摘要:
A circuit for supplying a stress to memory cells of a semiconductor memory device having the plurality of the memory cells respectively connected to a word line and a bit line comprises a circuit for generating precharge voltage for bit line, a bit line precharging and equalizing circuit which is connected between said circuit for generating precharge voltage for bit line and said memory cells, a pad connected to the bit line precharging and equalizing circuit for applying a desirable voltage to said memory cells through the corresponding bit lines, and a circuit connected to the circuit for generating precharge voltage for bit line for generating a signal for stopping the operation of said circuit for generating precharge voltage for bit line, whereby cell checker patterns can easily be realized in order to screen out possible failures not only in gate oxide films but also in capacitor dielectrics, storage node junctions or the like by applying an arbitrary stress voltage from the outside of the device.
摘要:
In a predetermined multibit test mode, a multibit test circuit 114 issues determination result data pairs RDM0 and /RDM0 to RDM3 and /RDM3, each of which corresponds to match/mismatch of logics of data read from memory cells selected by one column select line in corresponding one of memory cell plane blocks. In each memory cell plane block, memory cell columns selected by one single column select line can be replaced as a unit. The unit of memory cell columns containing a defective memory cell is replaced in accordance with determination result data RDM0 and /RDM0 to RDM3 and /RDM3.
摘要:
An input first stage is used for inputting both addresses and address keys. A test mode setting circuit and a function setting circuit are disposed between the input first stage and an address buffer. Each function setting mode buffer latches an internal address signal when a signal/RAS falls. Further, a function signal generating circuit is initialized by a power-on reset signal when a power supply is turned on.
摘要:
Data input/output pad portions are arranged corresponding to memory blocks and adjacent to a corresponding memory block in the center region between memory blocks, and memory blocks. Power supply pads are arranged at both ends of the center region. Power supply pad transmits a power supply voltage to data input/output pad portions, and power supply pad transmits the power supply voltage to data input/output pad portions. Power supply pad for peripheral circuitry is arranged in the center portion of the center region. A multibit test circuit is provided for each memory block. A data input/output buffer operating stably at high speed is implemented in a large storage capacity memory device which in turn accommodates a multibit test mode.
摘要:
In the case where information is read from a selected memory cell, the transfer gate included in the memory cell is turned on, and one electrode of the memory cell capacitor is connected to one bit line of a corresponding bit line pair. At the same time, the other electrode of the memory cell capacitor, i.e. the cell plate electrode is connected to the other bit line of the corresponding bit line pair. As a result, a change of the potentials occur at both the bit lines of the corresponding bit line pair. This change of the potentials acts in the different directions between one bit line and the other bit line. Therefore, the read potential difference appearing on the bit line pair becomes larger, and malfunction of the sense amplifier is reduced, while the incidence of soft error can be reduced.
摘要:
A semiconductor memory device comprises a DRAM memory cell array comprising a plurality of dynamic type memory cells arranged in a plurality of rows and columns, and an SRAM memory cell array comprising static type memory cells arranged in a plurality of rows and columns. The DRAM memory cell array is divided into a plurality of blocks each comprising a plurality of columns. The SRAM memory cell array is divided into a plurality of blocks each comprising a plurality of columns, corresponding to the plurality of blocks in the DRAM memory cell array. The SRAM memory cell array is used as a cache memory. At the time of cache hit, data is accessed to the SRAM memory cell array. At the time of cache miss, data is accessed to the DRAM memory cell array. On this occasion, data corresponding to one row in each of the blocks in the DRAM memory cell array is transferred to one row in the corresponding block in the SRAM memory cell array.
摘要:
In a semiconductor memory unit to which a plurality of different functions can be imparted by merely changing a portion of its production process, the improvement comprises: a plurality of data buses which include first data buses for use only in one of the functions and the remaining data buses for use in the one and the remainder of the functions; wherein when the semiconductor memory unit performs the remainder of the functions, the first data buses are utilized for the semiconductor memory unit.
摘要:
Complementary sub-decode signals to be provided to a sub-word line driver are separately generated through different circuits using individual power-supply voltages. Thus, the generation of a through current in the sub-word line driver is prevented.
摘要:
Complementary sub-decode signals to be provided to a sub-word line driver are separately generated through different circuits using individual power-supply voltages. Thus, the generation of a through current in the sub-word line driver is prevented.
摘要:
A semiconductor memory device according to the present invention includes: a test mode setting circuit capable of serially setting a plurality of test modes in accordance with an external signal; a voltage generating circuit; a column related control circuit; a row related control circuit; and a memory cell array. In a corresponding test mode, odd-numbered word lines/even-numbered word lines are brought into a selection/non-selection state. In the corresponding test mode, a voltage of the bit line is set higher (an internal power supply voltage) or lower (a ground voltage) than an equalization voltage in a normal operation mode. Thus, a checker pattern can efficiently be written.