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公开(公告)号：US20200006007A1
公开(公告)日：2020-01-02
申请号：US16570052
申请日：2019-09-13
Applicant: AVX Corporation
Inventor： Andrew P. Ritter , Craig W. Nies , Richard VanAlstine
IPC: H01G7/06
Abstract: A tunable multilayer capacitor is provided. The capacitor comprises first active electrodes that are in electrical contact with a first active termination and alternating second active electrodes that are in electrical contact with a second active termination. The capacitor also comprises first DC bias electrodes that are in electrical contact with a first DC bias termination and alternating second DC bias electrodes that are in electrical contact with a second DC bias termination. A plurality of dielectric layers are disposed between the alternating first and second active electrodes and between the alternating first and second bias electrodes. At least a portion of the dielectric layers contain a dielectric material that exhibits a variable dielectric constant upon the application of an applied voltage.
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公开(公告)号：US10510940B2
公开(公告)日：2019-12-17
申请号：US15010926
申请日：2016-01-29
Applicant: AVX Corporation
Inventor： Craig W. Nies , Andrew P. Ritter
Abstract: Disclosed are apparatus and methodology for constructing thermoelectric devices (TEDs). N-type elements are paired with P-type elements in an array of pairs between substrates. The paired elements are electrically connected in series by various techniques including brazing for hot side and/or also cold side connections, and soldering for cold side connections while being thermally connected in parallel. In selected embodiments, electrical and mechanical connections of the elements may be made solely by mechanical pressure.
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公开(公告)号：US10154616B2
公开(公告)日：2018-12-11
申请号：US14705460
申请日：2015-05-06
Applicant: AVX Corporation
Inventor： Andrew P. Ritter , Richard J. Panlener , Sam Eldawoudy , Kimberly Van Alstine
Abstract: An electromagnetic interference filter for various electronic devices such as implantable medical devices is provided. A plurality of signal electrodes can be configured in an array, where each signal electrode extends vertically from a top surface to a bottom surface of the filter such that the signal electrodes are flush with the top and bottom surface. Ground or common electrodes can have a parallel arrangement and be interposed between the signal electrodes. The ground electrodes can be grounded internally, externally, or both internally and externally. Dielectric material can be disposed between signal electrodes and ground electrodes to act as an insulator between adjacent electrodes.
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公开(公告)号：US20170338054A1
公开(公告)日：2017-11-23
申请号：US15598865
申请日：2017-05-18
Applicant: AVX Corporation
Inventor： Jonathan Robert Knopsnyder , Shawn Hansen , Andrew P. Ritter
IPC: H01G11/12 , H01G11/68 , H01G11/60 , H01G11/18 , H01G9/00 , H01G9/26 , H01G9/08 , H01G9/008 , H01G11/82 , H01G11/32
CPC classification number: H01G11/12 , H01G9/0003 , H01G9/016 , H01G9/08 , H01G9/26 , H01G11/18 , H01G11/24 , H01G11/32 , H01G11/52 , H01G11/60 , H01G11/62 , H01G11/68 , H01G11/70 , H01G11/76 , H01G11/78 , H01G11/82 , Y02E60/13
Abstract: An ultracapacitor that comprises a first and second electrochemical cell that are connected in parallel is provided. The cells are define by a first electrode that contains a current collector having opposing sides coated with a carbonaceous material, a second electrode that contains a current collector having opposing sides coated with a carbonaceous material, and a separator positioned between the first electrode and the second electrode. The second cell is by the second electrode, a third electrode that contains a current collector having opposing sides coated with a carbonaceous material, and a separator positioned between the second electrode and the third electrode. The ultracapacitor also contains a nonaqueous electrolyte that is in ionic contact with the electrodes and contains a nonaqueous solvent and an ionic liquid. A package encloses the first cell, the second cell, and the nonaqueous electrolyte.
