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71.发明申请SCHEDULING READ OPERATIONS DURING DRIVE RECONSTRUCTION IN AN ARRAY OF REDUNDANT DISK DRIVES 有权在冗余盘驱动器阵列的驱动重建期间安排阅读操作公开(公告)号：US20120272019A1
公开(公告)日：2012-10-25
申请号：US13542298
申请日：2012-07-05
IPC分类号： G06F12/00
CPC分类号： G06F3/0659 , G06F3/0613 , G06F3/0617 , G06F3/0653 , G06F3/0689 , G06F11/1096 , G06F11/3034 , G06F11/3058 , G06F11/3485
摘要： Some embodiments of the present invention provide a system that schedules read operations for disk drives in a set of disk drives. During operation, the system monitors a write rate for write operations to a given disk drive in the set of disk drives, wherein vibrations generated by the read operations directed to disk drives in the set of disk drives are transmitted to the given disk drive. Then, the read operations for disk drives in the set of disk drives are scheduled based on the write rate for the given disk drive, thereby limiting interference between the write operations and the vibrations generated by the read operations.
摘要翻译： 本发明的一些实施例提供一种系统，其对一组磁盘驱动器中的磁盘驱动器进行读取操作。 在操作期间，系统监视对磁盘驱动器集合中的给定磁盘驱动器的写入操作的写入速率，其中通过指向磁盘驱动器集合中的磁盘驱动器的读取操作产生的振动被发送到给定的磁盘驱动器。 然后，基于给定磁盘驱动器的写入速率来调度磁盘驱动器组中的磁盘驱动器的读取操作，从而限制写入操作与由读取操作产生的振动之间的干扰。
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公开(公告)号：US08207752B2
公开(公告)日：2012-06-26
申请号：US12685159
申请日：2010-01-11
申请人： Kannan Raj , Xuezhe Zheng , Ashok V. Krishnamoorthy , Ronald Ho , Michael O. McCracken , David K. McElfresh , John E. Cunningham
发明人： Kannan Raj , Xuezhe Zheng , Ashok V. Krishnamoorthy , Ronald Ho , Michael O. McCracken , David K. McElfresh , John E. Cunningham
IPC分类号： H03K19/003
CPC分类号： H03K19/177
摘要： A multi-chip module (MCM) is described. This MCM includes multiple sites, where a given site in the multiple sites includes multiple chips with proximity connectors that communicate information through proximity communication within the MCM via multiple components associated with the given site. Note that the MCM includes global redundancy and local redundancy at the given site. In particular, the global redundancy involves providing one or more redundant sites in the multiple sites. Furthermore, the local redundancy involves providing one or more redundant chips in the multiple chips and one or more redundant components in the multiple components.
摘要翻译： 描述了多芯片模块（MCM）。 该MCM包括多个站点，其中多个站点中的给定站点包括具有邻近连接器的多个芯片，其通过与给定站点相关联的多个组件在MCM内通过邻近通信传递信息。 请注意，MCM包括给定站点的全局冗余和本地冗余。 特别地，全局冗余涉及在多个站点中提供一个或多个冗余站点。 此外，本地冗余包括在多个芯片中提供一个或多个冗余芯片以及在多个组件中提供一个或多个冗余组件。
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公开(公告)号：US20100070210A1
公开(公告)日：2010-03-18
申请号：US12209745
申请日：2008-09-12
IPC分类号： G06F19/00
CPC分类号： G06F11/3058 , G06F11/3034 , G06F11/3409
摘要： Some embodiments of the present invention provide a system that detects the presence of constrained motion in one or more components in a computer system. First, a vibrational spectrum of the computer system is monitored while the computer system operates. Then, the vibrational spectrum is analyzed using a pattern-recognition model to detect constrained motion in one or more components in the computer system, wherein the pattern-recognition model classifies the vibrational spectrum as indicating constrained motion or as not indicating constrained motion.
