Thin film transistor, display device and liquid crystal display device and method for manufacturing the same
    71.
    发明授权
    Thin film transistor, display device and liquid crystal display device and method for manufacturing the same 有权
    薄膜晶体管,显示装置和液晶显示装置及其制造方法

    公开(公告)号:US08619219B2

    公开(公告)日:2013-12-31

    申请号:US13552845

    申请日:2012-07-19

    IPC分类号: G02F1/1333

    摘要: As a wiring becomes thicker, discontinuity of an insulating film covering the wiring has become a problem. It is difficult to form a wiring with width thin enough for a thin film transistor used for a current high definition display device. As a wiring is made thinner, signal delay due to wiring resistance has become a problem. In view of the above problems, the invention provides a structure in which a conductive film is formed in a hole of an insulating film, and the surfaces of the conductive film and the insulating film are flat. As a result, discontinuity of thin films covering a conductive film and an insulating film can be prevented. A wiring can be made thinner by controlling the width of the hole. Further, a wiring can be made thicker by controlling the depth of the hole.

    摘要翻译: 随着布线变厚,覆盖布线的绝缘膜的不连续性成为问题。 对于用于当前的高分辨率显示装置的薄膜晶体管,难以形成宽度足够薄的布线。 由于布线变薄,由于布线电阻引起的信号延迟已经成为问题。 鉴于上述问题,本发明提供一种在绝缘膜的孔中形成导电膜,并且导电膜和绝缘膜的表面平坦的结构。 结果,可以防止覆盖导电膜和绝缘膜的薄膜的不连续性。 通过控制孔的宽度可以使布线更薄。 此外,通过控制孔的深度,可以使布线变厚。

    THIN FILM TRANSISTOR, DISPLAY DEVICE AND LIQUID CRYSTAL DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME
    72.
    发明申请
    THIN FILM TRANSISTOR, DISPLAY DEVICE AND LIQUID CRYSTAL DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
    薄膜晶体管,显示装置和液晶显示装置及其制造方法

    公开(公告)号:US20120282717A1

    公开(公告)日:2012-11-08

    申请号:US13552845

    申请日:2012-07-19

    IPC分类号: H01L33/44

    摘要: As a wiring becomes thicker, discontinuity of an insulating film covering the wiring has become a problem. It is difficult to form a wiring with width thin enough for a thin film transistor used for a current high definition display device. As a wiring is made thinner, signal delay due to wiring resistance has become a problem. In view of the above problems, the invention provides a structure in which a conductive film is formed in a hole of an insulating film, and the surfaces of the conductive film and the insulating film are flat. As a result, discontinuity of thin films covering a conductive film and an insulating film can be prevented. A wiring can be made thinner by controlling the width of the hole. Further, a wiring can be made thicker by controlling the depth of the hole.

    摘要翻译: 随着布线变厚,覆盖布线的绝缘膜的不连续性成为问题。 对于用于当前的高分辨率显示装置的薄膜晶体管,难以形成宽度足够薄的布线。 由于布线变薄,由于布线电阻引起的信号延迟已经成为问题。 鉴于上述问题,本发明提供一种在绝缘膜的孔中形成导电膜,并且导电膜和绝缘膜的表面平坦的结构。 结果,可以防止覆盖导电膜和绝缘膜的薄膜的不连续性。 通过控制孔的宽度可以使布线更薄。 此外,通过控制孔的深度,可以使布线变厚。

    Method for forming wiring, method for manufacturing thin film transistor and droplet discharging method
    73.
    发明授权
    Method for forming wiring, method for manufacturing thin film transistor and droplet discharging method 有权
    形成布线的方法,薄膜晶体管的制造方法和液滴喷射方法

    公开(公告)号:US07968461B2

    公开(公告)日:2011-06-28

    申请号:US10575492

    申请日:2004-10-25

    IPC分类号: H01L21/44

    摘要: It is required that a line width of a wiring is prevented from being wider to be miniaturized when the wiring or the like is formed by a dropping method typified by an ink-jetting method. Therefore, the invention provides a method for narrowing (miniaturizing) the line width according to a method different from a conventional method. A region to be liquid-repellent is formed and further, a region to be lyophilic is formed selectively in the region to be liquid-repellent in a surface for forming a pattern, before forming a desired pattern. After that, a pattern for a wiring or the like is formed in the lyophilic region by a dropping method typified by an ink-jetting method for dropping a composition including a conductive material for the wiring or the like.

