公开(公告)号：US07069647B2

公开(公告)日：2006-07-04

申请号：US10700087

申请日：2003-11-03

申请人： Jürgen Högerl ,  Jens Pohl ,  Uta Sasse ,  Ingo Wennemuth

发明人： Jürgen Högerl ,  Jens Pohl ,  Uta Sasse ,  Ingo Wennemuth

IPC分类号： H05K3/30

CPC分类号： H01L21/67144 ,  H01L21/68 ,  H01L24/75 ,  H01L2924/12042 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49144 ,  Y10T29/53 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53265 ,  H01L2924/00

摘要： A novel method and placement system are configured for populating a substrate with an electronic component. The placement system has a substrate holding device for receiving the substrate, a wafer holding device above the substrate holding device serving for receiving a wafer holding frame, and a vacuum forceps holding device arranged above the wafer holding device. The wafer holding frame can receive a complete semiconductor wafer divided into electronic components.

摘要翻译： 一种新颖的方法和放置系统被配置成用电子元件填充衬底。 放置系统具有用于接收基板的基板保持装置，用于接收晶片保持框架的基板保持装置上方的晶片保持装置和布置在晶片保持装置上方的真空钳子保持装置。 晶片保持框架可以接收分为电子部件的完整的半导体晶片。

公开(公告)号：US20060125042A1

公开(公告)日：2006-06-15

申请号：US10529565

申请日：2004-07-08

申请人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Peter Strobel ,  Holger Woerner

发明人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Peter Strobel ,  Holger Woerner

IPC分类号： H01L29/00

CPC分类号： H01L23/3128 ,  H01L23/49537 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L25/065 ,  H01L25/0657 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05571 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/05099 ,  H01L2924/00012

摘要： One embodiment of the invention relates to an electronic component having stacked semiconductor chips, and to a panel for production of the component. In one case, the stack has a flat conductor structure with a chip island on which a stacked semiconductor chip is arranged, while a first semiconductor chip is located underneath it. The chip island is surrounded by flat conductors which have contact pillars. These contact pillars have pillar contact pads which, together with the active upper face of the first semiconductor chip and the upper face areas of a plastic encapsulation compound form a coplanar overall upper face.

摘要翻译： 本发明的一个实施例涉及具有堆叠的半导体芯片的电子部件和用于生产部件的面板。 在一种情况下，堆叠具有平坦的导体结构，其中布置有堆叠半导体芯片的芯片岛，而第一半导体芯片位于其下方。 芯片岛由具有接触柱的扁平导体包围。 这些接触柱具有支柱接触垫，其与第一半导体芯片的有源上表面和塑料封装化合物的上表面区域一起形成共面的整个上表面。

公开(公告)号：US20060123624A1

公开(公告)日：2006-06-15

申请号：US11348762

申请日：2006-02-07

申请人： Jurgen Hogerl ,  Jens Pohl ,  Uta Sasse ,  Ingo Wennemuth

发明人： Jurgen Hogerl ,  Jens Pohl ,  Uta Sasse ,  Ingo Wennemuth

IPC分类号： B23P19/00

CPC分类号： H01L21/67144 ,  H01L21/68 ,  H01L24/75 ,  H01L2924/12042 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49144 ,  Y10T29/53 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53265 ,  H01L2924/00

摘要： A novel method and placement system are configured for populating a substrate with an electronic component. The placement system has a substrate holding device for receiving the substrate, a wafer holding device above the substrate holding device serving for receiving a wafer holding frame, and a vacuum forceps holding device arranged above the wafer holding device. The wafer holding frame can receive a complete semiconductor wafer divided into electronic components.

公开(公告)号：US06972321B1

公开(公告)日：2005-12-06

申请号：US10048458

申请日：2000-08-04

申请人： Gertrud Hötten ,  Rolf Bechtold ,  Jens Pohl

发明人： Gertrud Hötten ,  Rolf Bechtold ,  Jens Pohl

IPC分类号： C12N15/09 ,  A61K9/10 ,  A61K9/127 ,  A61K9/50 ,  A61K35/76 ,  A61K38/00 ,  A61K38/18 ,  A61K38/22 ,  A61K47/46 ,  A61K48/00 ,  A61L27/00 ,  A61L27/22 ,  A61P1/02 ,  A61P1/04 ,  A61P15/00 ,  A61P17/02 ,  A61P19/08 ,  A61P21/00 ,  A61P25/00 ,  A61P43/00 ,  C07K14/475 ,  C07K14/495 ,  C07K14/575 ,  C12N1/21 ,  C12N5/10 ,  C12N15/12 ,  C07K14/00 ,  C12P21/06

CPC分类号： C07K14/495 ,  A61K38/00 ,  A61L27/227 ,  C07K14/475 ,  C07K14/575

摘要： The present invention is concerned with proteins selected from the members of the TGF-β superfamily, which are monomeric due to substitution or deletion of a cystein which is responsible for dimer formation. The invention is also concerned with nucleic acids, encoding such monomeric proteins, vectors or host cells containing the nucleic acids as well as with pharmaceutical compositions comprising the proteins or nucleic acids encoding the proteins. The pharmaceutical compositions can be applied advantageously for all indications for which the respective dimeric proteins are useful.

