公开(公告)号：US07541449B2

公开(公告)日：2009-06-02

申请号：US11619699

申请日：2007-01-04

申请人： Cindy A. Sprecher ,  Walt Kisiel ,  Donald C. Foster

发明人： Cindy A. Sprecher ,  Walt Kisiel ,  Donald C. Foster

IPC分类号： C07H17/00

CPC分类号： C07K14/8114 ,  A61K38/00

摘要： The present invention provides isolated DNA molecules comprising a DNA segment encoding novel human Kunitz-type inhibitors. Also provided are DNA constructs comprising a first DNA segment encoding a novel human Kunitz-type inhibitor wherein said first DNA segment is operably linked to additional DNA segments required for the expression for the first DNA segment, as well as host cells containing such DNA constructs and methods for producing proteins from the host cells.

摘要翻译： 本发明提供了分离的DNA分子，其包含编码新型人Kunitz型抑制剂的DNA区段。 还提供了包含编码新型人Kunitz型抑制剂的第一DNA区段的DNA构建体，其中所述第一DNA区段可操作地连接到第一DNA区段的表达所需的另外的DNA区段，以及含有这种DNA构建体的宿主细胞， 从宿主细胞产生蛋白质的方法。

公开(公告)号：US07491800B2

公开(公告)日：2009-02-17

申请号：US10787442

申请日：2004-02-26

申请人： Julia E. Novak ,  Scott R. Presnell ,  Cindy A. Sprecher ,  Donald C. Foster ,  Richard D. Holly ,  Jane A. Gross ,  Janet V. Johnston ,  Andrew J. Nelson ,  Stacey R. Dillon ,  Angela K. Hammond

发明人： Julia E. Novak ,  Scott R. Presnell ,  Cindy A. Sprecher ,  Donald C. Foster ,  Richard D. Holly ,  Jane A. Gross ,  Janet V. Johnston ,  Andrew J. Nelson ,  Stacey R. Dillon ,  Angela K. Hammond

IPC分类号： C07K17/00 ,  C07K14/00 ,  A61K39/00

CPC分类号： C07K14/001 ,  A01K67/0275 ,  A01K2217/05 ,  A01K2227/105 ,  A01K2267/03 ,  A61K38/00 ,  A61K38/18 ,  C07K14/52 ,  C07K14/535 ,  C07K14/54 ,  C07K14/5406 ,  C07K14/715 ,  C07K16/24 ,  C07K16/2866 ,  C07K2317/73 ,  C07K2319/00 ,  C07K2319/21 ,  C07K2319/24 ,  C07K2319/30 ,  C07K2319/55 ,  C12N15/62 ,  C12N15/8509 ,  C12N2799/026 ,  G01N2333/52 ,  A61K2300/00

摘要： The present invention relates to zalpha11 Ligand polynucleotide and polypeptide molecules. The zalpha11 Ligand is a novel cytokine. The polypeptides may be used within methods for stimulating the proliferation and/or development of hematopoietic cells in vitro and in vivo. The present invention also includes methods for producing the protein, uses therefor and antibodies thereto.

摘要翻译： 本发明涉及zalpha11配体多核苷酸和多肽分子。 zalpha11配体是一种新型细胞因子。 多肽可用于在体外和体内刺激造血细胞的增殖和/或发育的方法中。 本发明还包括生产蛋白质的方法，用途及其抗体。

公开(公告)号：US07473765B2

公开(公告)日：2009-01-06

申请号：US10659684

申请日：2003-09-10

申请人： Julia E. Novak ,  Scott R. Presnell ,  Cindy A. Sprecher ,  Donald C. Foster ,  Richard D. Holly ,  Jane A. Gross ,  Janet V. Johnston ,  Andrew J. Nelson ,  Stacey R. Dillon ,  Angela K. Hammond

发明人： Julia E. Novak ,  Scott R. Presnell ,  Cindy A. Sprecher ,  Donald C. Foster ,  Richard D. Holly ,  Jane A. Gross ,  Janet V. Johnston ,  Andrew J. Nelson ,  Stacey R. Dillon ,  Angela K. Hammond

IPC分类号： C07K14/52 ,  C07K14/00 ,  A61K38/20 ,  C12N15/00 ,  C07H21/04

CPC分类号： C07K14/001 ,  A01K67/0275 ,  A01K2217/05 ,  A01K2227/105 ,  A01K2267/03 ,  A61K38/00 ,  A61K38/18 ,  C07K14/52 ,  C07K14/535 ,  C07K14/54 ,  C07K14/5406 ,  C07K14/715 ,  C07K16/24 ,  C07K16/2866 ,  C07K2317/73 ,  C07K2319/00 ,  C07K2319/21 ,  C07K2319/24 ,  C07K2319/30 ,  C07K2319/55 ,  C12N15/62 ,  C12N15/8509 ,  C12N2799/026 ,  G01N2333/52 ,  A61K2300/00

摘要： The present invention relates to zalpha11 Ligand polynucleotide and polypeptide molecules. The zalpha11 Ligand is a novel cytokine. The polypeptides may be used within methods for stimulating the proliferation and/or development of hematopoietic cells in vitro and in vivo. The present invention also includes methods for producing the protein, uses therefor and antibodies thereto.

