公开(公告)号：US07485617B1

公开(公告)日：2009-02-03

申请号：US10550958

申请日：2004-03-26

申请人： Jens Pohl ,  Rolf Bechtold ,  Michael Kruse

发明人： Jens Pohl ,  Rolf Bechtold ,  Michael Kruse

IPC分类号： A61K38/00 ,  A61K38/16 ,  A61K38/17 ,  A61K38/18 ,  A61K9/00 ,  A61B17/56

CPC分类号： C07K14/51 ,  A61L27/34 ,  A61L27/56 ,  A61L2430/02 ,  C07K14/475 ,  C07K14/495 ,  C08L89/00

摘要： The present invention concerns improved osteoinductive materials comprising matrix materials and morphogenetic roteins, wherein depending on the subject matter the proteins may be dimeric or monomeric proteins. The osteoinductive materials according to the present invention have improved properties. The invention further concerns methods for producing the respective improved osteoinductive materials.

摘要翻译： 本发明涉及包含基质材料和形态发生蛋白质的改进的骨诱导材料，其中取决于主题，蛋白质可以是二聚体或单体蛋白质。 根据本发明的骨诱导材料具有改善的性质。 本发明还涉及生产各种改进的骨诱导材料的方法。

公开(公告)号：US20080203575A1

公开(公告)日：2008-08-28

申请号：US12116079

申请日：2008-05-06

申请人： Jochen Thomas ,  Peter Weitz ,  Jurgen Grafe ,  Harry Hedler ,  Jens Pohl

发明人： Jochen Thomas ,  Peter Weitz ,  Jurgen Grafe ,  Harry Hedler ,  Jens Pohl

IPC分类号： H01L23/482

CPC分类号： H01L25/0657 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06575 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012

摘要： An apparatus and a method of manufacture for a stacked-die assembly. A first die is placed on a substrate such that the backside of the die, i.e., the side opposite the side with the bond pads, is coupled to the substrate, preferably by an adhesive. Wire leads electrically couple the bond pads of the first die to contacts on the substrate. A second die is placed on the first die, and wire leads electrically couple the bond pads of the second die to contacts on the substrate. Preferably, a spacer is placed between the first die and the second die. Additional dies may be stacked on the second die.

摘要翻译： 堆叠式模具组件的装置和制造方法。 第一管芯被放置在衬底上，使得管芯的背面，即与接合焊盘的侧面相反的一侧，优选地通过粘合剂耦合到衬底。 引线将第一管芯的接合焊盘电耦合到衬底上的接触点。 第二管芯被放置在第一管芯上，引线将第二管芯的接合焊盘电耦合到衬底上的接触点。 优选地，间隔件被放置在第一管芯和第二管芯之间。 另外的模具可以堆叠在第二模具上。

公开(公告)号：US07129054B2

公开(公告)日：2006-10-31

申请号：US11132241

申请日：2005-05-19

申请人： Gertrud Hötten ,  Helge Neidhardt ,  Rolf Bechtold ,  Jens Pohl ,  Michael Paulista

发明人： Gertrud Hötten ,  Helge Neidhardt ,  Rolf Bechtold ,  Jens Pohl ,  Michael Paulista

IPC分类号： C07K16/24 ,  G01N33/53

CPC分类号： C07K16/22 ,  A61K38/00 ,  C07K14/495 ,  Y10S435/81 ,  Y10S435/975

摘要： The invention relates to an antibody or antibody fragment which specifically binds to a protein of the TGF-β family. The invention also relates to a kit for detecting a protein of the TGF-β family which comprises the antibody or antibody fragment. Finally, the invention relates to method for detecting a protein of the TGF-β family which uses the antibody or antibody fragment.