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公开(公告)号：US20160344365A1
公开(公告)日：2016-11-24
申请号：US15202814
申请日：2016-07-06
Applicant: AVX Corporation
Inventor： Gheorghe Korony , Andrew P. Ritter
IPC: H03H7/01 , H01G4/248 , H01G4/33 , H05K1/11 , H01C7/00 , H01F27/28 , H05K3/46 , H05K1/18 , H01G4/224 , H01C1/148
CPC classification number: H03H7/17 , H01C1/148 , H01C7/006 , H01F5/003 , H01F27/2804 , H01F2027/2809 , H01G4/224 , H01G4/248 , H01G4/33 , H01L2924/0002 , H03H7/0115 , H03H2001/0085 , H05K1/111 , H05K1/186 , H05K3/4611 , H05K3/467 , H05K3/4697 , Y10T29/49124 , H01L2924/00
Abstract: Surface mount components and related methods involve thin film circuits between first and second insulating substrates. The thin film circuits may include passive components, including resistors, capacitors, inductors, arrays of such components, networks, or filters of multiple passive components. Such thin film circuit(s) can be sandwiched between first and second insulating substrates with internal conductive pads which are exposed to the outside of the surface mount component and electrically connected to external terminations. External terminations may include at least one layer of conductive polymer. Optional shield layers may protect the surface mount components from signal interference. A cover substrate may be formed with a plurality of conductive elements that are designed to generally align with the conductive pads such that conductive element portions are exposed in groups along surfaces of a device.
Abstract translation: 表面贴装元件及相关方法涉及第一和第二绝缘基板之间的薄膜电路。 薄膜电路可以包括无源组件，包括电阻器，电容器，电感器，这种组件的阵列，网络或多个无源组件的滤波器。 这样的薄膜电路可以被夹在具有暴露于表面安装部件的外部并且电连接到外部端子的内部导电焊盘的第一和第二绝缘基板之间。 外部终端可以包括至少一层导电聚合物。 可选的屏蔽层可以保护表面贴装元件免受信号干扰。 覆盖衬底可以形成有多个导电元件，其被设计为与导电焊盘大体对准，使得导电元件部分沿着器件的表面以组的形式暴露。
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Patent Agency Ranking
公开(公告)号：US20160149109A1
公开(公告)日：2016-05-26
申请号：US15010926
申请日：2016-01-29
Applicant: AVX Corporation
Inventor： Craig W. Nies , Andrew P. Ritter
Abstract: Disclosed are apparatus and methodology for constructing thermoelectric devices (TEDs). N-type elements are paired with P-type elements in an array of pairs between substrates. The paired elements are electrically connected in series by various techniques including brazing for hot side and/or also cold side connections, and soldering for cold side connections while being thermally connected in parallel. In selected embodiments, electrical and mechanical connections of the elements may be made solely by mechanical pressure.
Abstract translation: 公开了用于构造热电装置（TED）的装置和方法。 N型元件与衬底之间的成对阵列中的P型元件配对。 成对元件通过各种技术串联电连接，包括用于热侧和/或冷侧连接的钎焊，以及在冷连接并联时进行冷侧连接的焊接。 在选择的实施例中，元件的电气和机械连接可以仅通过机械压力进行。
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公开(公告)号：US20160149108A1
公开(公告)日：2016-05-26
申请号：US15010755
申请日：2016-01-29
Applicant: AVX Corporation
Inventor： Craig W. Nies , Andrew P. Ritter
Abstract: Disclosed are apparatus and methodology for constructing thermoelectric devices (TEDs). N-type elements are paired with P-type elements in an array of pairs between substrates. The paired elements are electrically connected in series by various techniques including brazing for hot side and/or also cold side connections, and soldering for cold side connections while being thermally connected in parallel. In selected embodiments, electrical and mechanical connections of the elements may be made solely by mechanical pressure.
