摘要:
The present invention teaches a field emission display ("FED") architecture for isolating display grids, wherein an FED has a plurality of pixels. Each of the pixels comprise at least two field emitter tips for displaying information to the pixel and a pixelator for driving the field emitter tips. Further, an isolated display grid is incorporated for each of the field emitter tips. Each display grids is coupled to a bus having a predetermined voltage by a link. In one embodiment of the present invention, the link can be disintegrated by internal or external means. In a second embodiment, the FED comprises a first and second bus, each of bus having a predetermined voltage, whereby a first isolated display grid is coupled to the first bus by a first link and a second isolated display grids is coupled to the second bus by a second link.
摘要:
Described herein is a reference voltage circuit which includes, in combination, a bit line and first and second word line reference transistors connected to the bit line and operative to be turned on with a reference pulse simultaneously with the turning on of the word lines in the main memory circuit. First and second ferroelectric capacitors are connected to each of the first and second word line reference transistors, respectively, and to a source of plate line switching voltage, and a first precharging transistor is connected between the first ferroelectric capacitor and ground potential. A second precharging transistor is connected between the second ferroelectric capacitor and a further source of switching voltage, so that the first and second ferroelectric capacitors are polarized in a ONE and ZERO state in the manner identical to the logic states of the ferroelectric capacitors in the main ferroelectric memory circuit. Thus, when the first and second word line reference transistors turn on, the bit line reference voltage is raised above ground potential by the sum of the voltages of the first and second ferroelectric capacitors. This in turn causes the bit line reference voltage, BL, to track the voltage variations of the ferroelectric capacitors in the main memory circuit, thus providing improved margins for the BL and BL complementary signals which are sensed by a plurality of sense amplifiers for the main memory circuit.
摘要:
Described herein is a reference voltage circuit which includes, in combination, a bit line and first and second word line reference transistors connected to the bit line and operative to be turned on with a reference pulse simultaneously with the turning on of the word lines in the main memory circuit. First and second ferroelectric capacitors are connected to each of the first and second word line reference transistors, respectively, and to a source of plate line switching voltage, and a first precharging transistor is connected between the first ferroelectric capacitor and ground potential. A second precharging transistor is connected between the second ferroelectric capacitor and a further source of switching voltage, so that the first and second ferroelectric capacitors are polarized in a ONE and ZERO state in the manner identical to the logic states of the ferroelectric capacitors in the main ferroelectric memory circuit. Thus, when the first and second word line reference transistors turn on, the bit line reference voltage is raised above ground potential by the sum of the voltages of the first and second ferroelectric capacitors. This in turn causes the bit line reference voltage, BL, to track the voltage variations of the ferroelectric capacitors in the main memory circuit, thus providing improved margins for the BL and BL complementary signals which are sensed by a plurality of sense amplifiers for the main memory circuit.
摘要:
A chemical mechanical polishing process for the formation of self-aligned gate structures surrounding an electron emission tip for use in field emission displays in which the emission tip is i) optionally sharpened through oxidation, ii) deposited with a conformal insulating material, iii) deposited with a flowable insulating material, which is reflowed below the level of the tip, iv) optionally deposited with another insulating material, v) deposited with a conductive material layer, and vi) optionally, deposited with a buffering material, vii) planarized with a chemical mechanical planarization (CMP) step, to expose the conformal insulating layer, viii) wet etched to remove the insulating material and thereby expose the emission tip, afterwhich ix) the emitter tip may be coated with a material having a lower work function than silicon.
摘要:
The invention is directed to maximizing storage cell surface area in a high density/high volume DRAM (dynamic random access memory) fabrication process. Fabrication methods are disclosed that, when used with existing capacitor fabrication processes, will reduce cell leakage and allow for increased capacitance. The present invention corrects any severed storage node poly that may have resulted from a misalignment of a masking pattern used for defining future buried contacts by placing passivation oxidation over the existing wafer surface which, in effect, seals off the severed storage node poly form the capacitor's top cell plate poly. The passivation oxidation prevents cell plate to plate leakage while protecting the severed storage node poly from subsequent deposition of conductive layers.
