公开(公告)号：US20140035041A1

公开(公告)日：2014-02-06

申请号：US13997972

申请日：2011-12-28

申请人： Ravi Pillarisetty ,  Charles C. Kuo ,  Han Wui Then ,  Gilbert Dewey ,  Willy Rachmady ,  Van H. Le ,  Marko Radosavljevic ,  Jack T. Kavalieros ,  Niloy Mukherjee

发明人： Ravi Pillarisetty ,  Charles C. Kuo ,  Han Wui Then ,  Gilbert Dewey ,  Willy Rachmady ,  Van H. Le ,  Marko Radosavljevic ,  Jack T. Kavalieros ,  Niloy Mukherjee

IPC分类号： H01L29/78 ,  H01L29/66 ,  G11C11/412

CPC分类号： H01L29/785 ,  G11C11/412 ,  H01L21/845 ,  H01L27/0688 ,  H01L27/1211 ,  H01L29/4232 ,  H01L29/42392 ,  H01L29/66795 ,  H01L29/78696

摘要： Embodiments of the present disclosure provide techniques and configurations for stacking transistors of a memory device. In one embodiment, an apparatus includes a semiconductor substrate, a plurality of fin structures formed on the semiconductor substrate, wherein an individual fin structure of the plurality of fin structures includes a first isolation layer disposed on the semiconductor substrate, a first channel layer disposed on the first isolation layer, a second isolation layer disposed on the first channel layer, and a second channel layer disposed on the second isolation layer, and a gate terminal capacitively coupled with the first channel layer to control flow of electrical current through the first channel layer for a first transistor and capacitively coupled with the second channel layer to control flow of electrical current through the second channel layer for a second transistor. Other embodiments may be described and/or claimed.

摘要翻译： 本公开的实施例提供了用于堆叠存储器件的晶体管的技术和配置。 在一个实施例中，一种装置包括半导体衬底，形成在半导体衬底上的多个翅片结构，其中，多个翅片结构的单个翅片结构包括设置在半导体衬底上的第一隔离层， 第一隔离层，设置在第一沟道层上的第二隔离层和设置在第二隔离层上的第二沟道层，以及与第一沟道层电容耦合以控制通过第一沟道层的电流的栅极端子 用于第一晶体管，并与第二沟道层电容耦合，以控制通过第二沟道层的电流流向第二晶体管。 可以描述和/或要求保护其他实施例。

公开(公告)号：US09343574B2

公开(公告)日：2016-05-17

申请号：US14688410

申请日：2015-04-16

申请人： Gilbert Dewey ,  Marko Radosavljevic ,  Ravi Pillarisetty ,  Benjamin Chu-Kung ,  Niloy Mukherjee

发明人： Gilbert Dewey ,  Marko Radosavljevic ,  Ravi Pillarisetty ,  Benjamin Chu-Kung ,  Niloy Mukherjee

IPC分类号： H01L29/00 ,  H01L29/78 ,  B82Y10/00 ,  H01L29/775 ,  H01L29/06 ,  H01L29/205 ,  H01L29/40 ,  H01L29/423 ,  H01L29/51 ,  H01L29/786 ,  H01L29/201 ,  B82Y99/00

CPC分类号： H01L29/0673 ,  B82Y10/00 ,  B82Y99/00 ,  H01L29/0665 ,  H01L29/201 ,  H01L29/205 ,  H01L29/408 ,  H01L29/4236 ,  H01L29/42364 ,  H01L29/42392 ,  H01L29/511 ,  H01L29/512 ,  H01L29/513 ,  H01L29/517 ,  H01L29/518 ,  H01L29/66462 ,  H01L29/775 ,  H01L29/78 ,  H01L29/785 ,  H01L29/78696

摘要： Non-planar semiconductor devices having group III-V material active regions with multi-dielectric gate stacks are described. For example, a semiconductor device includes a hetero-structure disposed above a substrate. The hetero-structure includes a three-dimensional group III-V material body with a channel region. A source and drain material region is disposed above the three-dimensional group III-V material body. A trench is disposed in the source and drain material region separating a source region from a drain region, and exposing at least a portion of the channel region. A gate stack is disposed in the trench and on the exposed portion of the channel region. The gate stack includes first and second dielectric layers and a gate electrode.

