摘要:
A method, system, and computer program product for integrated circuit wafer and die testing. The method commences by selecting areas of interest accessible from a backside of an integrated circuit where the areas of interest correspond to electronic devices (e.g., gates or transistors or vias or pads). Then, using a small-beam light source such as a laser, illuminating the areas of interest and collecting the reflected signal returned from illuminated areas of interest. A processor analyses the reflected signal to determine logic states and timing information of the electronic devices and compares the determined logic states and timing information to a pre-determined logic pattern to identify one or more errors as observed from the actual electronic devices. Specific points within an area of interest are determined from CAD layout data, and the pre-determined logic patterns can be retrieved from CAD simulation data.
摘要:
Circuits are provided for modeling and characterizing the switching of magnetic tunnel junctions (MTJ) elements. More specifically, ring oscillators loaded with MTJ elements are used to characterize magnetic tunnel junction (MTJ) element performance. The circuits can include a ring oscillator (RO) having an odd number of inverters connected in series with a magnetic tunnel junction (MTJ) element inserted between each inverter. In some embodiments, the magnetic tunnel junction (MTJ) elements are arranged to act as a load to the inverters. The circuits optionally include one or more of a time to amplitude converter, a pulse distribution analyzer and/or PFET(s) and NFET(s). Methods of characterizing the switching characteristics of MTJ elements are also provided herein. Such MTJ elements can be suitable for use in magnetoresistive random access memory (MRAM) devices. Methods of making the ring oscillator are further provided herein.
摘要:
A computer system may determine a first set of output values for a set of test paths at a first time. Each output value may correspond to a test path in the set of test paths. The computer system may then determine a second set of output values at a second time. Each output value in the second set of output values may have an associated output value in the first set of output values. The computer system may then determine whether degradation of the semiconductor chip has occurred by comparing the first set of output values to the second set of output values.
摘要:
A monolithic stacked integrated circuit (IC) is provided with a known-good-layer (KGL) path delay test circuit and at least a portion of a critical path in one of its layers. The test circuit includes a plurality of inputs, outputs, a flip-flop coupled to the at least a portion of the critical path and a multiplexer coupled to the flip-flop and to a second layer of the IC. The test circuit further includes a control element such that path delay testing of the IC may be conducted on a layer-by-layer basis.
摘要:
A delay measurement technique using a tapped delay line edge capture circuit that captures tap position of edges within the delay line provides accuracy of measurement to one pico-second and below. A control circuit causes latches to capture an edge of a signal delayed through the delay line at taps of the delay line. The frequency of a clock from which the signal is derived is adjusted and tap outputs are captured by latches and averaged. A first frequency is found at which the average edge position is midway between two adjacent tap positions. A second signal, which may be the reference signal that clocks the latches, is propagated through the delay line and a second frequency is found for which the average edge position lies at the boundary between the two tap positions. The delay is determined from the difference between the periods of the first frequency and the second frequency.
摘要:
A delay circuit contains a first inversion circuit including a pull-up circuit and a pull-down circuit, and a second inversion circuit including a pull-up circuit and a pull-down circuit. The delay circuit further contains a first pass transistor connected in series to the pull-up circuit in the first inversion circuit between a power supply potential and an output node, a second pass transistor connected in series to the pull-down circuit in the first inversion circuit between a ground potential and the output node, a third pass transistor connected in series between the input node and the pull-up circuit in the second inversion circuit, and a fourth pass transistor connected in series between the input node and the pull-down circuit in the second inversion circuit. A delay characteristic of the delay circuit is changed by a combination of control signals applied to gates of the pass transistors.
摘要:
A test controller controlled by a design entity sends at least one closed type command of a closed loop architecture test flow to an arbiter of a vendor test platform controlled by a vendor entity, wherein the test controller controls nondeterministic testing on a protected integrated circuit (IC) integrated into an electronic assembly, as performed by test equipment hardware within the vendor test platform, without the design entity disclosing an underlying design of the protected IC to the vendor entity. In response to the test controller receiving at least one response of the at least one closed type command, from the arbiter interface passing the at least one closed type command directly through the test equipment hardware to the protected IC, determining, by the test controller, based on the at least one response, a next at least one closed type command of the closed loop architecture test flow to send to the arbiter.
摘要:
An aging monitor circuit that provides a more accurate estimate of aging and/or delay in a circuit and/or circuit path. The aging monitor circuit employs a separate aging path with driving and receiving flip flops (FFs) and a tunable replica circuit (TRC) to enable measurements of single-transition DC-stressed path delay that only propagates through stressed transistors or other circuit element(s). A finite state machine (FSM) in the aging monitor circuit is configured to adjust a frequency of a clock signal output by a digitally controlled oscillator (DCO) in response to an error signal output by the receiving FF. The error signal is generated in response to single-transition DC-stressed path delay; and therefore enables the adjustment of the frequency of the dock signal to correspond to an amount or effect of the delay.
摘要:
A semiconductor IC device comprises a timing circuit to transfer a timing signal, the timing circuit being configured to receive a first test signal and to effect a delay in the timing signal in response to the first test signal, the first test signal including a first timing event. The semiconductor IC device further comprises an interface circuit configured to transfer the data signal in response to the timing signal, the interface circuit being further configured to receive a second test signal and to effect a delay in the data signal in response to the second test signal, the second test signal including a second timing event that is related to the first timing event according to a test criterion.
摘要:
Screening a batch of integrated circuits (IC) may be done with test patterns provided in a sequence of test vectors. The sequence of test vectors may be fetched from a memory coupled to a tester and then one or more bits from each test vector may be provided to the tester. A test pattern is formed by updating a latch in a periodic manner with a bit value from a same bit position from each of the sequence of test vectors. The test pattern may then be applied to an input pin of a device under test and a resulting signal may be monitored on an output pin of each one of the batch of ICs. A slow speed ICs may be screened by treating each IC that passes both a fast pattern test and a slow speed pattern test as a failure, for example.