    摘要翻译: 当通过喷墨法代表的滴落方法形成布线等时,要求布线的线宽被更宽地小型化。 因此,本发明提供了一种根据与传统方法不同的方法来缩小(小型化)线宽的方法。 形成防液体的区域,此外,在形成所需图案之前,在用于形成图案的表面中,在要斥液的区域中选择性地形成要进行亲液化的区域。 之后,通过滴落方式形成用于布线等的图案,该滴加方法是通过用于滴加包括用于布线的导电材料等的组合物的喷墨方法。

    Liquid droplet ejection system and control program of ejection condition of compositions
    74.
    发明申请
    Liquid droplet ejection system and control program of ejection condition of compositions 审中-公开
    液滴喷射系统和组合物喷射条件控制程序

    公开(公告)号:US20050122351A1

    公开(公告)日:2005-06-09

    申请号:US10970712

    申请日:2004-10-21

    摘要: When using a liquid droplet ejection method, a conventional photomask is not required, however, it is required instead that a moving path of a nozzle or a substrate is controlled with accuracy at least in ejecting liquid droplets. According to the characteristics of compositions to be ejected or their pattern, such ejection conditions are desirably set as the moving rate of a nozzle or a substrate, ejection quantity, ejection distance and ejection rate of compositions, atmosphere of the space that the compositions are ejected, the temperature and moisture of the space, and heating temperature of the substrate. A liquid droplet ejection system in accordance with the invention comprises an input means for inputting data of a thin film pattern, a set means for setting a nozzle for a ejecting a composition containing a material for forming the thin film or setting a moving path of the substrate to which the composition is ejected, an image pick-up means for detecting an alignment marker formed on a substrate and a control means for controlling the moving path of the nozzle or the substrate.

    摘要翻译: 当使用液滴喷射方法时,不需要常规的光掩模,然而,需要至少在喷射液滴时精确地控制喷嘴或基板的移动路径。 根据要喷射的组合物或其图案的特征,这种喷射条件期望设置为喷嘴或基底的移动速率,喷射量,喷射距离和组合物的喷射速率,组合物喷出的空间的气氛 ,空间的温度和湿度,以及基板的加热温度。 根据本发明的液滴喷射系统包括用于输入薄膜图案的数据的输入装置,用于设置用于喷射包含用于形成薄膜的材料的组合物的喷嘴的设定装置或设置该薄膜图案的移动路径 用于检测形成在基板上的取向标记的图像拾取装置和用于控制喷嘴或基板的移动路径的控制装置。

    Droplet jetting device and method of manufacturing pattern
    75.
    发明授权
    Droplet jetting device and method of manufacturing pattern 有权
    液滴喷射装置及其制造方法

    公开(公告)号:US07393081B2

    公开(公告)日:2008-07-01

    申请号:US10879800

    申请日:2004-06-29

    IPC分类号: B41J2/15 H01L21/00

    摘要: The present invention provides a method of manufacturing a pattern with a flattened surface and a droplet jetting device which can provides the pattern with a flattened surface. A droplet jetting means of the present invention comprises a droplet jetting means having a plurality of nozzles arranged in each row, each of the plurality of nozzles has a plurality of discharge ports aligned in an axial direction, and diameters of the discharge ports for the plurality of nozzles differ from row to row. According to one aspect of the present invention, a droplet jetting means including a plurality of nozzles arranged in two rows with a plurality of discharge ports aligned in an axial direction in each row, comprising steps of: forming a first pattern by jetting a composition through the plurality of nozzles in the first row; and forming a second pattern by selectively jetting the composition through the plurality of nozzles in the second row, wherein discharge amounts the composition jetted from each of the plurality of nozzles aligned in the first row and the second row differ from each other.

    摘要翻译: 本发明提供一种制造具有平坦表面的图案的方法和能够为图案提供扁平表面的液滴喷射装置。 本发明的液滴喷射装置包括具有布置在每排中的多个喷嘴的液滴喷射装置,多个喷嘴中的每一个喷嘴具有沿轴向排列的多个排出口,并且用于多个喷嘴的排出口的直径 的喷嘴不同。 根据本发明的一个方面,一种液滴喷射装置,包括排列成两排的多个喷嘴,多个排出口在每一排沿轴向排列,包括以下步骤:通过喷射组合物形成第一图案 第一排中的多个喷嘴; 并且通过选择性地喷射组合物通过第二排中的多个喷嘴形成第二图案,其中排出量从在第一排和第二排中排列的多个喷嘴中的每一个喷射的组合物彼此不同。

    Manufacturing method of semiconductor device
    76.
    发明授权
    Manufacturing method of semiconductor device 失效
    半导体器件的制造方法

    公开(公告)号:US07727854B2

    公开(公告)日:2010-06-01

    申请号:US10573155

    申请日:2004-12-14

    IPC分类号: H01L21/76

    摘要: An IC card is more expensive than a magnetic card, and an electronic tag is also more expensive as a substitute for bar codes. Therefore, the present invention provides an extremely thin integrated circuit that can be mass-produced at low cost unlike a chip of a conventional silicon wafer, and a manufacturing method thereof. One feature of the present invention is that a thin integrated circuit is formed by a formation method that can form a pattern selectively, on a glass substrate, a quartz substrate, a stainless substrate, a substrate made of synthetic resin having flexibility, such as acryl, or the like except for a bulk substrate. Further, another feature of the present invention is that an ID chip in which a thin film integrated circuit and an antenna according to the present invention are mounted is formed.