摘要翻译： 本发明的一些实施例提供了一种在计算机系统中的一个或多个组件中检测约束运动的存在的系统。 首先，在计算机系统运行时监视计算机系统的振动频谱。 然后，使用模式识别模型分析振动频谱，以检测计算机系统中的一个或多个组件中的约束运动，其中模式识别模型将振动频谱分类为指示约束运动或不指示受限运动。
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公开(公告)号：US07466404B1
公开(公告)日：2008-12-16
申请号：US11145388
申请日：2005-06-03
IPC分类号： G01N21/00
CPC分类号： H01S5/0021 , G01R31/2635 , H01S5/18311
摘要： A method for testing a substrate by using a photoemission microscope is provided which includes providing the substrate and applying a reverse bias voltage to the substrate. The method further includes detecting light emissions from a top surface of the substrate and characterizing viability of the substrate from the detection of the light emissions.
摘要翻译： 提供一种通过使用光电显微镜测试基板的方法，其包括提供基板并向基板施加反向偏置电压。 该方法还包括检测来自衬底的顶表面的光发射，并且从光发射的检测来表征衬底的可行性。
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公开(公告)号：US20080061812A1
公开(公告)日：2008-03-13
申请号：US11531657
申请日：2006-09-13
IPC分类号： G01R31/26
CPC分类号： G01R31/046 , G01R31/2896
摘要： Apparatus, systems, and methods are provided for testing the integrity of electrical interconnections in electronic systems. Apparatus may be constructed by modifying a substrate designed for deployment in an end-use product by shorting together multiple contacts on one side of it. Such vehicles may be used to test the characteristics of interconnections between the vehicle and its support, the shorted contacts enabling testing of individual interconnects under both DC and AC conditions. A system for testing the interconnects may include the modified substrate, an input signal generator, and an output signal monitor.
摘要翻译： 提供了用于测试电子系统中电互连的完整性的装置，系统和方法。 装置可以通过将设计用于部署在最终用途产品中的基板通过将其一侧上的多个触点短接在一起而构成。 这样的车辆可以用于测试车辆与其支撑件之间的互连的特性，短路触点能够在DC和AC条件下测试各个互连。 用于测试互连的系统可以包括修改的衬底，输入信号发生器和输出信号监视器。
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76.发明授权
公开(公告)号：US5514627A
公开(公告)日：1996-05-07
申请号：US186196
申请日：1994-01-24
CPC分类号： H01L33/44 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/8592 , H01L2924/181 , H01L33/56 , Y10S438/938
摘要： A method for increasing the resistance of a light emitting diode and other semiconductor devices to extremes of temperature is disclosed. During the manufacture of the light emitting diode, a liquid coating is applied to the light emitting die after the die has been placed in its lead frame. After the liquid coating has been placed on the die and its lead frames, a thermosetting encapsulant material is placed over the coating. The operation that cures the thermosetting material leaves the coating liquid intact. As the die and the encapsulant expand and contract at different rates with respect to changes in temperature, and as in known light emitting diodes the encapsulating material adheres to the die and lead frames, this liquid coating reduces the stresses that these different rates of expansion and contraction normally cause by eliminating the adherence of the encapsulating material to the die and frame.
摘要翻译： 公开了一种用于将发光二极管和其它半导体器件的电阻增加到极限温度的方法。 在制造发光二极管期间，在将裸片放置在其引线框架之后，将液体涂层施加到发光管芯。 将液体涂层放置在模具及其引线框架上之后，将热固性密封剂材料放置在涂层上。 固化热固性材料的操作使涂布液完好无损。 随着模具和密封剂相对于温度变化以不同的速率膨胀和收缩，并且如已知的发光二极管中的封装材料粘附到模具和引线框架，该液体涂层减少了这些不同的膨胀率和 收缩通常通过消除封装材料对模具和框架的粘附而引起。
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77.发明授权Scheduling read operations during drive reconstruction in an array of redundant disk drives 有权在冗余磁盘驱动器阵列中的驱动重建期间调度读取操作公开(公告)号：US08239623B2
公开(公告)日：2012-08-07
申请号：US12167729
申请日：2008-07-03
CPC分类号： G06F3/0659 , G06F3/0613 , G06F3/0617 , G06F3/0653 , G06F3/0689 , G06F11/1096 , G06F11/3034 , G06F11/3058 , G06F11/3485
摘要： Some embodiments of the present invention provide a system that schedules read operations for disk drives in a set of disk drives. During operation, the system monitors a write rate for write operations to a given disk drive in the set of disk drives, wherein vibrations generated by the read operations directed to disk drives in the set of disk drives are transmitted to the given disk drive. Then, the read operations for disk drives in the set of disk drives are scheduled based on the write rate for the given disk drive, thereby limiting interference between the write operations and the vibrations generated by the read operations.