摘要翻译： 本发明涉及特异性结合TGF-β家族的蛋白质的抗体或抗体片段。 本发明还涉及用于检测包含抗体或抗体片段的TGF-β家族的蛋白质的试剂盒。 最后，本发明涉及检测使用该抗体或抗体片段的TGF-β家族的蛋白质的方法。

公开(公告)号：US20060189124A1

公开(公告)日：2006-08-24

申请号：US11350287

申请日：2006-02-09

申请人： Gottfried Beer ,  Jens Pohl

发明人： Gottfried Beer ,  Jens Pohl

IPC分类号： H01L21/4763 ,  H01L23/48

CPC分类号： H01L25/105 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor device includes a housing composition and a through contact extending through the housing composition. The through contact is provided in a contact hole formed through the housing composition and having an asymmetrical funnel form with at least two opposite inner wall sides oriented substantially perpendicular to the top side of the housing and a further inner wall side inclined in such a way that the contact hole has an elongated-hole cross section at the top side of the housing. In the region of the contact pad, the contact hole has a cross section adapted to the contact pad. The through contact includes a contact-making conductor track that extends from the top side of the housing along the inclined fourth inner wall side to the contact pad.

摘要翻译： 半导体器件包括壳体组合物和延伸穿过壳体组合物的通孔。 通孔形成在通过壳体组合物形成的接触孔中并且具有不对称的漏斗形式，其具有至少两个相对的内壁侧，该至少两个相对的内壁侧基本上垂直于壳体的顶侧定向，另外的内壁侧以如下方式倾斜： 接触孔在壳体的顶侧具有细长孔横截面。 在接触垫的区域中，接触孔具有适于接触垫的横截面。 通孔包括从壳体的顶侧沿着倾斜的第四内壁侧延伸到接触垫的接触导体轨迹。

公开(公告)号：US06534345B1

公开(公告)日：2003-03-18

申请号：US09514265

申请日：2000-02-28

申请人： Simon Muff ,  Jens Pohl ,  Johann Winderl

发明人： Simon Muff ,  Jens Pohl ,  Johann Winderl

IPC分类号： H01L2144

CPC分类号： H01L24/75 ,  H01L21/563 ,  H01L24/743 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082

摘要： In order to mount a semiconductor chip on a carrier layer, consolidated filler material is applied between the semiconductor chip and the carrier layer. The filler material is sucked, under the application of a partial vacuum, from at least one edge section of the semiconductor chip to at least one other edge section of the semiconductor chip. As a result, a package is provided in which the filler material is essentially free of air inclusions.

摘要翻译： 为了将半导体芯片安装在载体层上，固化的填充材料被施加在半导体芯片和载体层之间。 填充材料在部分真空下被从半导体芯片的至少一个边缘部分吸收到半导体芯片的至少另一个边缘部分。 结果，提供了其中填充材料基本上不含空气夹杂物的包装。

公开(公告)号：US06364751B1

公开(公告)日：2002-04-02

申请号：US09546421

申请日：2000-04-10

申请人： Jens Pohl ,  Oliver Wutz ,  Johann Winderl

发明人： Jens Pohl ,  Oliver Wutz ,  Johann Winderl

IPC分类号： B28D104

CPC分类号： H01L21/78 ,  Y10T83/687

摘要： Semiconductor components, which each include at least one semiconductor chip mounted on a common carrier substrate, are singled. The separation is effected by severing of the carrier substrate. The carrier substrate is thereby bent at least in that area of the carrier substrate which is to be severed. The severing takes place beginning from the convexly curved surface of the carrier substrate. In addition, the invention describes a singling device for separating semiconductor components.

摘要翻译： 单独地包括安装在公共载体衬底上的至少一个半导体芯片的半导体元件。 分离通过切断载体基底来实现。 因此，载体基板至少在要被切断的载体基板的那个区域中弯曲。 切断从载体基板的凸曲面开始发生。 此外，本发明描述了用于分离半导体部件的单一设备。

公开(公告)号：US06312962B1

公开(公告)日：2001-11-06

申请号：US09566936

申请日：2000-05-08

申请人： Thomas Münch ,  Jens Pohl ,  Oliver Wutz

发明人： Thomas Münch ,  Jens Pohl ,  Oliver Wutz

IPC分类号： H01L2166

CPC分类号： H01L24/83 ,  H01L24/32 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/00

摘要： A method for COB mounting of electronic chips on a circuit board includes contact connection of connecting wires and substantially whole-area adhesive bonding of a housing. A chip is partially adhesively bonded on a circuit board in such a way that the chip can be contact-connected and can be removed again without damage to the circuit board. Electronic tests or a burn-in process is performed on the chip. The chip, with a given functionality in a manner that is required for application of the circuit board, is fully adhesively bonding.

