摘要:
A semiconductor memory device comprises a DRAM memory cell array comprising a plurality of dynamic type memory cells arranged in a plurality of rows and columns, and an SRAM memory cell array comprising static type memory cells arranged in a plurality of rows and columns. The DRAM memory cell array is divided into a plurality of blocks each comprising a plurality of columns. The SRAM memory cell array is divided into a plurality of blocks each comprising a plurality of columns, corresponding to the plurality of blocks in the DRAM memory cell array. The SRAM memory cell array is used as a cache memory. At the time of cache hit, data is accessed to the SRAM memory cell array. At the time of cache miss, data is accessed to the DRAM memory cell array. On this occasion, data corresponding to one row in each of the blocks in the DRAM memory cell array is transferred to one row in the corresponding block in the SRAM memory cell array.
摘要:
Each of sense amplifiers is coupled to two bit lines with another bit line being interposed therebetween. Information stored in a memory cell is read out onto one of the two bit lines coupled to each of the sense ampliers, while a reference potential is read out onto the other bit line. Outside of the two bit lines, a reference potential is respectively read out onto other bit lines adjacent to the two bit lines. The information stored in the memory cell is read out onto the other bit line between the two bit lines.
摘要:
A cache DRAM (100) includes a DRAM memory array (11) accessed by a row address signal and a column address signal, an SRAM memory array (21) accessed by the column address signal, and an ECC circuit (30). The DRAM memory array (11) is divided into a plurality of blocks (B1 to B64), each including a plurality of columns. The SRAM memory array (21) includes 4 ways (W1 to W4). In determining a cache hit/cache miss, a column address signal is inputted. Consequently, the SRAM memory array (21) is accessed and data are read from each of the ways. When a cache hit occurs, one way is selected in response to an externally applied way address signal, and data from that way are outputted. When a cache miss occurs, the column address signal is latched and the row address signal is applied. The DRAM array (11) is accessed in accordance with the row address signal and the latched column address signal.
摘要:
A semiconductor memory device with a built-in cache memory comprises a memory cell array (1). The memory cell array (1) is divided into a plurality of blocks (B1 to B16). Each block is divided into a plurality of sub blocks each having a plurality of columns. At the time of a cache hit, block address signals (B0, B1) and a column address signal (CA) are simultaneously applied. Any of the plurality of blocks (B1 to B16) is selected in response to the block address signals (B0, B1). At the same time, any of the plurality of registers (16a) corresponding to the selected block is selected in response to the column address signal (CA). The data stored in the register (16a) is thereby read out at a high speed
摘要:
A DRAM for use in a simple cache memory system comprises a memory cell array divided into a plurality of blocks, a plurality of data registers provided corresponding to the respective blocks of the array for latching memory cell data of the corresponding blocks, and a selector responsive to a row address strobe signal for selecting access to either the data registers or the memory cell array. Upon cache hit, the row address strobe signal is inactivated to cause the selector to select the access to the data registers. Upon cache miss, the row address strobe signal is activated to cause the selector to select the access to the memory cell array.
摘要:
There are provided a first memory cell array and a second memory cell array. The first memory cell array comprises a dynamic RAM and the second memory cell array comprises a static RAM. In addition, the second memory cell array has smaller capacity than that of the first memory cell array. An error correcting circuit, a check bit generating circuit and a register are connected between the first memory cell array and the second memory cell array. Data which is frequently accessed is transferred from the first memory cell array to the second memory cell array and stored therein. Access is made to the second memory cell array. When data which is required is not in the second memory cell array, access is made to the first memory cell array. At the time of transferring data from the first memory cell array to the second memory cell array, errors are corrected by the error correcting circuit. The check bit generating circuit is responsive to data whose error is corrected by the error correcting circuit for generating new check bits.
摘要:
A plurality of word drivers are provided corresponding to a plurality of word lines. A switch band is provided between the plurality of word drivers and a plurality of row decoders. Each row decoder is connected to four word drivers through the switch band. The state of connection between each of the row decoders and the word driver can be changed by the switch band. A spare row decoder, four word drivers and four spare word lines are provided. Any of the row decoders can be replaced with the spare row decoder. Consequently, four spare word driver and four spare word lines can be selected instead of the four word drivers and four word lines connected to the row decoder.
摘要:
A semiconductor memory device comprises a DRAM memory cell array comprising a plurality of dynamic type memory cells arranged in a plurality of rows and columns, and an SRAM memory cell array comprising static type memory cells arranged in a plurality of rows and columns. The DRAM memory cell array is divided into a plurality of blocks each comprising a plurality of columns. The SRAM memory cell array is divided into a plurality of blocks each comprising a plurality of columns, corresponding to the plurality of blocks in the DRAM memory cell array. The SRAM memory cell array is used as a cache memory. At the time of cache hit, data is accessed to the SRAM memory cell array. At the time of cache miss, data is accessed to the DRAM memory cell array. On this occasion, data corresponding to one row in each of the blocks in the DRAM memory cell array is transferred to one row in the corresponding block in the SRAM memory cell array.
摘要:
A semiconductor memory device comprises a DRAM memory cell array comprising a plurality of dynamic type memory cells arranged in a plurality of rows and columns, and an SRAM memory cell array comprising static type memory cells arranged in a plurality of rows and columns. The DRAM memory cell array is divided into a plurality of blocks each comprising a plurality of columns. The SRAM memory cell array is divided into a plurality of blocks each comprising a plurality of columns, corresponding to the plurality of blocks in the DRAM memory cell array. The SRAM memory cell array is used as a cache memory. At the time of cache hit, data is accessed to the SRAM memory cell array. At the time of cache miss, data is accessed to the DRAM memory cell array. On this occasion, data corresponding to one row in each of the blocks in the DRAM memory cell array is transferred to one row in the corresponding block in the SRAM memory cell array.
摘要:
A semiconductor memory includes a memory cell array having a plurality of bit lines and a plurality of word lines arranged intersecting with the bit lines. A plurality of memory cells are arranged at intersections of the bit lines and the word lines, respectively. Word line selecting circuitry selects one of the word lines responsive to a row address and reads out to each of the bit lines information stored in the memory cell associated with the selected word line. A plurality of sense amplifiers are associated with corresponding rows of the memory for detecting and amplifying the information stored in respective memory cells. A first column selector circuit selects the sense amplifiers corresponding to a column address when the column address is applied and reads information held in the sense amplifier. Blocks are formed by dividing the memory cell array into groups of bit lines, each of the groups comprising a predetermined number of bit lines with block information transferred simultaneously from corresponding ones of the groups of bit lines of a selected block when the column address corresponding to the selected block is applied. Data registers hold information of an associated block. A second column selector reads data corresponding to the column address from the data register when the column address is applied.