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公开(公告)号：US20150282391A1
公开(公告)日：2015-10-01
申请号：US14705460
申请日：2015-05-06
Applicant: AVX Corporation
Inventor： Andrew P. Ritter , Richard J. Panlener , Sam Eldawoudy , Kimberly Van Alstine
CPC classification number: H05K9/0007 , H01B5/02 , H03H1/0007 , H03H7/0138 , H03H2001/0042 , H03H2001/0085
Abstract: An electromagnetic interference filter for various electronic devices such as implantable medical devices is provided. A plurality of signal electrodes can be configured in an array, where each signal electrode extends vertically from a top surface to a bottom surface of the filter such that the signal electrodes are flush with the top and bottom surface. Ground or common electrodes can have a parallel arrangement and be interposed between the signal electrodes. The ground electrodes can be grounded internally, externally, or both internally and externally. Dielectric material can be disposed between signal electrodes and ground electrodes to act as an insulator between adjacent electrodes.
Abstract translation: 提供了诸如可植入医疗装置的各种电子装置的电磁干扰滤波器。 多个信号电极可以被配置成阵列，其中每个信号电极从过滤器的顶表面垂直延伸到底部表面，使得信号电极与顶表面和底表面齐平。 接地或公共电极可以具有平行布置并且插入在信号电极之间。 接地电极可在内部，外部接地或内部和外部接地。 电介质材料可以设置在信号电极和接地电极之间，以作为相邻电极之间的绝缘体。
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公开(公告)号：US20140062618A1
公开(公告)日：2014-03-06
申请号：US14013307
申请日：2013-08-29
Applicant: AVX Corporation
Inventor： Andrew P. Ritter , Richard J. Panlener , Sam Eldawoudy , Kimberly Van Alstine
IPC: H03H7/01
CPC classification number: H05K9/0007 , H01B5/02 , H03H1/0007 , H03H7/0138 , H03H2001/0042 , H03H2001/0085
Abstract: An electromagnetic interference filter for various electronic devices such as implantable medical devices is provided. A plurality of signal electrodes can be configured in an array, where each signal electrode extends vertically from a top surface to a bottom surface of the filter such that the signal electrodes are flush with the top and bottom surface. Ground or common electrodes can have a parallel arrangement and be interposed between the signal electrodes. The ground electrodes can be grounded internally, externally, or both internally and externally. Dielectric material can be disposed between signal electrodes and ground electrodes to act as an insulator between adjacent electrodes.
Abstract translation: 提供了诸如可植入医疗装置的各种电子装置的电磁干扰滤波器。 多个信号电极可以被配置成阵列，其中每个信号电极从过滤器的顶表面垂直延伸到底部表面，使得信号电极与顶表面和底表面齐平。 接地或公共电极可以具有平行布置并且插入在信号电极之间。 接地电极可在内部，外部接地或内部和外部接地。 电介质材料可以设置在信号电极和接地电极之间，以作为相邻电极之间的绝缘体。
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公开(公告)号：US11817262B2
公开(公告)日：2023-11-14
申请号：US17172248
申请日：2021-02-10
Applicant: AVX Corporation
Inventor： Andrew P. Ritter , Carl L. Eggerding
CPC classification number: H01G2/065 , H01G4/224 , H01G4/232 , H01G4/2325 , H01G4/30 , H05K3/3442 , H01G4/12 , H05K1/181 , H05K2201/10015 , H05K2201/2045 , Y02P70/50 , Y10T29/51
Abstract: Relatively low noise capacitors are provided for surface mounted applications. Electro-mechanical vibrations generate audible noise, which are otherwise relatively reduced through modifications to MLCC device structures, and/or their mounting interfaces on substrates such as printed circuit boards (PCBs). Different embodiments variously make use of flexible termination compliance so that surface mounting has reduced amplitude vibrations transmitted to the PCB. In other instances, side terminal and transposer embodiments effectively reduce the size of the mounting pads relative to the case of the capacitor, or a molded enclosure provides standoff, termination compliance and clamping of vibrations.
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