公开(公告)号：US20130242287A1

公开(公告)日：2013-09-19

申请号：US13421194

申请日：2012-03-15

申请人： Asaf Schlezinger ,  Amir Al-Bayati

发明人： Asaf Schlezinger ,  Amir Al-Bayati

IPC分类号： G01N21/59 ,  G01N21/55

CPC分类号： G01N21/59

摘要： Provided are methods and apparatus for determining the crystal fraction of a casted-mono silicon wafer. A light source is directed at the wafer and the transmission or reflection is measured by a detector. An image of the wafer is generated by a processor and the crystal fraction is calculated from the generated image. The crystal fraction is correlated to the efficiency of the solar cell produced, allowing for the rejection of inferior wafers prior to processing.

摘要翻译： 提供了用于确定铸造单晶硅晶片的晶体分数的方法和装置。 光源指向晶片，透射或反射由检测器测量。 由处理器生成晶片的图像，并根据所生成的图像计算晶体分数。 晶体分数与所制造的太阳能电池的效率相关，允许在处理之前排出劣质晶片。

公开(公告)号：US08501568B2

公开(公告)日：2013-08-06

申请号：US12256173

申请日：2008-10-22

申请人： Mihaela Balseanu ,  Vladimir Zubkov ,  Li-Qun Xia ,  Atif Noori ,  Reza Arghavani ,  Derek R. Witty ,  Amir Al-Bayati

发明人： Mihaela Balseanu ,  Vladimir Zubkov ,  Li-Qun Xia ,  Atif Noori ,  Reza Arghavani ,  Derek R. Witty ,  Amir Al-Bayati

IPC分类号： H01L21/326 ,  H01L21/8238 ,  H01L21/3205 ,  H01L21/4763 ,  H01L21/00 ,  H01L29/792

CPC分类号： H01L21/3185 ,  H01L21/28282 ,  H01L21/3105 ,  H01L21/3115 ,  H01L21/31155 ,  H01L29/42332 ,  H01L29/7881 ,  H01L29/792

摘要： A methods of forming a flash memory device are provided. The flash memory device comprises a silicon dioxide layer on a substrate and a silicon nitride layer that is formed on the silicon dioxide layer. The properties of the silicon nitride layer can be modified by any of: exposing the silicon nitride layer to ultraviolet radiation, exposing the silicon nitride layer to an electron beam, and by plasma treating the silicon nitride layer. A dielectric material is deposited on the silicon nitride layer and a conductive date is formed over the dielectric material. The flash memory device with modified silicon nitride layer provides an increase in charge holding capacity and charge retention time of the unit cell of a non-volatile memory device.

摘要翻译： 提供了形成闪速存储器件的方法。 闪存器件包括在衬底上的二氧化硅层和形成在二氧化硅层上的氮化硅层。 氮化硅层的性质可以通过以下任何方式改变：将氮化硅层暴露于紫外线辐射，将氮化硅层暴露于电子束，以及通过等离子体处理氮化硅层。 介电材料沉积在氮化硅层上，并且在电介质材料上形成导电日期。 具有改进的氮化硅层的闪速存储器件提供了非易失性存储器件的单元电池的电荷保持容量和电荷保持时间的增加。

公开(公告)号：US20130008878A1

公开(公告)日：2013-01-10

申请号：US13619898

申请日：2012-09-14

申请人： Dean C. Jennings ,  Amir Al-Bayati

发明人： Dean C. Jennings ,  Amir Al-Bayati

IPC分类号： B23K26/00

CPC分类号： H01L21/268 ,  B23K26/0738 ,  H01L21/26533 ,  H01L21/324

摘要： A method including introducing a species into a substrate including semiconductor material; and translating linearly focused electromagnetic radiation across a surface of the substrate, the electromagnetic radiation being sufficient to thermally influence the species. An apparatus including an electromagnetic radiation source; a stage having dimensions suitable for accommodating a semiconductor substrate within a chamber; an optical element disposed between the electromagnetic radiation source and the stage to focus radiation from the electromagnetic radiation source into a line having a length determined by the diameter of a substrate to be placed on the stage; and a controller coupled to the electromagnetic radiation source including machine readable program instructions that allow the controller to control the depth into which a substrate is exposed to the radiation.