摘要翻译： 描述具有多电介质栅叠层的具有III-V族材料的区域的非平面半导体器件。 例如，半导体器件包括设置在衬底上的异质结构。 异质结构包括具有沟道区的三维III-V族材料体。 源极和漏极材料区域设置在三维III-V族材料体上方。 在源极和漏极材料区域中布置沟槽，其将源极区域与漏极区域分离，并且暴露沟道区域的至少一部分。 栅极堆叠设置在沟槽中和沟道区域的暴露部分上。 栅极堆叠包括第一和第二电介质层和栅电极。

公开(公告)号：US09018680B2

公开(公告)日：2015-04-28

申请号：US14340981

申请日：2014-07-25

申请人： Gilbert Dewey ,  Marko Radosavljevic ,  Ravi Pillarisetty ,  Benjamin Chu-Kung ,  Niloy Mukherjee

发明人： Gilbert Dewey ,  Marko Radosavljevic ,  Ravi Pillarisetty ,  Benjamin Chu-Kung ,  Niloy Mukherjee

IPC分类号： H01L29/66 ,  H01L29/40 ,  H01L29/78 ,  B82Y10/00 ,  H01L29/775 ,  H01L29/06 ,  H01L29/205 ,  H01L29/423 ,  H01L29/51 ,  H01L29/786 ,  B82Y99/00

CPC分类号： H01L29/0673 ,  B82Y10/00 ,  B82Y99/00 ,  H01L29/0665 ,  H01L29/201 ,  H01L29/205 ,  H01L29/408 ,  H01L29/4236 ,  H01L29/42364 ,  H01L29/42392 ,  H01L29/511 ,  H01L29/512 ,  H01L29/513 ,  H01L29/517 ,  H01L29/518 ,  H01L29/66462 ,  H01L29/775 ,  H01L29/78 ,  H01L29/785 ,  H01L29/78696

摘要： Non-planar semiconductor devices having group III-V material active regions with multi-dielectric gate stacks are described. For example, a semiconductor device includes a hetero-structure disposed above a substrate. The hetero-structure includes a three-dimensional group III-V material body with a channel region. A source and drain material region is disposed above the three-dimensional group III-V material body. A trench is disposed in the source and drain material region separating a source region from a drain region, and exposing at least a portion of the channel region. A gate stack is disposed in the trench and on the exposed portion of the channel region. The gate stack includes first and second dielectric layers and a gate electrode.

摘要翻译： 描述具有多电介质栅叠层的具有III-V族材料的区域的非平面半导体器件。 例如，半导体器件包括设置在衬底上的异质结构。 异质结构包括具有沟道区的三维III-V族材料体。 源极和漏极材料区域设置在三维III-V族材料体上方。 在源极和漏极材料区域中布置沟槽，其将源极区域与漏极区域分离，并且暴露沟道区域的至少一部分。 栅极堆叠设置在沟槽中和沟道区域的暴露部分上。 栅极堆叠包括第一和第二电介质层和栅电极。

公开(公告)号：US08823059B2

公开(公告)日：2014-09-02

申请号：US13629154

申请日：2012-09-27

申请人： Gilbert Dewey ,  Marko Radosavljevic ,  Ravi Pillarisetty ,  Benjamin Chu-Kung ,  Niloy Mukherjee

发明人： Gilbert Dewey ,  Marko Radosavljevic ,  Ravi Pillarisetty ,  Benjamin Chu-Kung ,  Niloy Mukherjee

IPC分类号： H01L29/78 ,  H01L29/06

CPC分类号： H01L29/0673 ,  B82Y10/00 ,  B82Y99/00 ,  H01L29/0665 ,  H01L29/201 ,  H01L29/205 ,  H01L29/408 ,  H01L29/4236 ,  H01L29/42364 ,  H01L29/42392 ,  H01L29/511 ,  H01L29/512 ,  H01L29/513 ,  H01L29/517 ,  H01L29/518 ,  H01L29/66462 ,  H01L29/775 ,  H01L29/78 ,  H01L29/785 ,  H01L29/78696

摘要： Non-planar semiconductor devices having group III-V material active regions with multi-dielectric gate stacks are described. For example, a semiconductor device includes a hetero-structure disposed above a substrate. The hetero-structure includes a three-dimensional group III-V material body with a channel region. A source and drain material region is disposed above the three-dimensional group III-V material body. A trench is disposed in the source and drain material region separating a source region from a drain region, and exposing at least a portion of the channel region. A gate stack is disposed in the trench and on the exposed portion of the channel region. The gate stack includes first and second dielectric layers and a gate electrode.

