公开(公告)号：US20110055981A1

公开(公告)日：2011-03-03

申请号：US12935063

申请日：2009-03-25

申请人： Alina Voda ,  Gildas Besancon ,  Sylvain Blanvillain

发明人： Alina Voda ,  Gildas Besancon ,  Sylvain Blanvillain

IPC分类号： G01Q10/00

CPC分类号： G01P15/0894 ,  G01Q10/065 ,  G01Q60/16

摘要： The instant disclosure describes a device for positioning a moveable object which can be moved over a distance of the order of 1 nanometer in a time of 1 microsecond or less, comprising: a microtip; first piezoelectric positioning, polarization, detection and control means for moving the microtip relative to the object and bringing it to a distance of the order of 1 nanometer from the object in order to make a tunnel current flow between the microtip and the object, for measuring the tunnel current and for slaving, depending on the measured tunnel current, the distance between the microtip and the object to a constant value (dref); and second positioning and control means which are capacitively coupled to the object so as to oppose an attractive force between the object and the microtip depending on the measured tunnel current, the second means being tied to a reference plane.

摘要翻译： 本公开描述了一种用于定位可移动物体的装置，其可以在1微秒或更短的时间内移动大约1纳米的距离，包括：微尖端; 第一压电定位，偏振，检测和控制装置，用于相对于物体移动微尖端并将其与物体相距1纳米的距离，以便在微尖端和物体之间形成隧道电流，用于测量 根据测量的隧道电流，微通道和物体之间的距离达到恒定值（dref）; 以及第二定位和控制装置，所述第二定位和控制装置电容耦合到所述物体，以便根据所测量的隧道电流来抵抗所述物体和所述微尖端之间的吸引力，所述第二装置被连接到参考平面。

公开(公告)号：US20100299949A1

公开(公告)日：2010-12-02

申请号：US12853169

申请日：2010-08-09

申请人： Bonifatijs Lubgins ,  Leonids Bekers

发明人： Bonifatijs Lubgins ,  Leonids Bekers

IPC分类号： G01B7/14

CPC分类号： G01P15/0894

摘要： A micromovement measuring device has a first element such as a probe tip or flat plate coupled to a test body (107) the movement of which is to be measured. A second element (104) is located adjacent to the first element, to form a gap (108) therebetween. As the test body and the first element gradually move away from the measuring element, so increasing the size of the gap, the second element is repeatedly moved up, to restore the gap to its original size. These repeated small quantized movements of the measuring element (104) are counted, and are used to provide an indication of how far the test body (107) has moved. In other embodiments, the first element may gradually move toward the second element, with the latter repeatedly moving away.

摘要翻译： 微运动测量装置具有第一元件，例如连接到测试体（107）的探针尖端或平板，其移动将被测量。 第二元件（104）位于与第一元件相邻的位置，以在它们之间形成间隙（108）。 随着测试体和第一元件逐渐离开测量元件，因此增加间隙的尺寸，第二元件反复向上移动，以将间隙恢复到其原始尺寸。 对测量元件（104）的这些重复的小量化运动进行计数，并用于提供测试体（107）移动多远的指示。 在其他实施例中，第一元件可以朝着第二元件逐渐移动，后者重复地移开。

公开(公告)号：US07774952B2

公开(公告)日：2010-08-17

申请号：US12090610

申请日：2006-10-17

申请人： Bonifatijs Lubgins ,  Leonids Bekers

发明人： Bonifatijs Lubgins ,  Leonids Bekers

IPC分类号： G01B7/14

CPC分类号： G01P15/0894

摘要： A micromovement measuring device has a first element such as a probe tip or flat plate coupled to a test body (107) the movement of which is to be measured. A second element (104) is located adjacent to the first element, to form a gap (108) therebetween. As the test body and the first element gradually move away from the measuring element, so increasing the size of the gap, the second element is repeatedly moved up, to restore the gap to its original size. These repeated small quantized movements of the measuring element (104) are counted, and are used to provide an indication of how far the test body (107) has moved. In other embodiments, the first element may gradually move toward the second element, with the latter repeatedly moving away.

