摘要:
Inkjet heads and methods of fabricating and exchanging the same. The inkjet head includes a substrate having a liquid supply hole; a nozzle plate disposed on an upper surface and provided with a nozzle hole to eject the liquid; a fluid channel forming layer disposed between the substrate and the nozzle plate and providing a chamber and a fluid channel to connect the chamber and the liquid supply hole; a heat-generating body disposed at the chamber to generate energy to eject the liquid; and a filler filled in the fluid channel to prevent air from being introduced into the fluid channel and allowed to cause phase transition into liquid. When the fluid channel forming layer and the nozzle plate are disposed on the substrate to constitute the head, the gel is injected into the fluid channel in the fluid channel forming layer to prevent air from being introduced into the fluid channel. When the head is newly mounted on the inkjet cartridge to be changed, the filled gel is ejected by an inherent operation of the head to eject ink droplets by expanding bubbles, and the ink stored in the ink cartridge is introduced into the fluid channel to be initially filled in the head while ejecting the gel.
摘要:
Adhesive compositions, micro-fluid ejection devices, and methods for attaching micro-fluid ejection heads to devices. One such adhesive composition is provided for use in attaching a micro-fluid ejection head to a device, such as to reduce chip bowing and/or to decrease chip fragility upon curing of the adhesive. Such an exemplary composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin selected from the group consisting of epoxy resins, siloxane resins, urethane resins, and functionalized olefin resins; from about 0.1 to about 25.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 30.0 percent by weight filler, and exhibit a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25° C.).
摘要:
Micro-fluid ejection head structures, methods of making micro-fluid ejection head structures having improved operability, and methods for improving the durability of micro-fluid ejection head structures are provided. One such micro-fluid ejection head structure includes a micro-fluid ejection head having a substrate and nozzle plate assembly adhesively attached adjacent to a substrate support using a substrate adhesive. The nozzle plate is adhesively attached adjacent to the substrate with a nozzle plate adhesive. A thermally, UV or other cure mechanism encapsulant material is attached adjacent to the ejection head and substrate support. Each of the substrate adhesive, and the encapsulant material, after curing, have a Young's modulus of less than about 2000 MPa, a shear modulus at 25° C. of less than about 15 MPa, and a glass transition temperature of less than about 90° C.
摘要:
A method of making a micro-fluid ejection head structure for a micro-fluid ejection device. The method includes applying a removable mandrel material to a semiconductor substrate wafer containing fluid ejection actuators on a device surface thereof. The mandrel material is shaped to provide fluid chamber and fluid channel locations on the substrate wafer. A micro machinable material is applied to the shaped mandrel and the device surface of the wafer to provide a nozzle plate and flow feature layer on the shaped mandrel and wafer. A plurality of nozzle holes are formed in the nozzle plate and flow feature layer. The shaped mandrel material is then removed from the device surface of the substrate wafer to provide fluid chambers and fluid channels in the nozzle plate and flow feature layer.
摘要:
An inkjet external ink manifold is provided that allows for use of a jet stack that does not internally contain ink manifolds. The external ink manifold has a manifold body that includes one or more ink manifold chambers and includes ports arranged to connect the chambers to one or more ink reservoirs. The external ink manifold further includes an adhesive layer overlying and sealing the ink manifold chambers. The adhesive layer includes a plurality of ports arranged to connect the external ink manifold chambers to the jet stack.
摘要:
A liquid discharge apparatus has liquid chambers and nozzles that discharge droplets of liquids contained in the liquid chambers through liquid channels. The liquid discharge apparatus includes a substrate provided with partitions on one face thereof, the liquid chambers and the liquid channels being defined between the partitions. The liquid discharge apparatus further includes a nozzle sheet provided with adhesion-improving layers at least at positions corresponding to the top faces of the partitions and the nozzles for discharging liquid, the nozzle sheet and the top faces of the respective partitions being bonded to each other with the adhesion-improving layers. The liquid discharge apparatus also includes driving elements provided on the face of the substrate at positions corresponding to the liquid chambers, for changing the pressure of the liquid chambers. The liquid discharge apparatus is used as a printer head for ink jet printing.
摘要:
A printhead assembly includes a chassis. An ink reservoir is mounted on the chassis. The ink reservoir defines a number of ink vessels for retaining respective inks, each ink vessel having a series of feed openings. A plurality of serially arranged printhead modules is mounted on the ink reservoir. Each printhead module includes an ink chamber structure that defines a number of ink chambers and complementary feed openings that engage respective feed openings of the ink reservoir so that each ink vessel is in fluid communication with a respective ink chamber. A printhead chip is mounted on each ink chamber structure to receive ink from the ink chambers. A TAB film is attached to the printhead chip to supply the printhead chip with power and control signals.
摘要:
A print head is provided with at least ink-pressurizing cells, heating elements, and ink-ejection nozzles. In addition, the print head includes substrate members which form side surfaces and one end surface of the ink-pressurizing cells, and which are provided with the heating elements; a nozzle-formed member which forms the other end surface of the ink-pressurizing cells, and in which the ink-ejection nozzles, which individually correspond to the ink-pressurizing cells, are formed; and a head frame which supports the nozzle-formed member.
摘要:
Two electronic components can be accurately aligned with each other such that a mark-recognition apparatus captures mutually corresponding alignment marking-means of the two components in the same fields of view thereof and measures the positions of the two components. A first electronic component having two alignment holes perforated at predetermined positions thereof so as to be spaced away from each other by a predetermined interval is held with a receiving table, and also a second electronic component having two alignment marks formed at predetermined positions thereon so as to have an interval therebetween in agreement with that between the two alignment holes is held with a position-adjusting mechanism. Thus, in a state in which the alignment marks of the second electronic component are introduced in the corresponding alignment holes of the first electronic component, the mark-recognition apparatus captures the alignment marks and the alignment holes in the same fields of view thereof and measures the positions of the two components, and the position-adjusting mechanism adjusts the position of the second electronic component such that the alignment marks of the second electronic component lie at predetermined positions in the alignment holes of the first electronic component.
摘要:
A printhead assembly for an A4 pagewidth drop on demand printer includes a number of printhead modules situated along a metal channel. The metal channel is typically of a special alloy called “Invar 36”. Preferably the channel is nickel plated to help match it to the coefficient of thermal expansion of silicon, being the major component of each individual printhead module. The channel captures the printhead modules in a precise alignment relative to each other and the similar coefficient of thermal expansion of the “Invar” channel to the silicon chips allows similar relative movement during temperature changes.