摘要翻译： 本发明涉及选自TGF-β超家族成员的蛋白质，其由于负责二聚体形成的半胱氨酸的取代或缺失而是单体的。 本发明还涉及编码这样的单体蛋白质的核酸，含有核酸的载体或宿主细胞以及包含编码蛋白质的蛋白质或核酸的药物组合物。 药物组合物可有利地用于各种二聚体蛋白质可用的所有适应症。

公开(公告)号：US20050175553A1

公开(公告)日：2005-08-11

申请号：US11105344

申请日：2005-04-14

申请人： Gertrud Hotten ,  Helge Neidhardt ,  Rolf Bechtold ,  Jens Pohl

发明人： Gertrud Hotten ,  Helge Neidhardt ,  Rolf Bechtold ,  Jens Pohl

IPC分类号： A61K38/00 ,  C07K14/495 ,  C07K14/51 ,  A61K38/18 ,  A61K7/28

CPC分类号： A61K38/1858 ,  A61K38/00 ,  A61K38/1808 ,  C07K14/495 ,  C07K14/51

摘要： The invention provides DNA sequences encoding novel members of the TGF-β family of proteins. The TGF-β family comprises proteins which function as growth and/or differentiation factors and which are useful in medical applications. Accordingly, the invention also describes the isolation of the above-mentioned DNA sequences, the expression of the encoded proteins, the production of said proteins and pharmaceutical compositions containing said proteins.

摘要翻译： 本发明提供编码TGF-β蛋白家族的新成员的DNA序列。 TGF-β家族包含用作生长和/或分化因子并且可用于医学应用的蛋白质。 因此，本发明还描述了上述DNA序列的分离，编码蛋白质的表达，所述蛋白质的产生和含有所述蛋白质的药物组合物。

公开(公告)号：US06897088B2

公开(公告)日：2005-05-24

申请号：US10440480

申请日：2003-05-15

申请人： Harry Hedler ,  Roland Irsigler ,  Jens Pohl

发明人： Harry Hedler ,  Roland Irsigler ,  Jens Pohl

IPC分类号： H01L23/48 ,  H01L21/98 ,  H01L23/31 ,  H01L23/485 ,  H01L25/065 ,  H01L21/44

CPC分类号： H01L24/10 ,  H01L23/3128 ,  H01L24/13 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2224/83139 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06575 ,  H01L2225/06582 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method of connecting a first and second circuit device includes providing a first circuit device having a first main area and a second circuit device having a second and a third main area. A spacer device is disposed on one of the first and second circuit devices to ensure a predetermined spacing between the first and second circuit devices. An adhesive is applied to at least one of the first main area and the second main area and the first and second circuit devices are aligned and joined. The adhesive is then cured.

摘要翻译： 连接第一和第二电路装置的方法包括提供具有第一主区域的第一电路装置和具有第二和第三主区域的第二电路装置。 间隔装置设置在第一和第二电路装置之一上，以确保第一和第二电路装置之间的预定间隔。 将粘合剂施加到第一主区域和第二主区域中的至少一个，并且第一和第二电路装置对准和接合。 然后将粘合剂固化。

公开(公告)号：US20050026247A1

公开(公告)日：2005-02-03

申请号：US10734583

申请日：2003-12-15

申请人： Hidetoshi Andou ,  Jun Honda ,  Shunjiro Sugimoto ,  Gertrud Hotten ,  Rolf Bechtold ,  Jens Pohl

发明人： Hidetoshi Andou ,  Jun Honda ,  Shunjiro Sugimoto ,  Gertrud Hotten ,  Rolf Bechtold ,  Jens Pohl

IPC分类号： A61K38/00 ,  C07K14/475 ,  C07K14/51 ,  C07K14/575 ,  C12N1/21 ,  C07H21/04

CPC分类号： C07K14/51 ,  A61K38/00 ,  C07K14/475 ,  C07K14/575

摘要： A process for preparing a purified refolded monomer or dimer of a bone-derived factor, which comprises subjecting an inclusion body of a bone-derived factor produced by genetic engineering to the following steps a) to c) in sequence: a) introducing a polynucleotide encoding a bone morphogenetic factor into a bacterium, expressing said bone morphogenetic factor in the form of an inclusion body, recovering said inclusion body and treating it with a denaturing agent to obtain a solubilized monomer, b) treating the solubilized monomer without purification directly with a refolding solution to obtain a refolded monomeric bone morphogenetic factor, c) subjecting the refolded monomeric bone morphogenetic factor to purification.