摘要翻译： 本发明的一些实施例提供一种系统，其对一组磁盘驱动器中的磁盘驱动器进行读取操作。 在操作期间，系统监视对磁盘驱动器集合中的给定磁盘驱动器的写入操作的写入速率，其中通过指向磁盘驱动器集合中的磁盘驱动器的读取操作产生的振动被发送到给定的磁盘驱动器。 然后，基于给定磁盘驱动器的写入速率来调度磁盘驱动器组中的磁盘驱动器的读取操作，从而限制写入操作与由读取操作产生的振动之间的干扰。
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公开(公告)号：US20110255768A1
公开(公告)日：2011-10-20
申请号：US12759960
申请日：2010-04-14
IPC分类号： G06K9/62
CPC分类号： G06T7/001 , G06T2207/30152
摘要： A method and system for identifying voids in solder balls in a ball-grid array (BGA) using an image of the BGA include localizing an image of a solder ball on the BGA image, the solder ball image having a radius and having multiple points each having an image intensity, and producing a void-free model image of the solder ball based on the radius of the solder ball image, the void-free model image having multiple points each having an image intensity. The method and system also include computing a difference between the image intensities of the points of the solder ball image and the image intensities of the points of the void-free model image to produce a residual image, and identifying a void using the residual image.
摘要翻译： 使用BGA的图像来识别球栅阵列（BGA）中的焊球中的空隙的方法和系统包括在BGA图像上定位焊球的图像，焊球图像具有半径并且具有多个点 具有图像强度，并且基于焊球图像的半径产生焊球的无空隙模型图像，具有多个点的无空隙模型图像具有图像强度。 该方法和系统还包括计算焊球图像的点的图像强度与无空隙模型图像的点的图像强度之间的差异以产生残余图像，以及使用残差图像来识别空隙。
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79.发明授权公开(公告)号：US07982468B2
公开(公告)日：2011-07-19
申请号：US12048133
申请日：2008-03-13
IPC分类号： G01R31/04
CPC分类号： G01R31/2808
摘要： A test system including a package with switchable paths. The package may have conductive paths that are selected by switches. The electrically switchable conductive paths may yield increased data without significantly increasing the required testing hardware.
摘要翻译： 包括具有切换路径的包装的测试系统。 封装可能具有由开关选择的导电路径。 电可切换导电路径可以产生增加的数据而不显着增加所需的测试硬件。
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公开(公告)号：US20100324882A1
公开(公告)日：2010-12-23
申请号：US12490012
申请日：2009-06-23
IPC分类号： G06F9/44
CPC分类号： H04Q9/00 , H04Q2209/84
摘要： A method for generating a service action for a computer system is described. During the method, a longevity index value for a packaging technology (such as solder joints in a BGA) in the computer system is calculated using thermal and vibration telemetry data (which is collected in the computer system) and a longevity model. This longevity model may be based on accelerated failure testing of the packaging technology, field failures of the packaging technology in a group of computer systems (which includes the computer system) and/or thermal and vibration telemetry data for the group of computer systems. Furthermore, using the longevity index value, the service action for the computer system is determined. Based on the longevity index value, remedial action (such as repairs to the computer system) may be scheduled and performed.
摘要翻译： 描述了一种用于为计算机系统生成服务动作的方法。 在该方法中，使用计算机系统中的热和振动遥测数据（计算机系统中收集）和长寿模型来计算计算机系统中的包装技术（诸如BGA中的焊点）的寿命指数值。 该寿命模型可以基于包装技术的加速故障测试，一组计算机系统（包括计算机系统）中的包装技术的现场故障和/或用于该组计算机系统的热和振动遥测数据。 此外，使用寿命指数值，确定计算机系统的服务动作。 根据寿命指数值，可以安排和执行补救措施（如计算机系统的维修）。
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