Abstract:
The present invention provides a frameless liquid crystal display device, which includes a rear enclosure, a backlight module arranged inside the rear enclosure, a mold frame arranged on the backlight module and mounted to the rear enclosure, and a liquid crystal display panel arranged on the mold frame. The liquid crystal display panel has an upper portion that is mounted to the mold frame through a plurality of connection sections. Each of the connection sections includes a cylindrical base plate and a cylindrical projection mounted to the cylindrical base plate. The liquid crystal display panel includes a CF substrate and a TFT substrate laminated on the CF substrate. The CF substrate forms a step with respect to a lower edge of the TFT substrate. A surface decoration is bonded to the step and fixed to the mold frame to assemble the liquid crystal display panel to the mold frame.
Abstract:
A frameless liquid crystal display device includes a rear enclosure, a backlight module arranged inside the rear enclosure, a mold frame arranged on the backlight module and mounted to the rear enclosure, and a liquid crystal display panel arranged on the mold frame. The liquid crystal display panel has upper and lower portions mounted to the mold frame through connection sections, each of which includes a rectangular base plate and a trapezoid block. The mold frame forms a trapezoid slot having an open end and a closed end corresponding to each of the connection sections. The connection section is thus receivable through the open end into the trapezoid slot to retain and fix the liquid crystal display panel to the mold frame. The liquid crystal display panel forms a step and a surface decoration is mounted to the step to fix the liquid crystal display panel to the mold frame.
Abstract:
The present invention discloses a back light module and a liquid crystal display (LCD) thereof. The back light module comprises a light guide plate, an optical sheet laid on the light transmission surface of the light guide plate, wherein the edge of the optical sheet is fixed to the light guide plate by a plurality of positioning structures. With application of the positioning structures, because the expansion coefficient of the optical sheet is not nearly to that of the frame but is close to the thermal expansion rate of the light guide plate, after the optical sheet is fixed to the light guide plate, the light guide plate is expanded along with the expansion of the optical sheet when subject to heating, and shrunk along with the shrinking of the optical sheet when the temperature drops. Thus, the optical sheet is not easy to warp due to the minimum performance change of the optical sheet and the light guide plate, and the temperature environment is also very similar because the optical sheet is near to the light guide plate. Therefore, as compared with the frame, the temperature of the optical sheet is more similar to that of the light guide plate, and the thermal expansion rate of the optical sheet is also similar to that of the light guide plate. Thereby, the warping of the optical sheet is further decreased.
Abstract:
A backlight module including a back frame, a light guiding plate received in the back frame, and a position piece is disclosed. The position piece is arranged between the back frame and the light guiding plate, and the position piece is detachably fixed on sidewalls of the back frame to firmly press the light guiding plate within the back frame. In addition, a liquid crystal display with the backlight module is also disclosed. The light guiding plate is reliably positioned by adopting the above position piece.
Abstract:
A thin film semiconductor device has a semiconductor layer including a mixture of an amorphous semiconductor ionic metal oxide and an amorphous insulating covalent metal oxide. A pair of terminals is positioned in communication with the semiconductor layer and define a conductive channel, and a gate terminal is positioned in communication with the conductive channel and further positioned to control conduction of the channel. The invention further includes a method of depositing the mixture including using nitrogen during the deposition process to control the carrier concentration in the resulting semiconductor layer.
Abstract:
A full-color AM OLED includes a transparent substrate, a color filter positioned on an upper surface of the substrate, and a metal oxide thin film transistor backpanel positioned in overlying relationship on the color filter and defining an array of pixels. An array of OLEDs is formed on the backpanel and positioned to emit light downwardly through the backpanel, the color filter, and the substrate in a full-color display. Light emitted by each OLED includes a first emission band with wavelengths extending across the range of two of the primary colors and a second emission band with wavelengths extending across the range of the remaining primary color. The color filter includes for each pixel, two zones separating the first emission band into two separate primary colors and a third zone passing the second emission band.
Abstract:
An enterprise service bus (ESB) and message processing method thereof are disclosed. The ESB includes: a message receiving unit, a message queuing unit, a processing-thread-group, and a request processing unit. The message receiving unit includes multiple message receiving channels which are used to receive messages each having at least one service request. The message queuing unit is used to receive messages from the multiple message receiving channels and to sort the messages according to predefined rules. The processing-thread-group is used to receive a predefined number of sorted messages from the message queuing unit. The request processing unit is used to acquire service requests of the messages from the processing-thread-group and to process the service requests. The present disclosure integrates various application programs into an electronic trading platform, and achieves program invocation by ESB. Therefore, service users are no longer required to perform complicated asynchronous invocations, while ESB is used to convert a synchronous mode to an asynchronous mode.
Abstract:
The present invention discloses an LCD panel assembly, an LCD device and a method for fixing the LCD panel. The LCD panel assembly comprises an LCD panel and a middle frame around the glass, wherein, an LCD module comprises a positioning element comprising a first positioning part and a second positioning part; the first positioning part contacts with an LCD panel and the second positioning part is fixed and connected to one end of the first positioning part. The present invention can omit a front frame of the LCD module, reduce the cost of the LCD module, and simplify the process of installing the fixed structure. Besides, the positioning element not only can match the middle frame to form the LCD module, but also can match the complete front frame to form the LCD device. Thus, the designing and manufacturing cost is to be further reduced with nice commonality and convenient assembling.
Abstract:
A method of fabricating a pixelated imager includes providing a substrate with bottom contact layer and sensing element blanket layers on the contact layer. The blanket layers are separated into an array of sensing elements by trenches isolating adjacent sensing elements. A sensing element electrode is formed adjacent each sensing element overlying a trench and defining a TFT. A layer of metal oxide semiconductor (MOS) material is formed on a dielectric layer overlying the electrodes and on an exposed upper surface of the blanket layers defining the sensing element adjacent each TFT. A layer of metal is deposited on each TFT and separated into source/drain electrodes on opposite sides of the sensing element electrode. The metal forming one of the S/D electrodes contacts the MOS material overlying the exposed surface of the semiconductor layer, whereby each sensing element in the array is electrically connected to the adjacent TFT by the MOS material.
Abstract:
A method of fabricating MOTFTs includes positioning opaque gate metal on a transparent substrate, depositing gate dielectric material overlying the gate metal and a surrounding area, and depositing metal oxide semiconductor material thereon. Etch stop material is deposited on the semiconductor material. Photoresist defines an isolation area in the semiconductor material. Exposing the photoresist from the rear surface of the substrate and removing exposed portions to leave the etch stop material uncovered except for a portion overlying and aligned with the gate metal. Etching uncovered portions of the semiconductor material to isolate the TFT. Using the photoresist, selectively etching the etch stop layer to leave a portion overlying and aligned with the gate metal and defining a channel area in the semiconductor material. Depositing and patterning conductive material to form source and drain areas.