    摘要翻译: IC卡比磁卡贵,电子标签也更昂贵代替条形码。 因此,本发明提供了与常规硅晶片的芯片相比可以以低成本批量生产的极薄的集成电路及其制造方法。 本发明的一个特征在于,通过可以在玻璃基板,石英基板,不锈钢基板,具有柔软性的合成树脂制成的基板(例如丙烯酸酯)上形成图案的形成方法形成薄的集成电路 ,或类似物,除了大量衬底。 此外,本发明的另一个特征是形成其中安装有根据本发明的薄膜集成电路和天线的ID芯片。

    Semiconductor device and method for manufacturing the same
    77.
    发明申请
    Semiconductor device and method for manufacturing the same 失效
    半导体装置及其制造方法

    公开(公告)号:US20070004100A1

    公开(公告)日:2007-01-04

    申请号:US10573155

    申请日:2004-12-14

    IPC分类号: H01L21/84 H01L31/113

    摘要: An IC card is more expensive than a magnetic card, and an electronic tag is also more expensive as a substitute for bar codes. Therefore, the present invention provides an extremely thin integrated circuit that can be mass-produced at low cost unlike a chip of a conventional silicon wafer, and a manufacturing method thereof. One feature of the present invention is that a thin integrated circuit is formed by a formation method that can form a pattern selectively, on a glass substrate, a quartz substrate, a stainless substrate, a substrate made of synthetic resin having flexibility, such as acryl, or the like except for a bulk substrate. Further, another feature of the present invention is that an ID chip in which a thin film integrated circuit and an antenna according to the present invention are mounted is formed.

    摘要翻译: IC卡比磁卡贵,电子标签也更昂贵代替条形码。 因此,本发明提供了与常规硅晶片的芯片相比可以以低成本批量生产的极薄的集成电路及其制造方法。 本发明的一个特征在于,通过可以在玻璃基板,石英基板,不锈钢基板,具有柔软性的合成树脂制成的基板(例如丙烯酸酯)上形成图案的形成方法形成薄的集成电路 ,或类似物,除了大量衬底。 此外,本发明的另一个特征是形成其中安装有根据本发明的薄膜集成电路和天线的ID芯片。

    Thin film transistor, manufacturing method for thin film transistor and manufacturing method for display device
    79.
    发明申请
    Thin film transistor, manufacturing method for thin film transistor and manufacturing method for display device 审中-公开
    薄膜晶体管,薄膜晶体管的制造方法及显示装置的制造方法

    公开(公告)号:US20070164280A1

    公开(公告)日:2007-07-19

    申请号:US10569595

    申请日:2004-08-25

    IPC分类号: H01L29/04

    摘要: The present invention provides a thin film transistor that can be manufactured at lower cost and at higher yield by simplifying a manufacturing process, a manufacturing method thereof, and a manufacturing method of a display device using the thin film transistor. According to this invention, a pattern used in a pattering process is formed by using a droplet discharging method. The pattern is formed by selectively discharging a composition comprising an organic resin. By using the pattern, an electrically conductive material, an insulator or semiconductor constituting a semiconductor element, are patterned into a desired shape by a simple process.

    摘要翻译: 本发明提供一种薄膜晶体管,其可以通过简化制造工艺,其制造方法和使用薄膜晶体管的显示装置的制造方法以较低的成本和更高的产率制造。 根据本发明,通过使用液滴喷射法形成用于图案化处理的图案。 通过选择性地排出包含有机树脂的组合物形成图案。 通过使用该图案,构成半导体元件的导电材料,绝缘体或半导体通过简单的工艺被图案化成所需的形状。

    Fabrication method of a semiconductor device using liquid repellent film
    80.
    发明授权
    Fabrication method of a semiconductor device using liquid repellent film 有权
    使用防液膜的半导体器件的制造方法

    公开(公告)号:US07399704B2

    公开(公告)日:2008-07-15

    申请号:US10954286

    申请日:2004-10-01

    IPC分类号: H01L21/44

    摘要: In the case where a contact hole is formed by a conventional process of the semiconductor device fabrication, a resist is required to be formed almost entirely over a substrate in order to form the resist over the film where the contact hole is not formed. Accordingly, the throughput is considerably low. Further, when the resist spreads to the area of the contact hole when the amount of the resist to be applied and the surface state of the base are not fully controlled, contact defect would occur. Thus, improvements are required. According to the invention, in forming a semiconductor device, a part to be a contact hole of the semiconductor device may be covered with a first organic film that is liquid repellent. Subsequently, a second organic film serving as an insulating film is formed on the area where the first organic film is not formed, and the first organic film is removed thereafter to form a contact hole.

    摘要翻译: 在通过半导体器件制造的传统工艺形成接触孔的情况下,为了在没有形成接触孔的膜上形成抗蚀剂,需要将抗蚀剂几乎整个地形成在基板上。 因此,吞吐量相当低。 此外,当未施加抗蚀剂的量和基体的表面状态未完全控制时,当抗蚀剂扩散到接触孔的区域时,会发生接触不良。 因此,需要进行改进。 根据本发明,在形成半导体器件时,半导体器件的接触孔的一部分可被第一有机膜覆盖,该第一有机膜是疏液性的。 随后,在没有形成第一有机膜的区域上形成用作绝缘膜的第二有机膜,之后除去第一有机膜以形成接触孔。