摘要翻译： 一种方法，包括将物质引入到包括半导体材料的基板中; 并且将线性聚焦的电磁辐射平移在衬底的表面上，电磁辐射足以热影响物质。 一种包括电磁辐射源的设备; 具有适于容纳半导体衬底在腔室内的尺寸的平台; 设置在所述电磁辐射源和所述台之间的光学元件，用于将来自所述电磁辐射源的辐射聚焦成具有由要放置在所述台上的基板的直径确定的长度的线; 以及耦合到电磁辐射源的控制器，包括允许控制器控制衬底暴露于辐射的深度的机器可读程序指令。

公开(公告)号：US20100096687A1

公开(公告)日：2010-04-22

申请号：US12255617

申请日：2008-10-21

申请人： Mihaela BALSEANU ,  Vladimir Zubkov ,  Li-Qun Xia ,  Atif Noori ,  Reza Arghavani ,  Derek R. Witty ,  Amir Al-Bayati

发明人： Mihaela BALSEANU ,  Vladimir Zubkov ,  Li-Qun Xia ,  Atif Noori ,  Reza Arghavani ,  Derek R. Witty ,  Amir Al-Bayati

IPC分类号： H01L29/78 ,  H01L21/3205 ,  H01L21/31

CPC分类号： H01L21/3185 ,  H01L21/28282 ,  H01L21/3105 ,  H01L21/3115 ,  H01L21/31155 ,  H01L29/42332 ,  H01L29/7881 ,  H01L29/792

摘要： A flash memory device and methods of forming a flash memory device are provided. The flash memory device includes a doped silicon nitride layer having a dopant comprising carbon, boron or oxygen. The doped silicon nitride layer generates a higher number and higher concentration of nitrogen and silicon dangling bonds in the layer and provides an increase in charge holding capacity and charge retention time of the unit cell of a non-volatile memory device.

摘要翻译： 提供闪速存储器件和形成闪存器件的方法。 闪速存储器件包括具有包含碳，硼或氧的掺杂剂的掺杂氮化硅层。 掺杂的氮化硅层在该层中产生更高数量和更高浓度的氮和硅悬挂键，并且提供了非易失性存储器件的单元电池的电荷保持容量和电荷保留时间的增加。

公开(公告)号：US20090120367A1

公开(公告)日：2009-05-14

申请号：US11985579

申请日：2007-11-14

申请人： Peter I. Porshnev ,  Majeed A. Foad ,  Kartik Ramaswamy ,  Biagio Gallo ,  Hiroji Hanawa ,  Andrew Nguyen ,  Kenneth S. Collins ,  Amir Al-Bayati

发明人： Peter I. Porshnev ,  Majeed A. Foad ,  Kartik Ramaswamy ,  Biagio Gallo ,  Hiroji Hanawa ,  Andrew Nguyen ,  Kenneth S. Collins ,  Amir Al-Bayati

IPC分类号： C23C16/513

CPC分类号： H01J37/32642 ,  H01J37/32412

摘要： The disclosure concerns a process ring for the wafer support pedestal of a toroidal source plasma immersion ion implantation reactor. The process ring improves edge uniformity by providing a continuous surface extending beyond the wafer edge, in one embodiment. In another embodiment, the process ring includes a floating electrode that functions as an extension of the wafer support electrode by RF coupling at the bias frequency.

摘要翻译： 本公开涉及用于环形源等离子体浸入式离子注入反应器的晶片支撑基座的工艺环。 在一个实施例中，处理环通过提供延伸超过晶片边缘的连续表面来提高边缘均匀性。 在另一个实施例中，处理环包括浮动电极，其通过在偏置频率下的RF耦合用作晶片支撑电极的延伸。

公开(公告)号：US07429532B2

公开(公告)日：2008-09-30

申请号：US11199592

申请日：2005-08-08

申请人： Kartik Ramaswamy ,  Hiroji Hanawa ,  Biagio Gallo ,  Kenneth S. Collins ,  Kai Ma ,  Vijay Parihar ,  Dean Jennings ,  Abhilash J. Mayur ,  Amir Al-Bayati ,  Andrew Nguyen

发明人： Kartik Ramaswamy ,  Hiroji Hanawa ,  Biagio Gallo ,  Kenneth S. Collins ,  Kai Ma ,  Vijay Parihar ,  Dean Jennings ,  Abhilash J. Mayur ,  Amir Al-Bayati ,  Andrew Nguyen

IPC分类号： H01L21/302

CPC分类号： H01L21/0332 ,  G03F1/54 ,  G03F1/68 ,  G03F7/202 ,  H01L21/3081 ,  H01L21/3086

摘要： A method of processing a thin film structure on a semiconductor substrate using an optically writable mask, the method includes placing the substrate in a reactor chamber, the substrate having on its surface a target layer to be exposed to a light source in accordance with a predetermined pattern, depositing an optically writable carbon-containing mask layer on the substrate by (a) introducing a carbon-containing process gas into the chamber, (b) generating a reentrant toroidal RF plasma current in a reentrant path that includes a process zone overlying the workpiece by coupling plasma RF source power to an external portion of the reentrant path, (c) coupling RF plasma bias power or bias voltage to the workpiece. The method further includes optically writing on the carbon-containing mask layer in accordance with the predetermined pattern with writing light of a characteristic suitable for transforming the transparency or opacity of the optically writable mask layer and exposing through the mask layer the target layer with reading light of a characteristic different from that of the writing light.

