Abstract:
An organic light emitting diode is provided. The organic light emitting diode includes a substrate, an electrode structure formed on said substrate, an organic layer formed on said electrode structure and a transparent electrode structure having at least one transparent dielectric layer with a relatively higher refraction index and deposited on said organic layer by thermal evaporation.
Abstract:
A TFT array substrate and a process for manufacturing the same are provided. A plurality of TFTs in array are formed on a substrate. A gate insulating layer and a protection layer are sequentially formed to cover a pixel region of the substrate. A plurality of openings each of which has an undercut profile are formed in the gate insulating layer and the protection layer. Then, a transparent conductive layer is formed over the substrate. One of the two parts separated is located in a bottom of the opening and the other is on the protection layer, such that two parts of the transparent conductive layer disconnect and no junction there between occurs. The part of the transparent conductive layer in the bottom of the opening is referred to as a transparent pixel electrode. The part of the transparent conductive layer on the protection layer is connected to a common metal line to form a transparent common electrode. The transparent pixel electrode disconnects to but overlaps the protection layer.
Abstract:
A simplified tri-layer process for forming a thin film transistor matrix for a liquid crystal display is disclosed. By forming a pixel electrode layer before a gate metal layer, a remaining portion of the gate metal layer surrounding the pixel electrode can function as a black matrix after properly patterning and etching the gate metal layer. The in-situ black matrix exempts from an additional step of providing a black matrix and solves the problem in alignment.
Abstract:
A simplified tri-layer process for forming a thin film transistor matrix for a liquid crystal display is disclosed. By using a backside exposure technique, the masking step for patterning an etch stopper layer can be omitted. After forming an active region including a gate electrode and a scan line on the front side of a substrate, and sequentially applying an etch stopper layer and a photoresist layer over the resulting structure, the backside exposure is performed by exposing from the back side of the substrate. A portion of photoresist is shielded by the active region from exposure so that an etch stopper structure having a shape similar to the shape of the active region is formed without any photo-masking and lithographic procedure. Therefore, the above self-aligned effect allows one masking step to be reduced so as to simplify the process.
Abstract:
A method of fabricating a capacitor plate constitutes first providing a substrate. Then, first insulating layer is formed over the substrate. Sequentially, a buffering layer and a second insulating layer, both of which constitute a stacked structure, are formed over the first insulating layer. Next, the stacked structure is patterned into an opening thereby exposing a portion of the first insulating layer therethrough. Subsequently, conducting spacers are formed on the sidewalls of the opening. The second insulating layer is thereafter removed, and simultaneously a portion of the first insulating layer not covered by the buffering layer and the conducting spacers are removed to form a contact window, thereby exposing a portion of the substrate therethrough. Then, a conducting layer is conformably deposited over the substrate, and thereafter etched away until a portion of the buffering layer is exposed. Finally, the exposed buffering layer is removed. The remaining conducting layer and the conducting spacers constitute the capacitor's bottom electrode plate.
Abstract:
The present invention provides a method for fabricating a storage plate of a semiconductor capacitor. A conductive layer is first formed on a semiconductor substrate. A glue layer is formed on the conductive layer. A plurality of micro masking-balls are then spread onto the surface of the glue layer. Using these micro masking-balls as masks, the glue layer is etched to expose a portion surface of the conductive layer. Using the remaining glue layer as a mask, the conductive layer is etched to form a bristle-shaped conductive layer. After that, the glue layer and micro masking-balls are removed, thereby allowing the remaining bristle-shaped conductive layer to form a storage plate of a semiconductor capacitor.
Abstract:
A high performance thin film transistor structure which includes a pixel electrode layer formed after a passivation step such that electrical connections can be made to a source electrode and to overlap a channel length of the transistor. As a result, the effective channel length can be reduced and the occurrence of short-circuiting is also minimized in densely packed devices. The pixel electrode can be formed of a non-transparent metallic material to serve as a light shield such that the thin film transistor can be most suitably used in a liquid crystal display device.
Abstract:
A touch panel comprises: a first conductive plate including a first substrate having a surface, a first conductive layer disposed on the surface of the first substrate and exhibiting an anisotropic resistivity, and at least one conductive first connecting line, the surface of the first substrate having a peripheral edge, a sensing region covered by the first conductive layer, and a marginal region extending from the sensing region to the peripheral edge, the first connecting line being disposed on the marginal region; and a second conductive plate including a second substrate and a second conductive layer disposed on the second substrate, facing the first conductive layer, and exhibiting anisotropic resistivity. An electronic device including the touch panel is also disclosed.
Abstract:
A method for making a plurality of touch panels one time which includes the following steps. A substrate is provided. The substrate has a surface defining a plurality of target areas with each including a touch-view area and a trace area. An adhesive layer is formed on the surface of the substrate. The adhesive layer on the trace areas is solidified. A carbon nanotube layer is formed on the adhesive layer. The adhesive layer on the touch-view area is solidified. The carbon nanotube layer on the trace areas is removed to obtain a plurality of transparent conductive layers spaced from each other. An electrode and a conductive trace are formed on each target area. A plurality of touch panels is obtained by cutting the substrate.
Abstract:
The present disclosure relates to a method for making a plurality of touch panels one time. The method includes following steps. A substrate is provided. The substrate has a surface defining a number of target areas with each including two areas: a touch-view area and a trace area. An adhesive layer is formed on the surface of the substrate. A carbon nanotube film is formed on the adhesive layer. The adhesive layer is solidified. An electrode and a conductive trace are formed on each target area so that part of the carbon nanotube film is exposed from a space between adjacent conductive lines of the conductive trace to form an exposed carbon nanotube film on each trace area. The exposed carbon nanotube film on each trace area is removed to obtain a plurality of transparent conductive layers spaced from each other. A number of touch panels is obtained by cutting the substrate.