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    Digital camera module with small sized image sensor chip package
    71.
    发明授权
    Digital camera module with small sized image sensor chip package 有权
    数码相机模块具有小尺寸图像传感器芯片封装

    公开(公告)号：US07643081B2

    公开(公告)日：2010-01-05

    申请号：US11402467

    申请日：2006-04-12

    Applicant: Steven Webster ,  Ying-Cheng Wu ,  Po-Chih Hsu ,  Kun-Hsieh Liu

    Inventor： Steven Webster ,  Ying-Cheng Wu ,  Po-Chih Hsu ,  Kun-Hsieh Liu

    IPC: H04N5/225

    CPC classification number: H04N5/2253 ,  H04N5/2254

    Abstract: A digital camera module (200) includes a lens holder (20), a lens module (30) received in the lens holder, and an image sensor chip package (40) mounted to the lens holder. The lens module includes a lens barrel (301) movably engaged in the lens holder and at least one lens (302) received in the lens barrel. The image sensor chip package includes a base (401), an image sensor chip (402) mounted on the base, a transparent cover (405), and an adhesive (50) positioning the transparent cover with respect to the image sensor chip. The adhesive and the transparent cover cooperatively seal the image sensor chip therein.

    Abstract translation: 数码相机模块（200）包括透镜保持器（20），容纳在透镜保持器中的透镜模块（30）和安装到透镜保持器的图像传感器芯片封装（40）。 透镜模块包括可移动地接合在透镜保持器中的透镜镜筒（301）和容纳在镜筒中的至少一个透镜（302）。 图像传感器芯片封装包括基座（401），安装在基座上的图像传感器芯片（402），透明盖（405）和相对于图像传感器芯片定位透明盖的粘合剂（50）。 粘合剂和透明盖协同地将图像传感器芯片密封在其中。

    Image sensor chip packaging method
    72.
    发明授权
    Image sensor chip packaging method 有权
    图像传感器芯片封装方法

    公开(公告)号：US07595839B2

    公开(公告)日：2009-09-29

    申请号：US11595331

    申请日：2006-11-10

    Applicant: Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

    Inventor： Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

    IPC: H04N5/225

    CPC classification number: H04N5/2254 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2924/01079 ,  H01L2924/16195 ,  H04N5/2253 ,  H01L2924/00014

    Abstract: An image sensor chip packaging method includes: first, providing a carrier (20). The carrier includes a base (21) and a lead frame (23). The base has a chamber (214) defined therein. The lead frame has a plurality of conduction pieces (233). The conduction pieces of the lead frame are embedded in the base and are spaced from each other. An image sensor chip (30) is then mounted in the chamber. The image sensor has a photosensitive area (301) and a plurality of chip pads (302). A plurality of bonding wires (40) is then provided. Each wire electrically connects a corresponding chip pad of the image sensor chip and one of the exposed ends of a corresponding conduction piece of the carrier. A holder (50) having a holding cavity (54) is then provided. Finally, the carrier is then mounted in the holding cavity of the holder.

    Abstract translation: 图像传感器芯片封装方法包括：首先提供载体（20）。 载体包括基座（21）和引线框架（23）。 底座具有限定在其中的腔室（214）。 引线框架具有多个导电件（233）。 引线框架的导电片被嵌入在基座中并且彼此间隔开。 然后将图像传感器芯片（30）安装在腔室中。 图像传感器具有感光区域（301）和多个芯片焊盘（302）。 然后提供多个接合线（40）。 每根线将图像传感器芯片的相应的芯片焊盘和载体的相应导电片的暴露端之一电连接。 然后提供具有保持腔（54）的保持器（50）。 最后，将载体安装在支架的保持腔中。

    Image sensor chip package fabrication method
    73.
    发明授权
    Image sensor chip package fabrication method 有权
    图像传感器芯片封装制造方法

    公开(公告)号：US07592197B2

    公开(公告)日：2009-09-22

    申请号：US11453456

    申请日：2006-06-14

    Applicant: Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

    Inventor： Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

    IPC: H01L21/00

    CPC classification number: H01L27/14685 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014

    Abstract: An image sensor package method includes the steps of: first, providing a carrier (30), which includes a base (24) and a leadframe (320). The base has a cavity therein and the leadframe includes a number of conductive pieces; Second, mounting an image sensor chip on the base and received in the cavity, the image sensor having a photosensitive area. Third, providing a plurality of wires, each electrically connects the image sensor chip and a corresponding one of the conductive pieces of the carrier. Fourth, applying an adhesive means around the image sensor chip that at least partially covers all the wires. Finally, mounting a transparent cover on the carrier, where an adhesive means fixes the cover in place.

