摘要:
A chemical mechanical polishing aqueous dispersion, including: (A) inorganic particles; (B) at least one type of particles selected from the group consisting of organic particles and organic-inorganic composite particles; (C) at least one compound selected from the group consisting of quinolinecarboxylic acid, quinolinic acid, a divalent organic acid (excluding quinolinic acid), and a hydroxyl acid; (D) at least one compound selected from the group consisting of benzotriazole and benzotriazole derivatives; (E) an oxidizing agent; and (F) water, the chemical mechanical polishing aqueous dispersion containing the component (A) in an amount of 0.05 to 2.0 wt % and the component (B) in an amount of 0.005 to 1.5 wt %, having a ratio (WA/WB) of the amount (WA) of the component (A) to the amount (WB) of the component (B) of 0.1 to 200, and having a pH of 1.0 to 5.0.
摘要:
An image processing and inspection system includes a master device (10) having a video camera (40) and a first controller (20) responsible for processing and inspecting the image of an object (1) in accordance with inspection criteria. Intercommunicated (12) with the master device (10) is a personal computer (100) equipped with a second monitor (120), and a second input member (102,104). The motion-picture taken by the camera (40) for inspection on the side of the master device (10) is transmitted to the computer (100) so as to be displayed on the second monitor (120) as a real-time image of the object (1) for easy confirmation of the object on the side of the computer (100), thereby enabling to determine the inspection criteria on the side of the computer (100) while monitoring the real-time image of the object (1).
摘要:
A chemical mechanical polishing aqueous dispersion, including: (A) abrasives; (B) an organic acid; (C) benzotriazole or a benzotriazole derivative; (D) a poly(meth)acrylate; (E) an oxidizing agent; and (F) water, the abrasives (A) being included in the chemical mechanical polishing aqueous dispersion in an amount of 2 to 10 wt %.
摘要:
A decoding system and method for providing relatively high likelihood of obtaining at least two paths of getting to each decoding state from at least three paths. The system and method also selects a maximum likelihood path from the two paths, where a log likelihood of getting to a state in the decoder is determined by a soft-input value encoded with a trellis so as to provide at least three paths for getting to the state.
摘要:
Error correction coding and decoding according to a serial concatenated modulation system are carried out under high code rate. A coding apparatus 1 comprises three convolutional coders 10, 30 and 50 for carrying out convolutional operation; two interleavers 20 and 40 for rearranging order of data input; and a multi-value mapping circuit 60 for carrying out mapping of a single point on the basis of a predetermined modulation system. The coding apparatus 1 carries out convolutional operation whose code rate is “⅔” as coding of extrinsic codes by a convolutional coder 10, and carries out convolutional operation whose code rate is “1” as coding of inner codes by a convolutional coder 50, and a multi-value modulation mapping circuit 60 applies mapping to a transmission symbol of a 8 PSK modulation system to output it as a single code transmission symbol.
摘要:
A cleaning composition for semiconductor components comprises a water-soluble polymer (a) having a specific molecular weight and a compound (b) represented by the following formula (1): NR4OH (1) wherein each R is independently a hydrogen atom or an alkyl group of 1 to 6 carbon atoms. A process for manufacturing a semiconductor device comprises chemical mechanical polishing a semiconductor component, and cleaning the semiconductor component with the cleaning composition for semiconductor components. The cleaning composition exerts a high cleaning effect on impurities remaining on a polished surface of a semiconductor component after chemical mechanical polishing, and becomes little burden on the environment.
摘要:
The present invention relates to a method of embedding an additional layer of error correction into an error correcting code, wherein information is encoded into code words of said code over a first Galois field and wherein a number of code words rare arranged in the columns of a code block comprising a user data sub-block and a parity data sub-block In order to provide an additional layer of error correction that can be easily implemented without losing compatibility improving the error correction capabilities, a method is proposed comprising the steps of:—encoding the rows of at least said user data sub-block separately or in groups using a horizontal error correcting code over a second Galois field larger than said first Galois field to obtain horizontal parities,—embedding said horizontal parities as additional layer in said error correcting code.
摘要:
To carry out error correction coding and decoding according to a serially concatenated coded modulation system with a small circuit scale and high performance. A coding apparatus 1 is designed so that an interleaver 20 interleaves order of bits so that all weights are coded by a convolutional coder 30 with respect to data comprising a series of 3 bits supplied from a convolutional coder 10; the convolutional coder 30 makes as small as possible the total value of the hamming distance of input bit between passes to be the minimum Euclidean distance with respect to data of 3 bits supplied from the interleaver 20; and a multi-value modulation mapping circuit 40 causes the hamming distance of input bits in the convolutional coder 30 as the distance between signal point on the I/Q plane is smaller to subject data of 3 bits supplied from the convolutional coder 30 to mapping.
摘要:
The object of the present invention is to provide an aqueous dispersion for chemical mechanical polishing which can be polished working film for semiconductor devices and which is useful for STI. The aqueous dispersion for chemical mechanical polishing of the invention is characterized by comprising an inorganic abrasive such as silica, ceria and the like, and organic particles composed of a resin having anionic group such as carboxyl group into the molecular chains. The removal rate for silicon oxide film is at least 5 times, particularly 10 times the removal rate for silicon nitride film. The aqueous dispersion may also contain an anionic surfactant such as potassium dodecylbenzene sulfonate and the like. And a base may also be included in the aqueous dispersion for adjustment og the pH to further enhance the dispersability, removal rate and selectivity.