摘要:
A silicide film is provided in diffusion regions formed in a semiconductor layer. The silicide film has a thickness substantially same as that of the semiconductor layer. The silicide film has the bottom located in the vicinity of an interface between the insulator film and the semiconductor layer.
摘要:
A semiconductor storage device, has a first conductive type semiconductor region formed on a semiconductor substrate, a plurality of second conductive type semiconductor regions formed separately from each other on the first conductive type semiconductor region, a plurality of MOSFETs each formed on the plurality of second conductive type semiconductor regions, and element isolating regions each formed between the adjacent second conductive type semiconductor regions, a bottom surface of which being located in the first conductive type semiconductor region, wherein the number of crystal defects per unit volume in the first conductive type semiconductor region is larger than the number of the crystal defects per unit volume in the second conductive type semiconductor regions.
摘要:
An insulated gate type field effect transistor in a memory cell array is a transistor having a gate insulating film which is thicker than a gate insulating film of an insulated gate type field effect transistor in an array peripheral circuit. DRAM (Dynamic Random Access Memory) cell-based semiconductor memory device can be implemented which allows a burn-in test to be accurately performed without degrading sensing operation characteristics even under a low power supply voltage.
摘要:
A semiconductor device includes a substrate having first to fourth regions, a first insulating film formed on the substrate in the first region, a first epitaxial layer formed on the substrate in the second region and having an upper surface higher than an upper surface of the first insulating film, a first semiconductor layer formed on the first insulating film with a space provided with respect to the first epitaxial layer and having an upper surface set at substantially the same height as the upper surface of the first epitaxial layer, and an element isolation insulating film formed in the space and having an upper surface set at substantially the same height as the upper surface of the first epitaxial layer and the upper surface of the first semiconductor layer.
摘要:
A semiconductor chip is provided with a phase comparison circuit (1), in addition to an integrated circuit implementing a normal operation. The phase comparison circuit (1) compares phases between an internal signal (A) of the integrated circuit and an external signal and outputs a monitor signal (MONSIG) expressing the result of this comparison outward from the semiconductor chip. Thus, the phase of the internal signal (A) of the integrated circuit can be directly detected.
摘要:
A semiconductor device includes a substrate having first to fourth regions, a first insulating film formed on the substrate in the first region, a first epitaxial layer formed on the substrate in the second region and having an upper surface higher than an upper surface of the first insulating film, a first semiconductor layer formed on the first insulating film with a space provided with respect to the first epitaxial layer and having an upper surface set at substantially the same height as the upper surface of the first epitaxial layer, and an element isolation insulating film formed in the space and having an upper surface set at substantially the same height as the upper surface of the first epitaxial layer and the upper surface of the first semiconductor layer.
摘要:
A semiconductor chip is provided with a phase comparison circuit (1), in addition to an integrated circuit implementing a normal operation. The phase comparison circuit (1) compares phases between an internal signal (A) of the integrated circuit and an external signal and outputs a monitor signal (MONSIG) expressing the result of this comparison outward from the semiconductor chip. Thus, the phase of the internal signal (A) of the integrated circuit can be directly detected.
摘要:
A clock signal, which is generated by utilizing a delay circuit having a delay time depending on the operation frequency of an internal clock signal, is applied to a first circuit for activation thereof, and a clock signal, which has a fixed delay not dependent on the clock frequency and is adjusted in phase with respect to an external clock signal, is applied to a second circuit receiving the output signal of the first circuit for operation thereof. Thus, the operation timing of the second circuit can be set to be as late as possible. Consequently, it is possible to mitigate the operation conditions of the first circuit, to achieve a high speed data transfer. Even in the high speed operation, internal data can be reliably taken in, and transferred accurately.
摘要:
A semiconductor memory device wherein, if an address-input buffer section 3 is arranged away from a central part of a memory chip 8, then a second address-latch circuit section 5 is arranged at a neighborhood of the address-input buffer section 3. By this means, the deterioration of the setup/hold characteristics in the address data IA[0-12] of the internal address signal due to coupling noise between wiring lines and the like can be prevented. A first address-latch circuit section 4 is arranged at a central part of the memory chip 8, so that delays in a bank-control signal for memory banks 2a to 2d and the like can be prevented. Further, if the address-input buffer section 3 is divided into a plurality of address-input buffers, for example, two buffers 3a and 3b, and arranged on the memory chip 8, then the second address-latch circuit section 5 is also divided into two address-latch circuits 5a and 5b, corresponding to the address-input buffers 3a and 3b, and the address-latch circuit 5a is arranged at a neighborhood of the address-input buffer 3a, and the address-latch circuit 5b is arranged at a neighborhood of the address-input buffer 3b.
摘要:
A pattern density inspection apparatus is provided which improves the detection accuracy of a pattern data density error region, and outputs detection results for a designer to efficiently perform a correction operation without performing detection of pattern data density error regions which do not require correction. A control section 1 reads out layout data from a layout storage section 2, and stores this in an input processing section 3 and an output processing section 7. A data density computation processing section 4, while displacing layout data of the input processing section 3 from a position where pattern data was computed immediately before, in either one of an X axis direction and a Y axis direction, performs computations of the pattern density in the detection range after movement, and judges if the pattern data density is above 50%, and makes that above 50% a temporary error region. An error overlap removal processing section 5 takes a logical sum of temporary error regions, and creates an aggregate temporary error region. An error region width computation processing section 6 judges if an aggregate temporary error region is an error shape which contains a 400 &mgr;m square error judgment reference shape.