    Abstract translation: 图像传感器封装方法包括以下步骤：首先，提供包括基座（24）和引线框架（320）的载体（30）。 基座在其中具有空腔，引线框架包括多个导电件; 第二，将图像传感器芯片安装在基座上并被接纳在空腔中，图像传感器具有感光区域。 第三，提供多条导线，每个电线将图像传感器芯片和载体的相应导电片之一电连接。 第四，在图像传感器芯片周围施加至少部分地覆盖所有电线的粘合剂装置。 最后，将透明盖子安装在托架上，粘合剂将盖子固定在适当位置。

    IMAGING MODULE PACKAGE
    74.
    发明申请
    IMAGING MODULE PACKAGE 审中-公开
    成像模块包装

    公开(公告)号：US20090153706A1

    公开(公告)日：2009-06-18

    申请号：US12100297

    申请日：2008-04-09

    Applicant: STEVEN WEBSTER ,  YING-CHENG WU ,  SHUO-WEI HUANG ,  SHIH-MIN LO

    Inventor： STEVEN WEBSTER ,  YING-CHENG WU ,  SHUO-WEI HUANG ,  SHIH-MIN LO

    IPC: H04N5/335

    CPC classification number: H01L25/16 ,  H01L27/14618 ,  H01L27/14625 ,  H01L31/0232 ,  H01L2224/48091 ,  H01L2224/8592 ,  H04N5/2257 ,  H01L2924/00014

    Abstract: An imaging module package includes a substrate, an imaging sensor chip, a functional unit, a housing, and a lens module positioned in the housing. The substrate defines an upper chamber extending through a top surface thereof, and a lower chamber extending through a bottom surface thereof. The imaging sensor chip is positioned in the upper chamber and is electrically connected to the substrate. The functional unit is positioned in the lower chamber and is electrically connected to the substrate. The housing is mounted on the top surface of the substrate and is disposed above the imaging sensor chip.

    Abstract translation: 成像模块封装包括基板，成像传感器芯片，功能单元，壳体和位于壳体中的透镜模块。 衬底限定了通过其顶表面延伸的上室，以及延伸穿过其底表面的下室。 成像传感器芯片定位在上部腔室中并且电连接到衬底。 功能单元位于下腔室中，并与电极连接。 壳体安装在基板的顶表面上并且设置在成像传感器芯片的上方。

    DIGITAL CAMERA MODULE AND ASSEMBLING METHOD WITH SAME
    78.
    发明申请
    DIGITAL CAMERA MODULE AND ASSEMBLING METHOD WITH SAME 审中-公开
    数码相机模块及其组装方法

    公开(公告)号：US20080075456A1

    公开(公告)日：2008-03-27

    申请号：US11687142

    申请日：2007-03-16

    Applicant: STEVEN WEBSTER ,  YU-CHIEH CHENG

    Inventor： STEVEN WEBSTER ,  YU-CHIEH CHENG

    IPC: H04N1/46

    CPC classification number: H04N5/2252 ,  H01L2224/48091 ,  H04N5/2257 ,  H01L2924/00014

    Abstract: A portable electronic device (400) includes a housing (402) and a digital camera module (200). The housing has at least one arcuate housing surface section (4024) at one end thereof. The digital camera module is received in the housing proximate the one end thereof. The digital camera module includes at least one contact portion. Each contact portion has an arcuate contact surface (6400), and each such contact portion tightly engages a corresponding arcuate housing surface section. Owing to the tight engagement of such arcuate surfaces, the top surface of the digital camera module may fit closely against the housing so as to more fully use the space in the portable electronic device. This would help satisfy the miniaturization requirement of the portable electronic device.

    Abstract translation: 便携式电子设备（400）包括壳体（402）和数字照相机模块（200）。 壳体在其一端具有至少一个弧形的壳体表面部分（4024）。 数码相机模块被接收在靠近其一端的壳体中。 数字照相机模块包括至少一个接触部分。 每个接触部分具有弓形接触表面（6400），并且每个这样的接触部分紧密地接合相应的弧形壳体表面部分。 由于这种弧形表面的紧密接合，数字照相机模块的顶表面可以紧密地配合在壳体上，以便更充分地使用便携式电子设备中的空间。 这将有助于满足便携式电子设备的小型化要求。

    Testing system for digital camera modules
    80.
    发明申请
    Testing system for digital camera modules 失效
    数码相机模块测试系统

    公开(公告)号：US20070146486A1

    公开(公告)日：2007-06-28

    申请号：US11592768

    申请日：2006-11-03

    Applicant: Steven Webster ,  Ying-Cheng Wu ,  Yuan-Po Wang

    Inventor： Steven Webster ,  Ying-Cheng Wu ,  Yuan-Po Wang

    IPC: H04N17/00

    CPC classification number: H04N17/002

    Abstract: A testing system (200) for digital camera modules (100) includes a first testing module (50), an assembling mechanism (60), a focusing module (62), a second testing module (70), a carrying mechanism (80), and a main processor (90). The carrying mechanism supports and transports subassemblies of the digital camera modules and the digital camera modules between the first testing module, the assembling mechanism, the focusing module and the second testing module. The first testing module, the assembling mechanism, the focusing module, the carrying mechanism, and the second testing module are all electronically connected with the main processor.

    Abstract translation: 一种用于数字照相机模块（100）的测试系统（200）包括第一测试模块（50），组装机构（60），聚焦模块（62），第二测试模块（70） ，以及主处理器（90）。 携带机构在第一测试模块，组装机构，聚焦模块和第二测试模块之间支撑和传送数字照相机模块和数字照相机模块的子组件。 第一测试模块，组装机构，聚焦模块，承载机构和第二测试模块都与主处理器电连接。

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