摘要翻译： 本发明涉及zalpha11配体多核苷酸和多肽分子。 zalpha11配体是一种新型细胞因子。 多肽可用于在体外和体内刺激造血细胞的增殖和/或发育的方法中。 本发明还包括生产蛋白质的方法，用途及其抗体。

公开(公告)号：US06995459B2

公开(公告)日：2006-02-07

申请号：US11063299

申请日：2005-02-22

申请人： Choon Heung Lee ,  Donald C. Foster ,  Jeoung Kyu Choi ,  Wan Jong Kim ,  Kyong Hoon Youn ,  Sang Ho Lee ,  Sun Goo Lee

发明人： Choon Heung Lee ,  Donald C. Foster ,  Jeoung Kyu Choi ,  Wan Jong Kim ,  Kyong Hoon Youn ,  Sang Ho Lee ,  Sun Goo Lee

IPC分类号： H01L23/495

CPC分类号： H01L24/49 ,  H01L23/3107 ,  H01L23/49503 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2221/68377 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： In accordance with the present invention, there is provided a semiconductor package which includes a generally planar die paddle defining multiple peripheral edge segments and including at least two slots formed therein and extending along respective ones of a pair of the peripheral edge segments thereof. The semiconductor package further comprises a plurality of first leads which are segregated into at least two sets disposed within respective ones of the slots included in the die paddle. In addition to the first leads, the semiconductor package includes a plurality of second leads which are also segregated into at least two sets extending along respective ones of at least two peripheral edge segments of the die paddle in spaced relation thereto. Electrically connected to the top surface of the die paddle is at least one semiconductor die which is electrically connected to at least some of each of the first and second leads. At least portions of the die paddle, the first and second leads, and the semiconductor die are encapsulated by a package body, the bottom surfaces of the die paddle and the first leads being exposed in a common exterior surface of the package body.

摘要翻译： 根据本发明，提供了一种半导体封装，其包括限定多个外围边缘段的大致平坦的管芯片，并且包括形成在其中的至少两个槽，并沿其一对周边边缘段中的相应的一个延伸。 半导体封装还包括多个第一引线，它们分离成设置在包括在管芯焊盘中的各个槽中的至少两个组。 除了第一引线之外，半导体封装还包括多个第二引线，它们也分隔成至少两组，其间隔开的关系相对于管芯焊盘的至少两个周边边缘段的相应延伸。 电连接到管芯焊盘的顶表面的是至少一个半导体管芯，其电连接到第一和第二引线中的每一个的至少一些。 裸片，第一和第二引线和半导体管芯的至少一部分被封装主体封装，裸片焊盘的底表面和第一引线暴露在封装体的公共外表面中。

公开(公告)号：US06876068B1

公开(公告)日：2005-04-05

申请号：US10447012

申请日：2003-05-28

申请人： Choon Heung Lee ,  Donald C. Foster ,  Jeoung Kyu Choi ,  Wan Jong Kim ,  Kyong Hoon Youn ,  Sang Ho Lee ,  Sun Goo Lee

发明人： Choon Heung Lee ,  Donald C. Foster ,  Jeoung Kyu Choi ,  Wan Jong Kim ,  Kyong Hoon Youn ,  Sang Ho Lee ,  Sun Goo Lee

IPC分类号： H01L23/31 ,  H01L23/495

CPC分类号： H01L24/49 ,  H01L23/3107 ,  H01L23/49503 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2221/68377 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： In accordance with the present invention, there is provided a semiconductor package which includes a generally planar die paddle defining multiple peripheral edge segments and including at least two slots formed therein and extending along respective ones of a pair of the peripheral edge segments thereof. The semiconductor package further comprises a plurality of first leads which are segregated into at least two sets disposed within respective ones of the slots included in the die paddle. In addition to the first leads, the semiconductor package includes a plurality of second leads which are also segregated into at least two sets extending along respective ones of at least two peripheral edge segments of the die paddle in spaced relation thereto. Electrically connected to the top surface of the die paddle is at least one semiconductor die which is electrically connected to at least some of each of the first and second leads. At least portions of the die paddle, the first and second leads, and the semiconductor die are encapsulated by a package body, the bottom surfaces of the die paddle and the first leads being exposed in a common exterior surface of the package body.

