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312 条记录 (耗时 0.028 秒)

    Method for Improving Copper Alloy Electroplating Filling Process
    61.
    发明公开
    Method for Improving Copper Alloy Electroplating Filling Process 审中-公开

    公开(公告)号：US20240060205A1

    公开(公告)日：2024-02-22

    申请号：US18125908

    申请日：2023-03-24

    申请人： Shanghai Huali Integrated Circuit Corporation

    发明人： Yu Bao

    IPC分类号： C25D5/02 ,  C25D7/12 ,  C25D3/38 ,  C25D3/58 ,  C25D21/14 ,  H01L21/768

    CPC分类号： C25D5/02 ,  C25D7/123 ,  C25D3/38 ,  C25D3/58 ,  C25D21/14 ,  H01L21/76873 ,  H01L21/76879 ,  H01L21/76883

    摘要： The present application provides a method for improving a copper alloy electroplating filling process, forming a groove on a semiconductor structure; forming a barrier layer on the surface of the groove, and then covering the barrier layer with a seed layer; electroplating the seed layer in the groove with copper, until an upper surface of the copper in the groove is close to an opening of the groove; adding impurity metal ions into an electroplating solution for copper electroplating to continue the electroplating, wherein during an electroplating process, the impurity metal ions are fully consumed quickly, forming an alloy layer on the surface of the copper; continuing the copper electroplating on the alloy layer in the groove; repeating steps 4 and 5 until the groove is fully filled; and performing chemical mechanical polishing, the polishing ending at the opening of the groove.

    CLADDED METAL INTERCONNECTS
    64.
    发明申请
    CLADDED METAL INTERCONNECTS 审中-公开

    公开(公告)号：US20200098619A1

    公开(公告)日：2020-03-26

    申请号：US16141522

    申请日：2018-09-25

    申请人： INTEL CORPORATION

    发明人： Thomas Marieb ,  Zhiyong Ma ,  Miriam R. Reshotko ,  Christopher Jezewski ,  Flavio Griggio ,  Rahim Kasim ,  Nikholas G. Toledo

    IPC分类号： H01L21/768 ,  H01L23/532 ,  C23C18/48 ,  C25D3/58

    摘要： Techniques are disclosed for providing cladded metal interconnects. Given an interconnect trench, a barrier layer is conformally deposited onto the bottom and sidewalls of the trench. A first layer of a bilayer adhesion liner is selectively deposited on the barrier layer, and a second layer of the bilayer adhesion liner is selectively deposited on the first layer. An interconnect metal is deposited into the trench above the bilayer adhesion liner. Any excess interconnect metal is recessed to get the top surface of the interconnect metal to a proper plane. Recessing the excess interconnect metal may include recessing previously deposited excess adhesion liner and barrier layer materials. The exposed top surface of the interconnect metal in the trench is then capped with the bilayer adhesion liner materials to provide a cladded metal interconnect core. In some embodiments, the adhesion liner is a single layer adhesion liner.

    Copper foil for printed circuit
    67.
    发明授权
    Copper foil for printed circuit 有权

    公开(公告)号：US10472728B2

    公开(公告)日：2019-11-12

    申请号：US15178620

    申请日：2016-06-10

    申请人： JX Nippon Mining & Metals Corporation

    发明人： Hideta Arai ,  Atsushi Miki

    IPC分类号： C23C28/00 ,  C25D15/00 ,  C25D7/06 ,  C25D5/10 ,  C25D5/12 ,  H05K3/38 ,  C25D5/16 ,  H05K1/09 ,  H05K3/20 ,  C25D1/04 ,  C25D3/38 ,  C25D3/56 ,  C25D3/58 ,  C25D9/04

    摘要： A copper foil for printed circuits is prepared by forming a primary particle layer of copper on a surface of a copper foil, and then forming a secondary particle layer based on ternary alloy composed of copper, cobalt and nickel on the primary particle layer. The average particle size of the primary particle layer is 0.25 to 0.45 μm, and the average particle size of the secondary particles layer based on ternary alloy composed of copper, cobalt and nickel is 0.05 to 0.25 μm. Provided is a copper foil for printed circuits, in which powder fall from the copper foil can be reduced and the peeling strength and heat resistance can be improved by forming a primary particle layer of copper on a surface of a copper foil, and then forming a secondary particle layer based on copper-cobalt-nickel alloy plating on the primary particle layer.

    METAL WIRES, MANUFACTURING METHODS THEREFOR AND TIRES
    68.
    发明申请
    METAL WIRES, MANUFACTURING METHODS THEREFOR AND TIRES 审中-公开

    公开(公告)号：US20190338435A1

    公开(公告)日：2019-11-07

    申请号：US16462257

    申请日：2017-10-25

    申请人： Jiangsu Xingda Steel Tyre Cord Co., Ltd.

    发明人： Xiang LIU ,  Ziming HU ,  Haidong YAO

    IPC分类号： C25D5/50 ,  C21D9/52 ,  C21D8/06 ,  C22C9/04 ,  C25D7/06 ,  C23F17/00 ,  B29B15/08 ,  B60C9/00 ,  C25D5/12 ,  C25D3/58 ,  D07B1/06 ,  B21C37/04

    摘要： Disclosed are a metal wire, a manufacturing method therefor, and a tire. The metal wire is made by twisting a filament; an outer peripheral surface of the filament is covered with a Cu—M—Zn alloy coating; the outer peripheral surface of the filament is also covered with a Cu—Zn alloy coating; the metal wire is made of at least one filament; an area covered by the Cu—M—Zn alloy coating is 10%-90% of an area of the outer peripheral surface of the filament, and the rest is the Cu—Zn alloy coating; M in the Cu—M—Zn alloy coating is selected from one or two of Co, Ni, Mn, or Mo; the mass fraction of Cu in the Cu—M—Zn alloy coating is 58%-72%, the mass fraction of M in the Cu—M—Zn alloy coating is 0.5%-5%, and the balance in the Cu—M—Zn alloy coating is Zn and inevitable impurities.

    Surface-treated copper foil
    69.
    发明授权
    Surface-treated copper foil 有权

    公开(公告)号：US10383222B2

    公开(公告)日：2019-08-13

    申请号：US15398126

    申请日：2017-01-04

    申请人： JX Nippon Mining & Metals Corporation

    发明人： Atsushi Miki ,  Ryo Fukuchi ,  Hideta Arai

    IPC分类号： H05K1/09 ,  C22C9/00 ,  C22C30/02 ,  C25F1/00 ,  C25D3/38 ,  C25D3/12 ,  C25D11/38 ,  C25D7/06 ,  C22F1/08 ,  H05K3/38 ,  C25D5/12 ,  C25D3/56 ,  C25D3/58

    摘要： To provide a surface-treated copper foil that is excellent in adhesiveness to an insulating substrate at ordinary temperature, and is capable of suppressing the formation of blister on application of a thermal load of reflow soldering to a copper-clad laminate board constituted by the copper foil. A surface-treated copper foil having a surface-treated surface, the surface-treated copper foil satisfying one or more of the following conditions (1) to (3): by an XPS measurement at a depth after sputtering from the surface-treated surface for 0.5 min at a rate of 1.1 nm/min (SiO2 conversion), (1) the N concentration is from 1.5 to 7.5 atomic %; (2) the C concentration is from 12 to 30 atomic %; and (3) the Si concentration is 3.1 atomic % or more and the O concentration is from 40 to 48 atomic %.