摘要翻译： 描述具有多电介质栅叠层的具有III-V族材料的区域的非平面半导体器件。 例如，半导体器件包括设置在衬底上的异质结构。 异质结构包括具有沟道区的三维III-V族材料体。 源极和漏极材料区域设置在三维III-V族材料体上方。 在源极和漏极材料区域中布置沟槽，其将源极区域与漏极区域分离，并且暴露沟道区域的至少一部分。 栅极堆叠设置在沟槽中和沟道区域的暴露部分上。 栅极堆叠包括第一和第二电介质层和栅电极。

公开(公告)号：US20140001519A1

公开(公告)日：2014-01-02

申请号：US13538985

申请日：2012-06-29

申请人： Gilbert Dewey ,  Marko Radosavljevic ,  Ravi Pillarisetty ,  Benjamin Chu-Kung ,  Niloy Mukherjee

发明人： Gilbert Dewey ,  Marko Radosavljevic ,  Ravi Pillarisetty ,  Benjamin Chu-Kung ,  Niloy Mukherjee

IPC分类号： H01L29/78 ,  H01L21/762

CPC分类号： H01L29/1054 ,  H01L21/76224 ,  H01L29/66795 ,  H01L29/785

摘要： A fin is formed over a first barrier layer over a substrate. The first barrier layer has a band gap greater than the band gap of the fin. In one embodiment, a gate dielectric layer is deposited on the top surface and opposing sidewalls of the fin and is adjacent to a second barrier layer deposited on the first barrier layer underneath the fin. In one embodiment, the gate dielectric layer is deposited on the top surface and the opposing sidewalls of the fin and an isolating layer is formed adjacent to the first barrier layer underneath the fin. In one embodiment, the gate dielectric layer is deposited on the top surface and the opposing sidewalls of the fin, and an isolating layer is formed adjacent to the second barrier layer deposited between the fin and the first barrier layer.

摘要翻译： 翅片形成在衬底上的第一阻挡层上。 第一阻挡层的带隙大于翅片的带隙。 在一个实施例中，栅极电介质层沉积在鳍的顶表面和相对侧壁上，并且与沉积在鳍下方的第一阻挡层上的第二势垒层相邻。 在一个实施例中，栅极电介质层沉积在顶表面上，翅片的相对的侧壁和隔离层邻近鳍片下方的第一阻挡层形成。 在一个实施例中，栅极电介质层沉积在鳍的顶表面和相对侧壁上，隔离层形成在沉积在鳍与第一阻挡层之间的第二势垒层附近。

公开(公告)号：US20110147706A1

公开(公告)日：2011-06-23

申请号：US12646697

申请日：2009-12-23

申请人： Marko Radosavljevic ,  Gilbert Dewey ,  Niloy Mukherjee ,  Ravi Pillarisetty

发明人： Marko Radosavljevic ,  Gilbert Dewey ,  Niloy Mukherjee ,  Ravi Pillarisetty

IPC分类号： H01L29/778 ,  H01L21/335

CPC分类号： H01L29/7782 ,  B82Y10/00 ,  H01L29/66431 ,  H01L29/66462 ,  H01L29/7783 ,  H01L29/7848

摘要： Embodiments of the present disclosure describe techniques and configurations to impart strain to integrated circuit devices such as horizontal field effect transistors. An integrated circuit device includes a semiconductor substrate, a first barrier layer coupled with the semiconductor substrate, a quantum well channel coupled to the first barrier layer, the quantum well channel comprising a first material having a first lattice constant, and a source structure coupled to the quantum well channel, the source structure comprising a second material having a second lattice constant, wherein the second lattice constant is different than the first lattice constant to impart a strain on the quantum well channel. Other embodiments may be described and/or claimed.

