Abstract:
An electromagnetic interference filter for various electronic devices such as implantable medical devices is provided. A plurality of signal electrodes can be configured in an array, where each signal electrode extends vertically from a top surface to a bottom surface of the filter such that the signal electrodes are flush with the top and bottom surface. Ground or common electrodes can have a parallel arrangement and be interposed between the signal electrodes. The ground electrodes can be grounded internally, externally, or both internally and externally. Dielectric material can be disposed between signal electrodes and ground electrodes to act as an insulator between adjacent electrodes.
Abstract:
A wet electrolytic capacitor that contains an anodically oxidized porous anode body, a cathode containing a metal substrate coated with a conductive coating, and a working electrolyte that wets the dielectric on the anode. The conductive coating contains an alkyl-substituted poly(3,4-ethylenedioxythiophene) having a certain structure. Such polymers can result in a higher degree of capacitance than many conventional types of coating materials. Further, because the polymers are generally semi-crystalline or amorphous, they can dissipate and/or absorb the heat associated with the high voltage. The degree of surface contact between the conductive coating and the surface of the metal substrate may also be enhanced in the present invention by selectively controlling the manner in which the conductive coating is formed.
Abstract:
A wet electrolytic capacitor that contains a casing within which is positioned an anode formed from an anodically oxidized sintered porous body and a fluidic working electrolyte is provided. The casing contains a conductive coating disposed on a surface of a metal substrate. The casing contains a metal substrate coated with a conductive coating. The conductive coating contains a conductive polymer layer formed through anodic electrochemical polymerization (“electro-polymerization”) of a colloidal suspension on the surface of the metal substrate. The conductive coating also contains a precoat layer that is discontinuous in nature and contains a plurality of discrete projections of a conductive material that are deposited over the surface of the metal substrate in a spaced-apart fashion so that they form “island-like” structures.
Abstract:
A wet electrolytic capacitor that contains an anodically oxidized porous anode body, a cathode containing a metal substrate coated with a conductive coating, and a working electrolyte that wets the dielectric on the anode. The conductive coating contains an alkyl-substituted poly(3,4-ethylenedioxythiophene) having a certain structure. Such polymers can result in a higher degree of capacitance than many conventional types of coating materials. Further, because the polymers are generally semi-crystalline or amorphous, they can dissipate and/or absorb the heat associated with the high voltage. The degree of surface contact between the conductive coating and the surface of the metal substrate may also be enhanced in the present invention by selectively controlling the manner in which the conductive coating is formed.
Abstract:
A capacitor assembly that is capable of performing under extreme conditions, such as at high temperatures and/or high voltages, is provided. The ability to perform at high temperature is achieved in part by enclosing and hermetically sealing the capacitor element within a housing in the presence of a gaseous atmosphere that contains an inert gas, thereby limiting the amount of oxygen and moisture supplied to the solid electrolyte of the capacitor element. Furthermore, the present inventors have also discovered that the ability to perform at high voltages can be achieved through a unique and controlled combination of features relating to the formation of the anode, dielectric, and solid electrolyte. For example, the solid electrolyte is formed from a combination of a conductive polymer and a hydroxy-functional nonionic polymer.
Abstract:
A wet electrolytic capacitor that contains electrodes (i.e., anode and cathode) and a working electrolyte is provided. The anode and optionally the cathode include a wire assembly containing two or more individual wires. A particulate material is also disposed in contact with at least a portion of the wire assembly.
Abstract:
Disclosed are apparatus and methodology for providing a precision laser adjustable (e.g., trimmable) thin film capacitor array. A plurality of individual capacitors are formed on a common substrate and connected together in parallel by way of fusible links. The individual capacitors are provided as laddered capacitance value capacitors such that a plurality of lower valued capacitors corresponding to the lower steps of the ladder, and lesser numbers of capacitors, including a single capacitor, for successive steps of the ladder, are provided. Precision capacitance values can be achieved by either of fusing or ablating selected of the fusible links so as to remove the selected subcomponents from the parallel connection. In-situ live-trimming of selected fusible links may be performed after placement of the capacitor array on a hosting printed circuit board.
Abstract:
A wet electrolytic capacitor that includes a porous anode body containing a dielectric layer, an electrolyte, and a cathode containing a metal substrate on which is disposed a conductive coating is provided. Prior to application of the conductive coating, the metal substrate is blasted with abrasive particles to enhance the ability of the substrate to adhere to the coating. The micro-roughened metal substrate can be treated after blasting so that substantially all of the abrasive particles are removed. This is accomplished by contacting the metal substrate with an extraction solution to remove the particles, and also by selectively controlling the nature of the abrasive particles so that they are dispersible (e.g., soluble) in the solution.
Abstract:
Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed internal electrode tabs and additional anchor tab portions which may optionally extend to the cover layers of a multilayer component. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. External anchor tabs positioned on top and bottom sides of a monolithic structure can facilitate the formation of wrap-around plated terminations.
Abstract:
An ultra wideband frequency compensated resistor and related methodologies for frequency compensation are disclosed. In exemplary configuration, a resistive layer is provided over a substrate, and a frequency compensating structure is provided over at least a portion of the resistive layer and separated therefrom by an insulative layer. In certain embodiments, the insulating layer may be an adhesive that may also be effective to secure a protective cover over the resistive material and supporting substrate. In selected embodiments, the frequency compensating structure corresponds to a plurality of conductive layers, one or more of which may be directly electrically connected to terminations for the resistive material while one or more of the conductive layers are not so connected.