摘要翻译： 根据本发明，提供了一种半导体封装，其包括限定多个外围边缘段的大致平坦的管芯片，并且包括形成在其中的至少两个槽，并沿其一对周边边缘段中的相应的一个延伸。 半导体封装还包括多个第一引线，它们分离成设置在包括在管芯焊盘中的各个槽中的至少两个组。 除了第一引线之外，半导体封装还包括多个第二引线，它们也分隔成至少两组，其间隔开的关系相对于管芯焊盘的至少两个周边边缘段的相应延伸。 电连接到管芯焊盘的顶表面的是至少一个半导体管芯，其电连接到第一和第二引线中的每一个的至少一些。 裸片，第一和第二引线和半导体管芯的至少一部分被封装主体封装，裸片焊盘的底表面和第一引线暴露在封装体的公共外表面中。

公开(公告)号：US06656746B2

公开(公告)日：2003-12-02

申请号：US09904621

申请日：2001-07-13

申请人： Cindy A. Sprecher ,  Walt Kisiel ,  Donald C. Foster

发明人： Cindy A. Sprecher ,  Walt Kisiel ,  Donald C. Foster

IPC分类号： C07K1638

CPC分类号： C07K14/8114 ,  A61K38/00

摘要： The present invention provides isolated DNA molecules comprising a DNA segment encoding novel human Kunitz-type inhibitors. Also provided are DNA constructs comprising a first DNA segment encoding a novel human Kunitz-type inhibitor wherein said first DNA segment is operably linked to additional DNA segments required for the expression for the first DNA segment, host cells containing such DNA constructs, methods for producing proteins from the host cells, as well as antibodies directed towards same.

摘要翻译： 本发明提供了分离的DNA分子，其包含编码新型人Kunitz型抑制剂的DNA区段。 还提供了包含编码新型人Kunitz型抑制剂的第一DNA区段的DNA构建体，其中所述第一DNA区段可操作地连接到第一DNA区段表达所需的其它DNA区段，含有这种DNA构建体的宿主细胞， 来自宿主细胞的蛋白质，以及针对其的抗体。

公开(公告)号：US06552416B1

公开(公告)日：2003-04-22

申请号：US09659017

申请日：2000-09-08

申请人： Donald C. Foster

发明人： Donald C. Foster

IPC分类号： H01L23495

CPC分类号： H01L24/49 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06572 ,  H01L2924/01013 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A multiple die package is formed, which allows multiple die to be interconnected using internal leads or traces from a lead frame. A plurality of slots in the paddle area of the lead frame are created which define the internal signal traces. Then the outer portions of the die paddle area of the lead frame are removed or trimmed to isolate the internal traces from each other and form a plurality of individual internal leads. Multiple die, either stacked, in a planar array, or a combination of the two, are connected to selected internal leads, such as by wire bonding, to form the desired die-to-die interconnections for routing signals between die without interfering with normal wire bond fan-out. A tape can be adhered to the interior portion of the die paddle area prior to trimming to hold the internal traces in place and leave the ends of the traces exposed for wire bonding to the die. The internal traces also allow connections to be made within a single die by wire bonding selected bond pads from the die via one or more of the internal traces.

摘要翻译： 形成多管芯封装，其允许使用来自引线框架的内部引线或迹线来互连多个管芯。 产生引线框架的桨区域中的多个槽，其定义内部信号迹线。 然后将引线框架的管芯焊盘区域的外部部分移除或修整以将内部迹线彼此隔离并形成多个独立的内部引线。 堆叠在平面阵列中的多个管芯或两者的组合通过引线接合连接到所选择的内部引线，以形成用于在管芯之间路由信号的期望的管芯到管芯互连，而不干扰正常 电线键盘扇出。 在修剪之前，可以将胶带粘附到模具片区域的内部部分，以将内部痕迹保持在适当位置，并将暴露的导线的端部露出以将线接合到模具。 内部迹线还允许通过一个或多个内部迹线将选定的接合焊盘从管芯引线接合而在单个管芯内进行连接。

公开(公告)号：US06271343B1

公开(公告)日：2001-08-07

申请号：US09071224

申请日：1998-05-01

申请人： Si Lok ,  Scott R. Presnell ,  Anna C. Jelmberg ,  Teresa Gilbert ,  Theodore E. Whitmore ,  Donald C. Foster ,  Robyn L. Adams ,  Joyce M. Lehner