摘要翻译： 本公开的实施例描述了为诸如水平场效应晶体管等集成电路器件施加应变的技术和配置。 集成电路器件包括半导体衬底，与半导体衬底耦合的第一势垒层，耦合到第一势垒层的量子阱沟道，量子阱沟道包括具有第一晶格常数的第一材料和耦合到 量子阱沟道，源结构包括具有第二晶格常数的第二材料，其中第二晶格常数不同于在量子阱沟道上施加应变的第一晶格常数。 可以描述和/或要求保护其他实施例。

公开(公告)号：US09748338B2

公开(公告)日：2017-08-29

申请号：US13538985

申请日：2012-06-29

申请人： Gilbert Dewey ,  Marko Radosavljevic ,  Ravi Pillarisetty ,  Benjamin Chu-Kung ,  Niloy Mukherjee

发明人： Gilbert Dewey ,  Marko Radosavljevic ,  Ravi Pillarisetty ,  Benjamin Chu-Kung ,  Niloy Mukherjee

IPC分类号： H01L29/78 ,  H01L21/762 ,  H01L29/10 ,  H01L29/66

CPC分类号： H01L29/1054 ,  H01L21/76224 ,  H01L29/66795 ,  H01L29/785

摘要： A fin is formed over a first barrier layer over a substrate. The first barrier layer has a band gap greater than the band gap of the fin. In one embodiment, a gate dielectric layer is deposited on the top surface and opposing sidewalls of the fin and is adjacent to a second barrier layer deposited on the first barrier layer underneath the fin. In one embodiment, the gate dielectric layer is deposited on the top surface and the opposing sidewalls of the fin and an isolating layer is formed adjacent to the first barrier layer underneath the fin. In one embodiment, the gate dielectric layer is deposited on the top surface and the opposing sidewalls of the fin, and an isolating layer is formed adjacent to the second barrier layer deposited between the fin and the first barrier layer.

公开(公告)号：US20160233344A1

公开(公告)日：2016-08-11

申请号：US15134093

申请日：2016-04-20

申请人： Ravi Pillarisetty ,  Willy Rachmady ,  Van H. Le ,  Seung Hoon Sung ,  Jessica S. Kachian ,  Jack T. Kavalieros ,  Han Wui Then ,  Gilbert Dewey ,  Marko Radosavljevic ,  Benjamin Chu-Kung ,  Niloy Mukherjee

发明人： Ravi Pillarisetty ,  Willy Rachmady ,  Van H. Le ,  Seung Hoon Sung ,  Jessica S. Kachian ,  Jack T. Kavalieros ,  Han Wui Then ,  Gilbert Dewey ,  Marko Radosavljevic ,  Benjamin Chu-Kung ,  Niloy Mukherjee

IPC分类号： H01L29/786 ,  H01L29/423 ,  H01L29/66 ,  H01L29/06

CPC分类号： H01L29/78609 ,  H01L29/0653 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/165 ,  H01L29/205 ,  H01L29/42392 ,  H01L29/66742 ,  H01L29/785 ,  H01L29/78606 ,  H01L29/78618 ,  H01L29/78681 ,  H01L29/78684 ,  H01L29/78696

摘要： Deep gate-all-around semiconductor devices having germanium or group III-V active layers are described. For example, a non-planar semiconductor device includes a hetero-structure disposed above a substrate. The hetero-structure includes a hetero-junction between an upper layer and a lower layer of differing composition. An active layer is disposed above the hetero-structure and has a composition different from the upper and lower layers of the hetero-structure. A gate electrode stack is disposed on and completely surrounds a channel region of the active layer, and is disposed in a trench in the upper layer and at least partially in the lower layer of the hetero-structure. Source and drain regions are disposed in the active layer and in the upper layer, but not in the lower layer, on either side of the gate electrode stack.

公开(公告)号：US20150349077A1

公开(公告)日：2015-12-03

申请号：US14821561

申请日：2015-08-07

申请人： Ravi Pillarisetty ,  Willy Rachmady ,  Van H. Le ,  Seung Hoon Sung ,  Jessica S. Kachian ,  Jack T. Kavalieros ,  Han Wui Then ,  Gilbert Dewey ,  Marko Radosavljevic ,  Benjamin Chu-Kung ,  Niloy Mukherjee

发明人： Ravi Pillarisetty ,  Willy Rachmady ,  Van H. Le ,  Seung Hoon Sung ,  Jessica S. Kachian ,  Jack T. Kavalieros ,  Han Wui Then ,  Gilbert Dewey ,  Marko Radosavljevic ,  Benjamin Chu-Kung ,  Niloy Mukherjee

