摘要:
Apparatus for protecting electronic components and equipment and method of manufacturing the apparatus. A transient protection device capable of mounting onto a circuit board. The transient protection device includes first and second conductive paths. The first conductive path lies in a first plane and the second conductive path lies in a second plane spaced apart from the first plane. Furthermore, a dielectric material lies in a third plane disposed between the first and the second plane. A ground plane is coupled with said first conductive path to discharge an electrical surge.
摘要:
A high-energy pulse protection device (10) protects an integrated circuit (28 and 30). The integrated circuit (28 and 30) is associated with an integrated circuit substrate region (64). The high-energy pulse protection device (10), has a protection circuit substrate region (74) that is disassociated from the integrated circuit substrate region (64). A primary protection circuit (40 and 42) is associated with the protection circuit substrate region (74) and has at least one connection (22) with the integrated circuit (28 and 30) for receiving and dissipating, through the at least one connection (22), a high-energy pulse. This protects the integrated circuit (28 and 30) from the high-energy pulse.
摘要:
Overvoltage protection circuits include a pass transistor having first and second current carrying terminals electrically connected to an input signal line and an output signal line, respectively, and a voltage clamping circuit. The voltage clamping circuit is electrically connected to a power supply line and a gate of the pass-transistor and dynamically clamps a capacitively bootstrapped voltage at a gate of the pass transistor within a first range so that the output voltage as well as the magnitudes of all gate-to-source, gate-to-drain and drain-to-source voltages across the pass transistor and all transistors within the voltage clamping circuit do not exceed a level in excess of about Vdd when Vin=2Vdd, where Vin equals a voltage of an input signal applied to the input signal line and Vdd equals a power supply voltage on the power supply line.
摘要:
An electrostatic discharge (ESD) protection circuit in a semiconductor integrated circuit (IC) having protected circuitry. In one embodiment, the ESD protection circuit includes a pad, adapted for connection to a protected circuit node of the IC, and an ESD protection device, which is coupled between the pad and ground. A diode turn-on device is coupled in a forward conduction direction from the pad to a first gate of the ESD protection device. In a second embodiment, the ESD protection circuit is an SCR having an anode coupled to a first voltage supply line, and a cathode coupled to ground. A parasitic capacitance is coupled between each the voltage supply line and the grounded cathode.
摘要:
A method and apparatus for fault condition protection for a lighting control circuit is presented. The method consists of a hybrid software and hardware solution to take advantage of the useful attributes of both. In the event of a fault condition being detected the software set driving signals to the light are rapidly blocked via hardware. In the event the fault condition persists, software modifies the driving signals to the light.
摘要:
A power supply rejection circuit and method thereof for capacitively-stored reference voltages is disclosed. The power supply rejection circuit generally comprises a comparison circuit for comparing a signal associated with a power supply such as, for example, a Wheatstone bridge configuration, to a stored reference voltage, such that the comparison circuit includes at least one existing capacitor therein. At least one additional capacitor can be then coupled to the comparison circuit, such that the additional capacitor creates a capacitively-coupled voltage divider. This capacitively-coupled voltage divider negates the first order effects of power supply noise in the system. This effect significantly reduces the effect of power supply noise and improves signal jitter associated with the comparison circuit during a comparison of the signal to the stored reference voltage utilizing the comparison circuit.
摘要:
Electrostatic Discharge (ESD) protection scheme includes a divided rail structure to route damaging ESD away from sensitive circuitry. Specifically, Vdd and Vss rails are divided to segregate the ESD current within a circuit, thus isolating the sensitive circuitry from ESD exposure. In an exemplary embodiment, Vdd is divided into Vdd-esd and Vdd core, while Vss is divided into Vss-esd and Vss core. The structure in cooperation with diodes, clamps and resistors enables to isolate the rails (Vdd core and Vss core) associated with sensitive circuitry from ESD current.
摘要:
An ESD protection circuit includes a SCR and a switching means, such as a MOS transistor connected to the SCR so that the SCR is turned on by the switching means to allow an ESD pulse to pass from a Pad line to a grounded VSS line and thereby dissipate the ESD pulse. The SCR is connected between the Pad line and the VSS line. One MOS switching means is connected between the Pad line and the SCR and has a gate which is connected to a VDD line which maintains the switch in open condition during normal VDD bias conditions. An ESD pulse applied to the Pad line, the switch is preconditioned in ON mode allowing the SCR to be predisposed to conduction to allow the ESD pulse to flow to the VSS line.
摘要:
A protection device includes a substrate capable of suppressing electromagnetic fields, with a channel formed therein, a current dependent circuit interrupter disposed inside the channel, and voltage management circuitry coupled to the substrate. The voltage management circuitry is electrically coupled to the current dependent circuit interrupter so as to form a crowbar circuit in the presence of overvoltage or undervoltage conditions as determined according to a reference voltage.
摘要:
An integrated circuit that includes I/O circuitry that may or may not be protected from ESD damage. The protection from ESD damage may be selectively deactivated or activated or may not be present at all in one or more of the I/O circuits. In use, the integrated circuit may be coupled to another integrated circuit to form a multi-chip module where the ESD protection for the I/O circuitry between the modules is deactivated or not present. This is advantageous because the likelihood of ESD damage to this I/O circuitry is reduced once the multi-chip module is formed. It is to be understood that both the foregoing general description and the following detailed description are exemplary, but are not restrictive, of the invention.