摘要翻译： 用于将电子芯片COB安装在电路板上的方法包括连接线的接触连接和壳体的基本全面的粘结。 芯片被部分地粘合在电路板上，使得芯片可以被接触连接并且可以再次被去除而不损坏电路板。 在芯片上执行电子测试或老化过程。 具有以电路板的应用所需的方式具有给定功能的芯片完全粘合。

公开(公告)号：US06197550B1

公开(公告)日：2001-03-06

申请号：US09054526

申请日：1998-04-03

申请人： Gertrud Hötten ,  Helge Neidhardt ,  Rolf Bechtold ,  Jens Pohl

发明人： Gertrud Hötten ,  Helge Neidhardt ,  Rolf Bechtold ,  Jens Pohl

IPC分类号： C12N1519

CPC分类号： C07K14/51 ,  A61K38/00 ,  C07K14/495

摘要： The invention provides DNA sequences encoding novel members of the TGF-&bgr; family of proteins. The TGF-&bgr; family comprises proteins which function as growth and/or differentiation factors and which are useful in medical applications. Accordingly, the invention also describes the isolation of the above-mentioned DNA sequences, the expression of the encoded proteins, the production of said proteins and pharmaceutical compositions containing said proteins.

摘要翻译： 本发明提供编码TGF-β蛋白家族的新成员的DNA序列。 TGF-β家族包含用作生长和/或分化因子并且可用于医学应用的蛋白质。 因此，本发明还描述了上述DNA序列的分离，编码蛋白质的表达，所述蛋白质的产生和含有所述蛋白质的药物组合物。

公开(公告)号：US06171584B2

公开(公告)日：2001-01-09

申请号：US09218176

申请日：1998-12-22

申请人： Gertrud Hötten ,  Helge Neidhardt ,  Rolf Bechtold ,  Jens Pohl ,  Michael Paulista

发明人： Gertrud Hötten ,  Helge Neidhardt ,  Rolf Bechtold ,  Jens Pohl ,  Michael Paulista

IPC分类号： A61K3819

CPC分类号： C07K14/495 ,  A61K38/00 ,  C07K14/51 ,  Y10S514/885

摘要： The invention concerns a protein of the TGF-&bgr; family, the DNA coding therefor and a pharmaceutical composition containing such protein.

摘要翻译： 本发明涉及TGF-β家族的蛋白质，其编码的DNA和含有这种蛋白质的药物组合物。

公开(公告)号：US6144088A

公开(公告)日：2000-11-07

申请号：US898734

申请日：1997-07-23

申请人： Jens Pohl ,  Michael Blumenauer ,  Ulrich Vidal

发明人： Jens Pohl ,  Michael Blumenauer ,  Ulrich Vidal

IPC分类号： H01L23/495 ,  H01L23/50 ,  H01L23/28 ,  H01L23/48 ,  H01L29/44

CPC分类号： H01L23/4951 ,  H01L2924/0002

摘要： A leadframe for connection to a semiconductor chip, in particular a metal leadframe, includes a plurality of lead prongs and at least two raised lead surfaces. When a semiconductor module that includes the leadframe and a semiconductor chip is sheathed with plastic, the raised lead surfaces assure a uniform flow of a plastic composition in a mold cavity and thus prevent air from becoming trapped in a plastic package. The lead surfaces are preferably created by folding over tabs in the leadframe. The invention also relates to preliminary stages of the leadframe and to semiconductor components that contain the leadframe of the invention.

摘要翻译： 用于连接到半导体芯片，特别是金属引线框架的引线框架包括多个引线插脚和至少两个凸起引线表面。 当包括引线框和半导体芯片的半导体模块被塑料覆盖时，升高的引线表面确保塑料组合物在模腔中的均匀流动，从而防止空气被捕获在塑料封装中。 引线表面优选通过折叠引线框架中的突出部而形成。 本发明还涉及引线框架和包含本发明引线框架的半导体部件的初步阶段。