IPC分类号： H01L29/423 ,  H01L29/205 ,  H01L29/786 ,  H01L29/165 ,  H01L29/06

CPC分类号： H01L29/78609 ,  H01L29/0653 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/165 ,  H01L29/205 ,  H01L29/42392 ,  H01L29/66742 ,  H01L29/785 ,  H01L29/78606 ,  H01L29/78618 ,  H01L29/78681 ,  H01L29/78684 ,  H01L29/78696

摘要： Deep gate-all-around semiconductor devices having germanium or group III-V active layers are described. For example, a non-planar semiconductor device includes a hetero-structure disposed above a substrate. The hetero-structure includes a hetero-junction between an upper layer and a lower layer of differing composition. An active layer is disposed above the hetero-structure and has a composition different from the upper and lower layers of the hetero-structure. A gate electrode stack is disposed on and completely surrounds a channel region of the active layer, and is disposed in a trench in the upper layer and at least partially in the lower layer of the hetero-structure. Source and drain regions are disposed in the active layer and in the upper layer, but not in the lower layer, on either side of the gate electrode stack.

摘要翻译： 描述具有锗或III-V族有源层的深栅极全面半导体器件。 例如，非平面半导体器件包括设置在衬底上的异质结构。 异质结构包括不同组成的上层和下层之间的异质结。 有源层设置在杂结构上方，并且具有与异质结构的上层和下层不同的组成。 栅电极堆叠设置在有源层的沟道区上并完全包围有源层的沟道区，并且设置在上层中的沟槽中，并且至少部分地设置在异质结构的下层中。 源极和漏极区域设置在栅电极堆叠的任一侧上的有源层和上层中，而不是在下层中。

公开(公告)号：US08936976B2

公开(公告)日：2015-01-20

申请号：US12646711

申请日：2009-12-23

申请人： Marko Radosavljevic ,  Prashant Majhi ,  Jack T. Kavalieros ,  Niti Goel ,  Wilman Tsai ,  Niloy Mukherjee ,  Yong Ju Lee ,  Gilbert Dewey ,  Willy Rachmady

发明人： Marko Radosavljevic ,  Prashant Majhi ,  Jack T. Kavalieros ,  Niti Goel ,  Wilman Tsai ,  Niloy Mukherjee ,  Yong Ju Lee ,  Gilbert Dewey ,  Willy Rachmady

IPC分类号： H01L21/338 ,  H01L29/778 ,  H01L21/225 ,  H01L29/20 ,  H01L29/423 ,  H01L29/47 ,  H01L29/66

CPC分类号： H01L29/7786 ,  H01L21/2256 ,  H01L29/20 ,  H01L29/42316 ,  H01L29/47 ,  H01L29/66431 ,  H01L29/66462 ,  H01L29/7787

摘要： Conductivity improvements in III-V semiconductor devices are described. A first improvement includes a barrier layer that is not coextensively planar with a channel layer. A second improvement includes an anneal of a metal/Si, Ge or SiliconGermanium/III-V stack to form a metal-Silicon, metal-Germanium or metal-SiliconGermanium layer over a Si and/or Germanium doped III-V layer. Then, removing the metal layer and forming a source/drain electrode on the metal-Silicon, metal-Germanium or metal-SiliconGermanium layer. A third improvement includes forming a layer of a Group IV and/or Group VI element over a III-V channel layer, and, annealing to dope the III-V channel layer with Group IV and/or Group VI species. A fourth improvement includes a passivation and/or dipole layer formed over an access region of a III-V device.

摘要翻译： 描述了III-V半导体器件的电导率改进。 第一改进包括与通道层不共同平面的阻挡层。 第二个改进包括金属/ Si，Ge或硅锗/ III-V堆叠的退火，以在Si和/或锗掺杂的III-V层上形成金属硅，金属锗或金属硅锗层。 然后，去除金属层并在金属硅，金属锗或金属硅锗层上形成源/漏电极。 第三个改进包括在III-V沟道层上形成IV族和/或VI族元素的层，以及退火以使IV族和/或VI族物质掺杂III-V通道层。 第四个改进包括在III-V器件的接近区域上形成的钝化层和/或偶极层。