摘要翻译： 一种制备骨源性因子的纯化的重折叠单体或二聚体的方法，其包括使基因工程产生的骨衍生因子的内含体按顺序步骤a）至c）：a）将多核苷酸 将骨形态发生因子编码成细菌，以包涵体的形式表达所述骨形态发生因子，回收所述包涵体并用变性剂处理以获得溶解的单体，b）直接用 重折叠溶液以获得重折叠的单体骨形态发生因子，c）使重折叠的单体骨形态发生因子进行纯化。

公开(公告)号：US06798045B2

公开(公告)日：2004-09-28

申请号：US09771912

申请日：2001-01-29

申请人： Jens Pohl ,  Simon Muff ,  Eckehard Miersch

发明人： Jens Pohl ,  Simon Muff ,  Eckehard Miersch

IPC分类号： H01L23495

CPC分类号： H01L23/5383 ,  H01L23/3677 ,  H01L23/49861 ,  H01L23/50 ,  H01L25/0657 ,  H01L2225/06527 ,  H01L2924/0002 ,  H01L2924/00

摘要： A lead frame is described which has at least one integrated electronic circuit. The integrated electronic circuit is situated in a region of a main area of the lead frame. The lead frame has at least one signal line, at least one electrically insulating plate, and an electrically conductive, grounded plate are situated. The electrically insulating plate, and the electrically conductive, grounded plate are situated, at least in sections, between the integrated electronic circuit and the signal line. A method for producing the lead frame is also described.

摘要翻译： 描述了具有至少一个集成电子电路的引线框架。 集成电子电路位于引线框架的主区域的区域中。 引线框架具有至少一个信号线，至少一个电绝缘板和导电接地板。 电绝缘板和导电接地板至少部分地位于集成电子电路和信号线之间。 还描述了用于制造引线框架的方法。

公开(公告)号：US06531450B2

公开(公告)日：2003-03-11

申请号：US08981490

申请日：1998-05-18

申请人： Gertrud Hötten ,  Jens Pohl ,  Rolf Bechtold ,  Michael Paulista ,  Klaus Unsicker

发明人： Gertrud Hötten ,  Jens Pohl ,  Rolf Bechtold ,  Michael Paulista ,  Klaus Unsicker

IPC分类号： A61R3818

CPC分类号： C07K14/475 ,  A61K38/1841 ,  C07K2319/00 ,  A61K2300/00

摘要： The present invention concerns the use of biologically active MP52 or/and MP121 for the treatment and prevention of diseases of the nervous system or/and for the treatment of neuropathological situations which are caused by ageing of the nervous system. A pharmaceutical agent according to the invention for the treatment and prevention of diseases of the nervous system or/and for treating neuropathological situations which are caused by ageing of the nervous system therefore contains biologically active MP52 or/and MP121 as the active substance.

摘要翻译： 本发明涉及生物活性MP52或/和MP121用于治疗和预防神经系统疾病和/或用于治疗由神经系统衰老引起的神经病理学情况的用途。 因此，根据本发明的用于治疗和预防由神经系统衰老引起的神经系统疾病和/或用于治疗神经病理学情况的本发明的药剂包含生物活性MP52或/和MP121作为活性物质。

公开(公告)号：US08361745B2

公开(公告)日：2013-01-29

申请号：US12374080

申请日：2007-07-17

申请人： Jens Pohl ,  Frank Ploeger

发明人： Jens Pohl ,  Frank Ploeger

IPC分类号： C12N15/00 ,  C12N15/09 ,  C12N15/12 ,  C12N15/19 ,  A61K38/00 ,  A61K38/16 ,  A61K38/17 ,  A61K38/18 ,  A61K38/19

CPC分类号： A61K38/1875 ,  A61K38/00 ,  A61K38/482 ,  C07K14/475

摘要： This invention relates to the production and use of pharmaceutical growth factor compositions with novel characteristics, e.g., improved solubility and controlled release characteristics under physiological conditions. Compositions of one or more precursor proteins of growth factors of the GDF family provoke morphogenic effects, such as growth, differentiation, protection and regeneration of a variety of tissues and organs, e.g., bone, cartilage, tendons, ligaments, nerves and skin. These compositions can be advantageously used for the healing of tissue-destructive injuries and for the prevention or therapy of degenerative disorders.

摘要翻译： 本发明涉及具有新特性的药物生长因子组合物的生产和使用，例如生理条件下溶解度和控制释放特性的改善。 GDF家族生长因子的一种或多种前体蛋白质的组成引起形态发生的作用，例如各种组织和器官（例如骨，软骨，腱，韧带，神经和皮肤）的生长，分化，保护和再生。 这些组合物可有利地用于组织破坏性损伤的愈合和用于预防或治疗退行性疾病。