that the volume conforms to the shapes of the metal layer.
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62.发明授权Process for fabricating a monolayer or multilayer metal structure in LIGA technology, and structure obtained 有权在LIGA技术中制造单层或多层金属结构的方法和获得的结构公开(公告)号：US09284654B2
公开(公告)日：2016-03-15
申请号：US12952825
申请日：2010-11-23
Applicant: Clément Saucy
Inventor： Clément Saucy
CPC classification number: C25D1/003 , B81B2201/035 , B81C99/0085 , B81C2201/032 , C25D1/20 , G03F7/00
Abstract: The invention relates to a process for fabricating a monolayer or multilayer metal structure in LIGA technology, in which a photoresist layer is deposited on a flat metal substrate, a photoresist mold is created by irradiation or electron or ion bombardment, a metal or alloy is electroplated in this mold, the electroformed metal structure is detached from the substrate and the photoresist is separated from this metal structure, wherein the metal substrate is used as an agent involved in the forming of at least one surface of the metal structure other than that formed by the plane surface of the substrate.
Abstract translation: 本发明涉及一种在LIGA技术中制造单层或多层金属结构的方法，其中光致抗蚀剂层沉积在平坦的金属基底上，通过照射或电子或离子轰击产生光致抗蚀剂模具，电镀金属或合金 在该模具中，电铸金属结构与基板分离，并且光致抗蚀剂与该金属结构分离，其中金属基板用作形成金属结构的至少一个表面的试剂，而不是由 基板的平面。
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公开(公告)号：US09194052B2
公开(公告)日：2015-11-24
申请号：US13266229
申请日：2010-05-26
Applicant: Alexandre Fussinger
Inventor： Alexandre Fussinger
CPC classification number: C25D1/003 , B81C99/0085 , B81C2201/032 , C25D1/20 , C25D5/022 , G03F7/0035 , Y10T29/49124
Abstract: A method of fabricating a plurality of metallic microstructures by LIGA process, the method including a flattening step or a levelling step of the resin layer before the step of electroforming the metallic microstructures permitting the resin layer to have a uniform thickness, which enables molds, and then finished metallic microstructures, to be made with uniform dimensional precision in the plane for the metallic microstructures of the same substrate.
Abstract translation: 一种通过LIGA工艺制造多个金属微结构的方法，所述方法包括在电铸所述树脂层具有均匀厚度的金属微结构的步骤之前的所述树脂层的平整步骤或调平步骤，所述金属微结构允许模具和 然后完成金属微观结构，在相同基底的金属微结构的平面上制成具有均匀的尺寸精度。
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公开(公告)号：US20150108004A1
公开(公告)日：2015-04-23
申请号：US14587883
申请日：2014-12-31
Applicant: University of Southern California
Inventor： Adam L. Cohen
CPC classification number: C25D5/10 , B33Y10/00 , B33Y70/00 , B81C1/00126 , B81C2201/0181 , B81C2201/0197 , B81C2201/032 , C25D1/00 , C25D1/003 , C25D5/022 , C25D5/12 , C25D5/22 , C25D17/06 , H01L21/2885 , H05K3/241 , Y10T428/12486 , Y10T428/239
Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.
Abstract translation: 一种电镀方法，包括：a）使第一衬底与第一制品接触，所述第一制品包括衬底和以衬底形式设置的贴合掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述第一基板上，所述第一图案对应于所述适形掩模图案的所述补体; 和c）从第一基板上去除第一制品。 还公开了电镀制品和电镀装置。
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65.发明申请In-situ Compressed Specimen for Evaluating Mechanical Property of Copper Interconnection Micro Column and Preparation Method thereof 审中-公开用于评估铜互连微柱的机械性能的原位压缩试样及其制备方法公开(公告)号：US20140242407A1
公开(公告)日：2014-08-28
申请号：US14345392
申请日：2013-03-25
Applicant: Hong Wang , Zhaoyu Wang , Ping Cheng , Guifu Ding , Ting Gu , Huiying Wang , Congchun Zhang
Inventor： Hong Wang , Zhaoyu Wang , Ping Cheng , Guifu Ding , Ting Gu , Huiying Wang , Congchun Zhang
IPC: B81C1/00
CPC classification number: B81C1/00111 , B81C2201/032 , G01N3/08 , G01N2203/0298 , Y10T428/12389
Abstract: An in-situ compressed specimen of copper interconnection micro column, which is a circular metal column formed in a PDMS hole, includes: a specimen part and a fixed end part for fixing the specimen; wherein the fixed end part is a circular or square plate structure, the specimen part is an upper part of the fixed end part; a main body of the present invention is of micron order, a forced direction of the specimen is consistent with a growth direction of the metal column. A method of electroplating copper column by adopting PDMS as template substrate is applied to overcome a problem that TSV is corrosive to the copper column during a silicon etching process so as to affect a mechanical property accuracy test, the method is advanced in shortening test process period, achieving good reproducibility and high yield.
Abstract translation: 在PDMS孔中形成的圆形金属柱的铜互连微柱的原位压缩样品包括：样品部分和用于固定样品的固定端部; 所述固定端部为圆形或方形板状结构，所述检体部为所述固定端部的上部; 本发明的主体是微米级的，试样的强制方向与金属柱的生长方向一致。 应用PDMS作为模板基板电镀铜柱的方法，以克服在硅蚀刻过程中TSV对铜柱腐蚀的问题，从而影响机械性能精度试验，该方法在缩短试验过程周期 ，实现良好的再现性和高产量。
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Patent Agency Ranking
公开(公告)号：US08551315B2
公开(公告)日：2013-10-08
申请号：US13441573
申请日：2012-04-06
Applicant: Adam L. Cohen
Inventor： Adam L. Cohen
CPC classification number: C25D5/10 , B33Y10/00 , B33Y70/00 , B81C1/00126 , B81C2201/0181 , B81C2201/0197 , B81C2201/032 , C25D1/00 , C25D1/003 , C25D5/022 , C25D5/12 , C25D5/22 , C25D17/06 , H01L21/2885 , H05K3/241 , Y10T428/12486 , Y10T428/239
Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.