摘要翻译： 微运动测量装置具有第一元件，例如连接到测试体（107）的探针尖端或平板，其移动将被测量。 第二元件（104）位于与第一元件相邻的位置，以在它们之间形成间隙（108）。 随着测试体和第一元件逐渐离开测量元件，因此增加间隙的尺寸，第二元件反复向上移动，以将间隙恢复到其原始尺寸。 对测量元件（104）的这些重复的小量化运动进行计数，并用于提供测试体（107）移动多远的指示。 在其他实施例中，第一元件可以朝着第二元件逐渐移动，后者重复地移开。

公开(公告)号：US20070127164A1

公开(公告)日：2007-06-07

申请号：US11560826

申请日：2006-11-16

申请人： Eran Ofek ,  Amir Lichtenstein ,  Noel Axelrod

发明人： Eran Ofek ,  Amir Lichtenstein ,  Noel Axelrod

IPC分类号： G11B5/33 ,  G11B5/127

CPC分类号： G01H11/06 ,  B82Y5/00 ,  B82Y15/00 ,  B82Y30/00 ,  G01N33/54373 ,  G01P15/0802 ,  G01P15/0894 ,  G01P15/12 ,  G01P15/123 ,  G01P2015/0828

摘要： A plurality of densely packed nano-particles are arrayed on a elastic substrate via an intervening spacer by a combination of self-assembly methods or imprinting. The coated substrate is useful as a sensor device as the substrate is sufficiently non-rigid such that the deformation increases the separation between nano-particles resulting in a measurable change in the physical properties of the array. When the array comprises of closely packed conductive nano-particles deformation of the substrate disturbs the electrical continuity between the particles resulting in a significant increase in resistivity. The various optical properties of the device may exhibit measurable changes depending on the size and composition of the nano-particles, as well as the means for attaching them to the substrate.

摘要翻译： 多个密集填充的纳米颗粒通过自组装方法或印记的组合通过中间间隔物排列在弹性基底上。 涂覆的基材作为传感器装置是有用的，因为基材是非常刚性的，使得变形增加了纳米颗粒之间的分离，导致阵列的物理性质的可测量的变化。 当阵列包括紧密堆积的导电纳米颗粒时，基板的变形会扰乱颗粒之间的电连续性，导致电阻率的显着增加。 器件的各种光学性质可以根据纳米颗粒的尺寸和组成以及用于将其附着到衬底的手段来显示可测量的变化。

公开(公告)号：US06975009B2

公开(公告)日：2005-12-13

申请号：US10853848

申请日：2004-05-25

申请人： Randall L. Kubena ,  David T. Chang

发明人： Randall L. Kubena ,  David T. Chang

IPC分类号： B81B3/00 ,  B81C1/00 ,  G01C19/5656 ,  G01P15/08 ,  H01L29/82

CPC分类号： B81C1/0015 ,  B81B2201/0242 ,  B81C2201/014 ,  B81C2201/0191 ,  B81C2203/036 ,  G01C19/5656 ,  G01P15/0802 ,  G01P15/0894

摘要： A MEM tunneling gyroscope assembly includes (1) a beam structure, and a mating structure defined on a first substrate or wafer; and (2) at least one contact structure, and a mating structure defined on a second substrate or wafer, the mating structure on the second substrate or wafer being of a complementary shape to the mating structure on the first substrate or wafer; and (3) a bonding layer is disposed on at least one of said mating structures for bonding the mating structure defined on the first substrate or wafer to the mating structure on the second substrate or wafer.

摘要翻译： MEM隧道陀螺仪组件包括（1）梁结构和限定在第一衬底或晶片上的配合结构; 以及（2）至少一个接触结构以及限定在第二衬底或晶片上的配合结构，所述第二衬底或晶片上的所述配合结构与所述第一衬底或晶片上的配合结构互补形状; 和（3）粘合层设置在至少一个所述配合结构上，用于将限定在第一衬底或晶片上的配合结构接合到第二衬底或晶片上的配合结构。

公开(公告)号：US06841838B2

公开(公告)日：2005-01-11

申请号：US10223874

申请日：2002-08-19

申请人： Randall L. Kubena ,  David T. Chang

发明人： Randall L. Kubena ,  David T. Chang

IPC分类号： B81B3/00 ,  B81C1/00 ,  G01C19/5656 ,  G01P15/08 ,  H01L29/82

CPC分类号： B81C1/0015 ,  B81B2201/0242 ,  B81C2201/014 ,  B81C2201/0191 ,  B81C2203/036 ,  G01C19/5656 ,  G01P15/0802 ,  G01P15/0894

摘要： A method of making a micro electromechanical gyroscope. A cantilevered beam structure, first portions of side drive electrodes and a mating structure are defined on a first substrate or wafer; and at least one contact structure, second portions of the side drive electrodes and a mating structure are defined on a second substrate or wafer, the mating structure on the second substrate or wafer being of a complementary shape to the mating structure on the first substrate or wafer and the first and second portions of the side drive electrodes being of a complementary shape to each other. A bonding layer, preferably a eutectic bonding layer, is provided on at least one of the mating structures and one or the first and second portions of the side drive electrodes. The mating structure of the first substrate is moved into a confronting relationship with the mating structure of the second substrate or wafer. Pressure is applied between the two substrates so as to cause a bond to occur between the two mating structures at the bonding or eutectic layer and also between the first and second portions of the side drive electrodes to cause a bond to occur therebetween. Then the first substrate or wafer is removed to free the cantilevered beam structure for movement relative to the second substrate or wafer. The bonds are preferably eutectic bonds.