摘要:
A method of increasing capacitance by surface roughening in semiconductor wafer processing includes the following steps: a) applying a first layer of material atop a substrate thereby defining an exposed surface; b) incontinuously adhering discrete solid particles to the first layer exposed surface to roughen the exposed surface; and c) applying a second layer of material atop the first layer and adhered solid particles to define an outer surface, the particles adhered to the first layer inducing roughness into the outer surface thereby increasing its surface area and accordingly capacitance of the second layer in the final wafer structure.
摘要:
A chemical mechanical polishing process for the formation of self-aligned gate structures surrounding an electron emission tip for use in field emission displays in which the emission tip is i) optionally sharpened through oxidation, ii) deposited with a conformal insulating material, iii) deposited with a flowable insulating material, which is reflowed below the level of the tip, iv) optionally deposited with another insulating material, v) deposited with a conductive material layer, and vi) optionally, deposited with a buffering material, vii) planarized with a chemical mechanical planarization (CMP) step, to expose the conformal insulating layer, viii) wet etched to remove the insulating material and thereby expose the emission tip, afterwhich ix) the emitter tip may be coated with a material having a lower work function than silicon.
摘要:
A flat panel display in which low-voltage row and column address signals control a much higher pixel activation voltage. Although the invention was created with field-emission displays in mind, the technique may be used in any matrix-addressable display (e.g. vacuum fluorescent, electro-luminescent, or plasma-type displays) where high pixel activation voltages must be switched. In a preferred embodiment field emission display, emitter-to-grid voltage differential is maintained near zero during non-emission periods, and is raised to a level sufficient to cause emission by grounding pixel emitters at each row and column intersection through a pair of series-connected field-effect transistors (FETs). The emitter base electrode of each emitter node is coupled to the grid via a current-limiting transistor. Display brightness control is accomplished by varying the gate voltages of either FET, such that emission current can be adjusted. In addition, a fusible link is placed in series with the grounding path through the series-connected FETs. Gray scale shading is accompanied by varying the duty cycle of pixel actuation time as a percentage of frame time.
摘要:
This invention constitutes a 10-12 mask, split-polysilicon process for fabricating dynamic random access memories of the stacked capacitor type for the one-megabit generation and beyond. The process flow is characterized: reduced mask count due to the elimination of the N+ and p+ source-drain masking layers via the split polysilicon technique; an option to further reduce wafer processing by allowing the LOCOS stress relief (pad) oxide layer to later function as the transistor gate dielectric layer; N-channel device optimization via self-aligned punch-through and lightly-doped-drain (LDD) implants, without the addition of extra P-channel masking steps via the split poly approach; use of semi, self-aligned contact of bottom cell plate to access gate diffusion allowing tight spacing between bottom cell plate buried contact and access gate polysilicon; improved refresh characteristics achieved by avoiding reduction of isolation thickness due to the spacer oxide etch; improved refresh characteristics achieved by protecting the sensitive areas of the storage node from damage typically caused by a spacer oxide etch; improved refresh characteristics achieved by eliminating the high-dose N-channel source/drain implantation from the storage node side of the access transistor gate; and improved immunity to soft error upset achieved through the use of an optional self-aligned "Hi-C" implant that is performed without the addition of an extra masking step.
摘要:
The present invention provides a programmable structure for a programmable read-only memory (PROM) which utilizes one-sided ozone spacers constructed on the digit lines as one time programmable nodes. An oxide/nitride/oxide layer (ONO) is used as an interface between underlying parallel rows of digit lines, having one-sided ozone spacers, and overlying parallel columns of word lines in a programmable read only memory. With a each digit line passing under each word line in a row/column matrix is formed thereby providing a programmable digit/word line matrix. Each crossing point of the digit and word lines in the matrix will be permanently programmed to either a one or a zero by rupturing the thin ONO dielectric interface by applying the appropriate voltage potential between the associated digit/word line conductors.