Abstract translation: 一种电镀方法，包括：a）使第一衬底与第一制品接触，所述第一制品包括衬底和以衬底形式设置的贴合掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述第一基板上，所述第一图案对应于所述适形掩模图案的所述补体; 和c）从第一基板上去除第一制品。 还公开了电镀制品和电镀装置。
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67.发明申请公开(公告)号：US20110303546A1
公开(公告)日：2011-12-15
申请号：US13212636
申请日：2011-08-18
Applicant: Clément SAUCY
Inventor： Clément SAUCY
CPC classification number: C25D1/003 , B81B2201/035 , B81C99/0085 , B81C2201/032 , C25D1/20 , G03F7/00
Abstract: The invention relates to a process for fabricating a monolayer or multilayer metal structure in LIGA technology, in which a photoresist layer is deposited on a flat metal substrate, a photoresist mold is created by irradiation or electron or ion bombardment, a metal or alloy is electroplated in this mold, the electroformed metal structure is detached from the substrate and the photoresist is separated from this metal structure, wherein the metal substrate is used as an agent involved in the forming of at least one surface of the metal structure other than that formed by the plane surface of the substrate.
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68.发明授权Process for fabricating a monolayer or multilayer metal structure in LIGA technology, and structure obtained 有权在LIGA技术中制造单层或多层金属结构的方法和获得的结构公开(公告)号：US08025782B2
公开(公告)日：2011-09-27
申请号：US11717773
申请日：2007-03-14
Applicant: Clément Saucy
Inventor： Clément Saucy
IPC: C25D1/00
CPC classification number: C25D1/003 , B81B2201/035 , B81C99/0085 , B81C2201/032 , C25D1/20 , G03F7/00
Abstract: The invention relates to a process for fabricating a monolayer or multilayer metal structure in LIGA technology, in which a photoresist layer is deposited on a flat metal substrate, a photoresist mold is created by irradiation or electron or ion bombardment, a metal or alloy is electroplated in this mold, the electroformed metal structure is detached from the substrate and the photoresist is separated from this metal structure, wherein the metal substrate is used as an agent involved in the forming of at least one surface of the metal structure other than that formed by the plane surface of the substrate.
Abstract translation: 本发明涉及一种在LIGA技术中制造单层或多层金属结构的方法，其中光致抗蚀剂层沉积在平坦的金属基底上，通过照射或电子或离子轰击产生光致抗蚀剂模具，电镀金属或合金 在该模具中，电铸金属结构与基板分离，并且光致抗蚀剂与该金属结构分离，其中金属基板用作形成金属结构的至少一个表面的试剂，而不是由 基板的平面。
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69.发明申请PROCESS FOR FABRICATING A MONOLAYER OR MULTILAYER METAL STRUCTURE IN LIGA TECHNOLOGY, AND STRUCTURE OBTAINED 有权在LIGA技术中制造单层或多层金属结构的方法和获得的结构公开(公告)号：US20110062112A1
公开(公告)日：2011-03-17
申请号：US12952825
申请日：2010-11-23
Applicant: Clément SAUCY
Inventor： Clément SAUCY
CPC classification number: C25D1/003 , B81B2201/035 , B81C99/0085 , B81C2201/032 , C25D1/20 , G03F7/00
Abstract: The invention relates to a process for fabricating a monolayer or multilayer metal structure in LIGA technology, in which a photoresist layer is deposited on a flat metal substrate, a photoresist mold is created by irradiation or electron or ion bombardment, a metal or alloy is electroplated in this mold, the electroformed metal structure is detached from the substrate and the photoresist is separated from this metal structure, wherein the metal substrate is used as an agent involved in the forming of at least one surface of the metal structure other than that formed by the plane surface of the substrate.
Abstract translation: 本发明涉及一种在LIGA技术中制造单层或多层金属结构的方法，其中光致抗蚀剂层沉积在平坦的金属基底上，通过照射或电子或离子轰击产生光致抗蚀剂模具，电镀金属或合金 在该模具中，电铸金属结构与基板分离，并且光致抗蚀剂与该金属结构分离，其中金属基板用作形成金属结构的至少一个表面的试剂，而不是由 基板的平面。
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公开(公告)号：US20100193366A1
公开(公告)日：2010-08-05
申请号：US12698026
申请日：2010-02-01
Applicant: Adam L. Cohen
Inventor： Adam L. Cohen
CPC classification number: C25D5/10 , B33Y10/00 , B33Y70/00 , B81C1/00126 , B81C2201/0181 , B81C2201/0197 , B81C2201/032 , C25D1/00 , C25D1/003 , C25D5/022 , C25D5/12 , C25D5/22 , C25D17/06 , H01L21/2885 , H05K3/241 , Y10T428/12486 , Y10T428/239
Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.
Abstract translation: 一种电镀方法，包括：a）使第一衬底与第一制品接触，所述第一制品包括衬底和以衬底形式设置的贴合掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述第一基板上，所述第一图案对应于所述适形掩模图案的所述补体; 和c）从第一基板上去除第一制品。 还公开了电镀制品和电镀装置。
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