中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

112 records (took 0.033 seconds)

    FOURIER FILTERING OF SPECTRAL DATA FOR MEASURING LAYER THICKNESS DURING SUBSTRATE PROCESSING
    74.
    发明申请
    FOURIER FILTERING OF SPECTRAL DATA FOR MEASURING LAYER THICKNESS DURING SUBSTRATE PROCESSING 有权

    公开(公告)号：US20220371152A1

    公开(公告)日：2022-11-24

    申请号：US17325364

    申请日：2021-05-20

    Applicant: Applied Materials, Inc.

    Inventor： Benjamin Cherian ,  Dominic J. Benvegnu ,  Harry Q. Lee

    IPC: B24B37/013 ,  H01L21/66 ,  H01L21/321 ,  H03H17/02

    Abstract: Determining a thickness of a layer on a wafer during a semiconductor process may include executing the process on the layer on the wafer; monitoring the wafer during the process with an in-situ spectrographic monitoring system to generate spectral data reflected from the wafer; applying a bandpass filter operation to the spectral data to generate filtered spectral data, where the bandpass filter may be configured to pass a frequency range corresponding to the layer on the wafer; and matching the filtered spectral data to a reference filtered spectral data, where the reference filtered spectral data may have been filtered using the bandpass filter operation, and the reference filtered spectral data may be associated with a thickness of the layer.

    PIXEL CLASSIFICATION OF FILM NON-UNIFORMITY BASED ON PROCESSING OF SUBSTRATE IMAGES
    75.
    发明申请
    PIXEL CLASSIFICATION OF FILM NON-UNIFORMITY BASED ON PROCESSING OF SUBSTRATE IMAGES 有权

    公开(公告)号：US20220285227A1

    公开(公告)日：2022-09-08

    申请号：US17680165

    申请日：2022-02-24

    Applicant: Applied Materials, Inc.

    Inventor： Dominic J. Benvegnu ,  Nojan Motamedi

    IPC: H01L21/66 ,  H01L21/306 ,  G01N21/95 ,  G06T7/00 ,  G06T7/10

    Abstract: A method of classification of a film non-uniformity on a substrate includes obtaining a color image of a substrate with the color image comprising a plurality of color channels, obtaining a standard color for the color image of the substrate, for each respective pixel along a path in the color image determining a difference vector between the a color of the respective pixel and the standard color to generate a sequence of difference vectors, and sorting the pixels along the path into a plurality of regions including at least one normal region and at least one abnormal region based on the sequence of difference vectors, including comparing a multiplicity of the difference vectors in the sequence to a threshold.

    IMAGING FOR MONITORING THICKNESS IN A SUBSTRATE CLEANING SYSTEM
    76.
    发明申请
    IMAGING FOR MONITORING THICKNESS IN A SUBSTRATE CLEANING SYSTEM 有权

    公开(公告)号：US20220270889A1

    公开(公告)日：2022-08-25

    申请号：US17185876

    申请日：2021-02-25

    Applicant: Applied Materials, Inc.

    Inventor： Dominic J. Benvegnu ,  Jun Qian ,  Boguslaw A. Swedek ,  Thomas H. Osterheld

    IPC: H01L21/321 ,  B24B37/005 ,  B08B7/00

    Abstract: A substrate cleaning system includes a cleaner module to clean a substrate after polishing of the substrate, a drier module to dry the substrate after cleaning by the cleaner module, a substrate support movable along a first axis from a first position in the drier module to a second position outside the drier module, and an in-line metrology station including a line-scan camera positioned to scan the substrate as the substrate is held by the substrate support and the substrate support is between the first position to the second position. The first axis is substantially parallel to a face of the substrate as held in by the substrate support.

    SYSTEM USING FILM THICKNESS ESTIMATION FROM MACHINE LEARNING BASED PROCESSING OF SUBSTRATE IMAGES
    77.
    发明申请
    SYSTEM USING FILM THICKNESS ESTIMATION FROM MACHINE LEARNING BASED PROCESSING OF SUBSTRATE IMAGES 有权

    公开(公告)号：US20210407066A1

    公开(公告)日：2021-12-30

    申请号：US17359345

    申请日：2021-06-25

    Applicant: Applied Materials, Inc.

    Inventor： Sivakumar Dhandapani ,  Arash Alahgholipouromrani ,  Dominic J. Benvegnu ,  Jun Qian ,  Kiran Lall Shrestha

    IPC: G06T7/00 ,  G06T7/60 ,  B24B37/013

    Abstract: A neural network is trained for use in a substrate thickness measurement system by obtaining ground truth thickness measurements of a top layer of a calibration substrate at a plurality of locations, each location at a defined position for a die being fabricated on the substrate. A plurality of color images of the calibration substrate are obtained, each color image corresponding to a region for a die being fabricated on the substrate. A neural network is trained to convert color images of die regions from an in-line substrate imager to thickness measurements for the top layer in the die region. The training is performed using training data that includes the plurality of color images and ground truth thickness measurements with each respective color image paired with a ground truth thickness measurement for the die region associated with the respective color image.

    Thickness measurement of substrate using color metrology
    78.
    发明授权
    Thickness measurement of substrate using color metrology 有权

    公开(公告)号：US11100628B2

    公开(公告)日：2021-08-24

    申请号：US16414709

    申请日：2019-05-16

    Applicant: Applied Materials, Inc.

    Inventor： Nojan Motamedi ,  Dominic J. Benvegnu ,  Boguslaw A. Swedek ,  Martin A. Josefowicz

    IPC: G06T7/00 ,  G06T5/00 ,  H01L21/67 ,  G01B11/06

    Abstract: A layer thickness measurement system includes a support to hold a substrate, an optical sensor to capture a color image of at least a portion of the substrate, and a controller. The controller is configured to receive the color image from the optical sensor, store a function that provides a value representative of a thickness as a function of position along a predetermined path in a coordinate space of at least two dimensions including a first color channel and a second color channel, for a pixel of the color image determine a coordinate of the pixel in the coordinate space from color data in the color image, determine a position of a point on the predetermined path that is closest to the coordinate, and calculate a value representative of a thickness from the function and the position of the point on the predetermined path.

    THICKNESS MEASUREMENT OF SUBSTRATE USING COLOR METROLOGY
    79.
    发明申请
    THICKNESS MEASUREMENT OF SUBSTRATE USING COLOR METROLOGY 有权

    公开(公告)号：US20210248730A1

    公开(公告)日：2021-08-12

    申请号：US17242158

    申请日：2021-04-27

    Applicant: Applied Materials, Inc.

    Inventor： Dominic J. Benvegnu

    IPC: G06T7/00 ,  G06T7/90 ,  B24B37/013 ,  H01L21/67 ,  H04N5/225 ,  H01L21/677 ,  H04N9/07

    Abstract: A metrology system for obtaining a measurement representative of a thickness of a layer on a substrate includes a camera positioned to capture a color image of at least a portion of the substrate. A controller is configured to receive the color image from the camera, store a predetermined path in a coordinate space of at least two dimension including a first color channel and a second color channel, store a function that provides a value representative of a thickness as a function of a position on the predetermined path, determine a coordinate of a pixel in the coordinate space from color data in the color image for the pixel, determine a position of a point on the predetermined path that is closest to the coordinate of the pixel, and calculate a value representative of a thickness from the function and the position of the point on the predetermined path.

Patent Agency Ranking