摘要翻译： 一种使用光学可写掩模在半导体衬底上处理薄膜结构的方法，所述方法包括将衬底放置在反应室中，所述衬底在其表面上具有根据预定的暴露于光源的靶层 （a）将含碳工艺气体引入所述室中，（b）在可折入路径中产生可重入环形的RF等离子体电流，所述折返路径包括位于所述腔内的过程区域 通过将等离子体RF源功率耦合到可折入路径的外部部分，（c）将RF等离子体偏置功率或偏置电压耦合到工件。 该方法还包括根据预定图案，用适合于转换光学可写掩膜层的透明度或不透明度的特性的光进行光学写入，并通过掩模层曝光目标层与读取光 具有与书写光不同的特征。

公开(公告)号：US20080173237A1

公开(公告)日：2008-07-24

申请号：US12016810

申请日：2008-01-18

申请人： Kenneth S. Collins ,  Andrew N. Nguyen ,  Kartik Ramaswamy ,  Hiroji Hanawa ,  Douglas A. Buchberger ,  Daniel J. Hoffman ,  Amir Al-Bayati

发明人： Kenneth S. Collins ,  Andrew N. Nguyen ,  Kartik Ramaswamy ,  Hiroji Hanawa ,  Douglas A. Buchberger ,  Daniel J. Hoffman ,  Amir Al-Bayati

IPC分类号： C23C16/453

CPC分类号： H01J37/32458 ,  H01J37/32412 ,  H01J37/32477

摘要： Embodiments described herein generally provide a toroidal plasma source, a plasma channeling device, a showerhead, and a substrate support assembly for use in a plasma chamber. The toroidal plasma source, plasma channeling device, showerhead, and substrate support assembly are adapted to improve the usable lifetime of the plasma chamber, as well as reduce assembly cost, increase the plasma chamber reliability, and improve device yield on the processed substrates.

摘要翻译： 本文描述的实施例通常提供环形等离子体源，等离子体引导装置，喷头和用于等离子体室的基板支撑组件。 环形等离子体源，等离子体引导装置，喷头和基板支撑组件适于改善等离子体室的使用寿命，并且降低组装成本，增加等离子体室的可靠性，并提高处理的基板上的装置产量。

公开(公告)号：US07335611B2

公开(公告)日：2008-02-26

申请号：US11199572

申请日：2005-08-08

申请人： Kartik Ramaswamy ,  Hiroji Hanawa ,  Biagio Gallo ,  Kenneth S. Collins ,  Kai Ma ,  Vijay Parihar ,  Dean Jennings ,  Abhilash J. Mayur ,  Amir Al-Bayati ,  Andrew Nguyen

发明人： Kartik Ramaswamy ,  Hiroji Hanawa ,  Biagio Gallo ,  Kenneth S. Collins ,  Kai Ma ,  Vijay Parihar ,  Dean Jennings ,  Abhilash J. Mayur ,  Amir Al-Bayati ,  Andrew Nguyen

IPC分类号： H01L21/4763 ,  H01L21/00

CPC分类号： B23K26/0738 ,  B23K26/0608 ,  B23K26/0876 ,  B23K26/361 ,  B23K26/40 ,  B23K2103/172 ,  B23K2103/50 ,  H01L21/76843 ,  H01L21/76864 ,  H01L21/76873 ,  H01L21/76877 ,  H01L21/76886

摘要： A method of forming a conductor in a thin film structure on a semiconductor substrate includes forming high aspect ratio openings in a base layer having vertical side walls, depositing a dielectric barrier layer comprising a dielectric compound of a barrier metal on the surfaces of the high aspect ratio openings including the vertical side walls, depositing a metal barrier layer comprising the barrier metal on the first barrier layer, depositing a main conductor species seed layer on the metal barrier layer and depositing a main conductor layer. The method further includes annealing the main conductor layer by (a) directing light from an array of continuous wave lasers into a line of light extending at least partially across the thin film structure, and (b) translating the line of light relative to the thin film structure in a direction transverse to the line of light. The method of Claim 1 further comprising, prior to the annealing step, depositing an amorphous carbon optical absorber layer on the main conductor layer. The step of depositing an amorphous carbon optical absorber layer includes introducing a carbon-containing process gas into a reactor chamber containing the substrate in a process zone of the reactor, applying RF source power to an external reentrant conduit of the reactor to generate a reentrant toroidal RF plasma current passing through the process zone and applying a bias voltage to the substrate.