摘要翻译： 制造微机电陀螺仪的方法。 悬臂梁结构，侧驱动电极的第一部分和配合结构限定在第一基板或晶片上; 并且至少一个接触结构，侧驱动电极的第二部分和配合结构限定在第二衬底或晶片上，第二衬底或晶片上的配合结构与第一衬底上的配合结构互补形状，或 并且所述侧驱动电极的第一和第二部分彼此互补形状。 在至少一个配合结构和侧驱动电极的一个或第一和第二部分中提供粘结层，优选共晶粘结层。 第一基板的配合结构被移动成与第二基板或晶片的配合结构面对面的关系。 在两个基板之间施加压力，使得在接合或共晶层处的两个配合结构之间以及侧驱动电极的第一和第二部分之间发生接合，从而在它们之间发生接合。 然后移除第一衬底或晶片以释放悬臂梁结构以相对于第二衬底或晶片移动。 键优选为共晶键。

公开(公告)号：US06762543B1

公开(公告)日：2004-07-13

申请号：US09617351

申请日：2000-07-17

申请人： Weng Poo Kang ,  Jimmy Lee Davidson ,  David V. Kerns, Jr.

发明人： Weng Poo Kang ,  Jimmy Lee Davidson ,  David V. Kerns, Jr.

IPC分类号： H01J130

CPC分类号： H01J9/025 ,  B82Y10/00 ,  G01L9/0041 ,  G01L9/0047 ,  G01P15/0802 ,  G01P15/0894 ,  G01P2015/0828 ,  H01J1/3042 ,  H01J1/3044 ,  H01J3/022 ,  H01J31/127 ,  H01J2201/30407 ,  H01J2201/30457

摘要： Diamond microtip field emitters are used in diode and triode vacuum microelectronic devices, sensors and displays. Diamond diode and triode devices having integral anode and grid structures can be fabricated. Ultra-sharp tips are formed on the emitters in a fabrication process in which diamond is deposited into mold cavities in a two-step deposition sequence. During deposition of the diamond, the carbon graphite content is carefully controlled to enhance emission performance. The tips or the emitters are treated by post-fabrication processes to further enhance performance.

摘要翻译： 金刚石微尖端场发射器用于二极管和三极管真空微电子器件，传感器和显示器。 可以制造具有整体阳极和栅格结构的金刚石二极管和三极管器件。 在制造工艺中在发射体上形成超尖尖，其中金刚石以两步沉积顺序沉积到模腔中。 在沉积金刚石期间，仔细控制碳石墨含量以增强排放性能。 尖端或发射器通过后制造处理来进一步提高性能。

公开(公告)号：US06613601B1

公开(公告)日：2003-09-02

申请号：US10142814

申请日：2002-05-09

申请人： Alan R. Krauss ,  Dieter M. Gruen ,  Michael J. Pellin ,  Orlando Auciello

发明人： Alan R. Krauss ,  Dieter M. Gruen ,  Michael J. Pellin ,  Orlando Auciello

IPC分类号： H01L2100

CPC分类号： G01H9/00 ,  B82Y35/00 ,  G01D5/30 ,  G01H11/06 ,  G01L1/005 ,  G01L1/044 ,  G01P15/0888 ,  G01P15/0894 ,  G01P15/093 ,  Y10S977/732 ,  Y10S977/932

摘要： An ultrananocrystalline diamond (UNCD) element formed in a cantilever configuration is used in a highly sensitive, ultra-small sensor for measuring acceleration, shock, vibration and static pressure over a wide dynamic range. The cantilever UNCD element may be used in combination with a single anode, with measurements made either optically or by capacitance. In another embodiment, the cantilever UNCD element is disposed between two anodes, with DC voltages applied to the two anodes. With a small AC modulated voltage applied to the UNCD cantilever element and because of the symmetry of the applied voltage and the anode-cathode gap distance in the Fowler-Nordheim equation, any change in the anode voltage ratio V1/V2 required to maintain a specified current ratio precisely matches any displacement of the UNCD cantilever element from equilibrium. By measuring changes in the anode voltage ratio required to maintain a specified current ratio, the deflection of the UNCD cantilever can be precisely determined. By appropriately modulating the voltages applied between the UNCD cantilever and the two anodes, or limit electrodes, precise independent measurements of pressure, uniaxial acceleration, vibration and shock can be made. This invention also contemplates a method for fabricating the cantilever UNCD structure for the sensor.