发明人： Si Lok ,  Scott R. Presnell ,  Anna C. Jelmberg ,  Teresa Gilbert ,  Theodore E. Whitmore ,  Donald C. Foster ,  Robyn L. Adams ,  Joyce M. Lehner

IPC分类号： C07K14715

CPC分类号： C07K14/715

摘要： Novel receptor polypeptides, polynucleotides encoding the polypeptides, and related compositions. The polypeptides of the present invention can be used to down-regulate their natural ligands. The polynucleotides and subsequences thereof can be used as diagnostic probes to determine if chromosome 19 is mutated. The antibodies which bind to the polypeptides can be used to purify the receptors and to inhibit the binding of the ligands onto the receptors.

摘要翻译： 新型受体多肽，编码多肽的多核苷酸和相关组合物。 本发明的多肽可用于下调其天然配体。 其多核苷酸及其亚序列可用作诊断探针，以确定染色体19是否突变。 结合多肽的抗体可用于纯化受体并抑制配体结合到受体上。

公开(公告)号：US6111075A

公开(公告)日：2000-08-29

申请号：US53866

申请日：1998-04-01

申请人： Wen-feng Xu ,  Scott R. Presnell ,  David P. Yee ,  Donald C. Foster

发明人： Wen-feng Xu ,  Scott R. Presnell ,  David P. Yee ,  Donald C. Foster

IPC分类号： A61K38/00 ,  C07K14/705 ,  C12N15/12 ,  C07K7/06 ,  C07K7/08

CPC分类号： C07K14/705 ,  A61K38/00

摘要： The present invention relates to polynucleotide and polypeptide molecules for PAR4, a novel member of the protease-activated receptor family. The polypeptides, and polynucleotides encoding them, mediate biological responses and/or cellular signaling in response to proteases. Protease cleavage of PAR4 exposes a PAR4 extracellular amino terminal portion that serves as a ligand for the PAR4 receptor. PAR4 may be used as a target in drug screening, and further used to identify proteinaceous or non-proteinaceous PAR4 agonists and antagonists. The present invention also includes antibodies to the PAR4 polypeptides.

摘要翻译： 本发明涉及用于PAR4（蛋白酶活化受体家族的新成员）的多核苷酸和多肽分子。 多肽和编码它们的多核苷酸介导响应于蛋白酶的生物反应和/或细胞信号传导。 PAR4的蛋白酶切割暴露了作为PAR4受体配体的PAR4细胞外氨基末端部分。 PAR4可用作药物筛选中的靶标，并进一步用于鉴定蛋白质或非蛋白质PAR4激动剂和拮抗剂。 本发明还包括对PAR4多肽的抗体。

公开(公告)号：US06025176A

公开(公告)日：2000-02-15

申请号：US453040

申请日：1995-05-30

申请人： Ake Lernmark ,  Allan E. Karlsen ,  Catherine E. Grubin ,  William Hagopian ,  Patrick J. O'Hara ,  Donald C. Foster

发明人： Ake Lernmark ,  Allan E. Karlsen ,  Catherine E. Grubin ,  William Hagopian ,  Patrick J. O'Hara ,  Donald C. Foster

IPC分类号： A61K38/00 ,  A61K38/11 ,  A61P37/00 ,  C07K16/40 ,  C12N1/21 ,  C12N9/04 ,  C12N9/88 ,  C12N15/09 ,  C12R1/19 ,  G01N33/53 ,  G01N33/573 ,  C12N9/14 ,  A61K38/04 ,  C12P21/06

CPC分类号： C12N9/88 ,  C07K16/40 ,  A61K38/00

摘要： Human pancreatic islet cell glutamic acid decarboxylase (GAD), an autoantigen involved in the development of insulin-dependent diabetes mellitus (IDDM), has been cloned, sequenced and expressed by recombinant means. Recombinant human islet cell GAD polypeptides and antibodies specific to the GAD polypeptides can be used in methods of diagnosis and treatment, including use in immunoadsorptive therapy and the induction of immune tolerance.

摘要翻译： 人胰岛细胞谷氨酸脱羧酶（GAD）是一种参与胰岛素依赖型糖尿病（IDDM）发展的自身抗原，已通过重组手段进行克隆，测序和表达。 重组人胰岛细胞GAD多肽和对GAD多肽特异性的抗体可用于诊断和治疗的方法，包括用于免疫吸收治疗和诱导免疫耐受。