摘要翻译： 在半导体衬底上形成薄膜结构中的导体的方法包括在具有垂直侧壁的基底层中形成高纵横比的开口，在高方面的表面上沉积包含阻挡金属的电介质化合物的介电阻挡层 比例开口，包括垂直侧壁，在第一阻挡层上沉积包括阻挡金属的金属阻挡层，在金属阻挡层上沉积主导体种子种子层并沉积主导体层。 该方法还包括通过以下步骤来退火主导体层：（a）将来自连续波激光器阵列的光引导到至少部分穿过薄膜结构的光线，以及（b）相对于薄的平面 薄膜结构在横向于光线的方向上。 2.根据权利要求1所述的方法，还包括在所述退火步骤之前，在所述主导体层上沉积无定形碳光吸收层。 沉积无定形碳光吸收层的步骤包括将含碳工艺气体引入反应器的反应器室中，该反应器室在反应器的工艺区域中，将RF源功率施加到反应器的外部折入导管以产生可重入环形 RF等离子体电流通过工艺区域并向衬底施加偏置电压。

公开(公告)号：US07312162B2

公开(公告)日：2007-12-25

申请号：US11131941

申请日：2005-05-17

申请人： Kartik Ramaswamy ,  Hiroji Hanawa ,  Biagio Gallo ,  Kenneth S. Collins ,  Kai Ma ,  Vijay Parihar ,  Dean Jennings ,  Abhilash J. Mayur ,  Amir Al-Bayati ,  Andrew Nguyen

发明人： Kartik Ramaswamy ,  Hiroji Hanawa ,  Biagio Gallo ,  Kenneth S. Collins ,  Kai Ma ,  Vijay Parihar ,  Dean Jennings ,  Abhilash J. Mayur ,  Amir Al-Bayati ,  Andrew Nguyen

IPC分类号： H01L21/31

CPC分类号： C23C16/26 ,  C23C16/505 ,  C23C16/52 ,  H01L21/268 ,  H01L21/3146

摘要： A method of depositing a carbon layer on a workpiece includes placing the workpiece in a reactor chamber, introducing a carbon-containing process gas into the chamber, generating a reentrant toroidal RF plasma current in a reentrant path that includes a process zone overlying the workpiece by coupling plasma RF source power to an external portion of the reentrant path, and coupling RF plasma bias power or bias voltage to the workpiece.

摘要翻译： 在工件上沉积碳层的方法包括将工件放置在反应器室中，将含碳工艺气体引入室中，在可重入路径中产生可重入环形RF等离子体电流，该等离子体电流包括通过 将等离子体RF源功率耦合到可折入路径的外部部分，以及将RF等离子体偏置功率或偏置电压耦合到工件。

公开(公告)号：US07291545B2

公开(公告)日：2007-11-06

申请号：US11284975

申请日：2005-11-21

申请人： Kenneth S. Collins ,  Hiroji Hanawa ,  Kartik Ramaswamy ,  Andrew Nguyen ,  Amir Al-Bayati ,  Biagio Gallo ,  Gonzalo Antonio Monroy

发明人： Kenneth S. Collins ,  Hiroji Hanawa ,  Kartik Ramaswamy ,  Andrew Nguyen ,  Amir Al-Bayati ,  Biagio Gallo ,  Gonzalo Antonio Monroy

IPC分类号： H01L21/04

CPC分类号： H01J37/32357 ,  H01J37/32082 ,  H01J37/321 ,  H01J37/32412 ,  H01L21/2236

摘要： A method of ion implanting a species in a workpiece to a selected ion implantation profile depth includes placing a workpiece having a semiconductor material on an electrostatic chuck in or near a processing region of a plasma reactor chamber and applying a chucking voltage to the electrostatic chuck. The method further includes introducing into the chamber a precursor gas including a species to be ion implanted in the workpiece and applying an RF bias to the electrostatic chuck, the RF bias having a bias level corresponding to the ion implantation profile depth.

摘要翻译： 将工件中的物质离子注入到选定的离子注入轮廓深度的方法包括将具有半导体材料的工件放置在等离子体反应器室的处理区域中或其附近的静电卡盘上，并向静电卡盘施加夹持电压。 所述方法还包括将包括要离子植入的物质的前体气体引入所述室中并将RF偏压施加到所述静电卡盘，所述RF偏压具有对应于所述离子注入轮廓深度的偏置电平。