摘要翻译： 在一个高灵敏度的超小型传感器中，采用悬臂结构形成的超微晶金刚石（UNCD）元件用于在宽动态范围内测量加速度，冲击，振动和静压力。 悬臂UNCD元件可以与单个阳极组合使用，测量光学或电容测量。 在另一个实施例中，悬臂UNCD元件设置在两个阳极之间，其中DC电压施加到两个阳极。 通过施加到UNCD悬臂元件上的小的AC调制电压，并且由于Fowler-Nordheim方程中所施加的电压和阳极 - 阴极间隙距离的对称性，维持指定的所需的阳极电压比V1 / V2的任何变化 电流比精确匹配UNCD悬臂元件的任何位移与平衡。 通过测量维持指定电流比所需的阳极电压比的变化，可以精确地确定UNCD悬臂的偏转。 通过适当地调制在UNCD悬臂与两个阳极之间施加的电压或极限电极，可以精确地独立测量压力，单轴加速度，振动和冲击。 本发明还考虑了用于制造用于传感器的悬臂UNCD结构的方法。

公开(公告)号：US20030141562A1

公开(公告)日：2003-07-31

申请号：US10358471

申请日：2003-02-04

申请人： HRL LABORATORIES, LLC

发明人： Randall L. Kubena ,  David T. Chang

IPC分类号： H01L029/82

CPC分类号： H01H1/0036 ,  G01P15/0802 ,  G01P15/0894 ,  H01H59/0009

摘要： A method of making a micro electro-mechanical switch or tunneling sensor. A cantilevered beam structure and a mating structure are defined on an etch stop layer on a first substrate or wafer; and at least one contact structure and a mating structure are defined on a second substrate or wafer, the mating structure on the second substrate or wafer being of a complementary shape to the mating structure on the first substrate or wafer. A bonding layer, preferably a eutectic bonding layer, is provided on at least one of the mating structures. The mating structure of the first substrate is moved into a confronting relationship with the mating structure of the second substrate or wafer. Pressure is applied between the two substrates so as to cause a bond to occur between the two mating structures at the bonding or eutectic layer. Then the first substrate or wafer and the etch stop layer are removed to free the cantilevered beam structure for movement relative to the second substrate or wafer.

公开(公告)号：US06580138B1

公开(公告)日：2003-06-17

申请号：US09629682

申请日：2000-08-01

申请人： Randall L. Kubena ,  David T. Chang

发明人： Randall L. Kubena ,  David T. Chang

IPC分类号： H01L2982

CPC分类号： H01H1/0036 ,  G01P15/0802 ,  G01P15/0894 ,  H01H59/0009

摘要： A method of making a micro electro-mechanical switch or tunneling sensor. A cantilevered beam structure and a mating structure are defined on an etch stop layer on a first substrate or wafer; and at least one contact structure and a mating structure are defined on a second substrate or wafer, the mating structure on the second substrate or wafer being of a complementary shape to the mating structure on the first substrate or wafer. A bonding layer, preferably a eutectic bonding layer, is provided on at least one of the mating structures. The mating structure of the first substrate is moved into a confronting relationship with the mating structure of the second substrate or wafer. Pressure is applied between the two substrates so as to cause a bond to occur between the two mating structures at the bonding or eutectic layer. Then the first substrate or wafer and the etch stop layer are removed to free the cantilevered beam structure for movement relative to the second substrate or wafer.

摘要翻译： 一种制造微机电开关或隧道传感器的方法。 在第一衬底或晶片上的蚀刻停止层上限定悬臂梁结构和配合结构; 并且在第二衬底或晶片上限定至少一个接触结构和配合结构，所述第二衬底或晶片上的配合结构与第一衬底或晶片上的配合结构互补形状。 在至少一个配合结构上提供粘合层，优选共晶粘合层。 第一基板的配合结构被移动成与第二基板或晶片的配合结构面对面的关系。 在两个基板之间施加压力，以便在接合或共晶层处在两个配合结构之间发生结合。 然后去除第一衬底或晶片和蚀刻停止层以释放悬臂梁结构以相对于第二衬底或晶片移动。