摘要:
A semiconductor memory device includes a mode detection circuit for generating a mode detection signal in response to external input signals /RAS, /CAS and /WE, an internal potential generating circuit for generating and supplying to an output node an internal potential, in response to an activated potential control signal, and an internal potential control circuit for activating a potential control signal when a potential at the output node has not yet reached a predetermined potential in a case where mode detection signal indicates a mode other than the test mode, and for activating the potential control signal when the potential at the output node has not yet reached an externally supplied external reference potential in a case where the mode detection signal indicates the test mode. When external input signals are applied at a predetermined timing, a mode detection signal indicating the test mode is generated, and when the potential at the output node of the internal potential generating circuit has not yet reached the external reference potential, an internal potential is generated and supplied to the output node. Therefore, the internal potential can be controlled in accordance with the external reference potential.
摘要:
Read drivers which are provided in correspondence to simultaneously selected plural bits of memory cells are wired-OR connected to internal read data buses which in turn are provided in correspondence to a plurality of memory cell arrays respectively. A test mode circuit is provided for the internal read data buses for detecting coincidence/incoincidence of logics of signal potentials on these internal read data bus lines. In a test operation, all read drivers are activated to read selected memory cell data on the corresponding internal read data bus lines.
摘要:
A memory array MA.sub.0 is divided into four sub memory arrays by sense amplifier strips. Word drivers belonging to each sub memory array are connected to a corresponding segment boosted signal line. A fuse is connected to each segment boosted signal line. By blowing out a fuse, the sub memory array corresponding to the blown out fuse is no longer used. The sub memory array that is no longer used is exchanged with a spare sub memory array of a spare memory array.
摘要:
A semiconductor memory device includes a sense amp band including a plurality of sense amplifiers, and a plurality of operation power supply potential lines and a plurality of ground potential lines arranged in a meshed shape. The operation power supply potential lines and the ground potential lines include the lines arranged in parallel with and in proximity to the sense amp band. Each sense amplifier in the sense amp band is connected to an operation power supply potential line and a ground line arranged in proximity to and in parallel with the sense amplifier through a drive component. The drive component is provided one for a predetermined number of sense amplifiers, and is rendered conductive in response to a sense amplifier activation signal from a signal line arranged in parallel with the sense amp band. The plurality of operation power supply potential lines and the plurality of ground lines arranged in a meshed shape are contacted at crossings. Therefore, in the semiconductor memory device, no distribution of power supply potentials is generated to allow a stable supply of a power supply potential and a ground potential to an arbitrary circuit portion. In addition, since a sense amplifier is connected to a proximate operation power supply potential line and ground line through a drive component, a reliable and high-speed sensing operation is possible irrespective of a length of a sense amp drive signal line.
摘要:
A semiconductor memory device includes a sense amp band including a plurality of sense amplifiers, and a plurality of operation power supply potential lines and a plurality of ground potential lines arranged in a meshed shape. The operation power supply potential lines and the ground potential lines include the lines arranged in parallel with and in proximity to the sense amp band. Each sense amplifier in the sense amp band is connected to an operation power supply potential line and a ground line arranged in proximity to and in parallel with the sense amplifier through a drive component. The drive component is provided one for a predetermined number of sense amplifiers, and is rendered conductive in response to a sense amplifier activation signal from a signal line arranged in parallel with the sense amp band. The plurality of operation power supply potential lines and the plurality of ground lines arranged in a meshed shape are contacted at crossings. Therefore, in the semiconductor memory device, no distribution of power supply potentials is generated to allow a stable supply of a power supply potential and a ground potential to an arbitrary circuit portion. In addition, since a sense amplifier is connected to a proximate operation power supply potential line and ground line through a drive component, a reliable and high-speed sensing operation is possible irrespective of a length of a sense amp drive signal line.
摘要:
A semiconductor memory device includes a sense amp band including a plurality of sense amplifiers, and a plurality of operation power supply potential lines and a plurality of ground potential lines arranged in a meshed shape. The operation power supply potential lines and the ground potential lines include the lines arranged in parallel with and in proximity to the sense amp band. Each sense amplifier in the sense amp band is connected to an operation power supply potential line and a ground line arranged in proximity to and in parallel with the sense amplifier through a drive component. The drive component is provided one for a predetermined number of sense amplifiers, and is rendered conductive in response to a sense amplifier activation signal from a signal line arranged in parallel with the sense amp band. The plurality of operation power supply potential lines and the plurality of ground lines arranged in a meshed shape are contacted at crossings. Therefore, in the semiconductor memory device, no distribution of power supply potentials is generated to allow a stable supply of a power supply potential and a ground potential to an arbitrary circuit portion. In addition, since a sense amplifier is connected to a proximate operation power supply potential line and ground line through a drive component, a reliable and high-speed sensing operation is possible irrespective of a length of a sense amp drive signal line.
摘要:
A semiconductor memory device includes a semiconductor substrate, a plurality of memory blocks, first and second substrate potential generating circuits and a select circuit. The semiconductor substrate includes a plurality of wells corresponding to the memory blocks. Each memory block includes a plurality of memory cells formed on corresponding wells. The select circuit supplies to the well of the activated memory block a deep substrate potential generated by the first substrate potential generating circuit, and supplies to the well of the unselected memory block a shallow substrate potential generated by the second substrate potential generating circuit. Thereby, the minimum operation in the inactive memory block is ensured in spite of the fact that a power consumption of the inactive memory block is reduced.
摘要:
In read operation, a current from a current supply transistor flows through a selected memory cell and a data line. Moreover, a bias magnetic field having such a level that does not destroy storage data is applied to the selected memory cell. By application of the bias magnetic field, an electric resistance of the selected memory cell changes in the positive or negative direction depending on the storage data level. A sense amplifier amplifies the difference between voltages on the data line before and after the change in electric resistance of the selected memory cell. Data is thus read from the selected memory cell by merely accessing the selected memory cell. Moreover, since the data line and the sense amplifier are insulated from each other by a capacitor, the sense amplifier can be operated in an optimal input voltage range regardless of magnetization characteristics of the memory cells.
摘要:
A tester is connected to a signal output terminal provided in a DRAM chip, and a frequency of a clock signal output from an internal timer is monitored. The frequency of the clock signal is varied by changing the combination of 3 bit signals, so as to obtain signals by which the frequency closest to the set value is obtained. A fuse in the internal timer is disconnected to set the frequency of the clock signal so as to obtain the same state as in the case where that signal is applied. The internal timer includes an oscillator formed of a plurality of inverters connected in ring shape and a variable capacitance circuit for each inverter. Each variable capacitance circuit includes a plurality of sets of transfer gates, fuses and capacitors connected between the output node of the corresponding inverter and a prescribed potential line.
摘要:
Built-in self-test circuit and built-in redundancy analysis circuit are provided commonly to plural DRAM cores. Built-in redundancy analysis circuit determines a defective address to be replaced with one of plural spare memory cell rows and plural spare memory cell columns according to an address signal and a detection result of a defective memory cell from built-in self-test circuit. Built-in redundancy analysis circuit controls an effective service area of an address storage circuit into which a defective address is stored according to a capacity of a DRAM core to be tested.