摘要:
A variable gap thermal interface is coupled with a cold or hot plate, forming a low thermal resistance connection between an electronic device module containing at least one heat generating electronic device and a rack or other structure. The variable gap thermal interface and the cold or hot plate are provided in a configuration to allow quick-disconnect of the electronic device module from the rack, allowing for a wide dimensional tolerance between the module and the rack while maintaining a reliable thermal connection. An embodiment including a plurality of server modules within a server rack in conformance with the present invention, allows the replacement of server modules while powered without any disconnection or reconnection of hoses to cold plates used in cooling the server modules, thus greatly reducing the probability of leaks and resulting damage to the system.
摘要:
Small winglets placed at the outer end of each fan blade substantially reduce the vortices created in conventional fans by the pressure differential between the low pressure and high pressure sides of the blade. The winglet acts as a barrier, which substantially blocks leakage around the blade tip, thus suppressing vortices. Technical advantages include noise reduction, because there are no shedding vortices to create noise as the blades pass the struts; increased aerodynamic efficiency of the fan, providing higher air flow for the same fan speed, size, and power, because less energy is lost in vortices; and minimal cost impacts, because housings currently used for fans can still be used with standard finger guards and because winglets and blades can be formed integrally of injection molded plastic.
摘要:
A heat-activated self-aligning heat sink is built thermally connecting at least one heat-generating devices on a substrate to the heat sink body, where the heat-generating devices may not be co-planar with each other due to tolerance stack-up or parallel with the heat sink body. A pedestal is attached to the substrate to support the heat sink body. A plug or floating pedestal is placed on top of each heat-generating device and held within the pedestal allowing sufficient movement for the bottom surface of the plug to fully contact the top surface of the heat-generating device. A quantity of a low melting temperature, thermally conductive material, such as solder, or a thermally conductive liquid, is placed over each plug and a heat sink body is placed over the assembly. When heated, the thermal material melts, forming a low impedance thermal junction between the plug and the heat sink body regardless of planarity differences between the two devices.
摘要:
A method and system are disclosed for cooling a room having one or more heat generating objects. A number of heat exchangers are disposed adjacent a floor or ceiling and extends substantially entirely or partially between the walls of the room. A fan unit is disposed adjacent the heat exchanger and draws or blows cooled air from the heat exchanger and directs the drawn air into the room. The fan unit is capable of being repositioned along a different portion of the heat exchanger so as to redefine the flow of cooled air into the room. The cooling system components are modularized enabling configuration of a number of components to cool a room.
摘要:
The air moving assembly includes at least one air moving device and a stator, said stator being operable to at least reduce one expansion and/or one contraction for airflow passing through the assembly. The stator is also preferably operable to impart or adjust swirl for airflow passing through the stator. In at least one embodiment, the imparted or adjusted swirl rotates in a direction opposite to that of the rotation of an impeller of the air moving device. As a result, in at least one embodiment, airflow exiting the air assembly has no rotational component. The air moving assembly may include additional air moving devices and/or stators. In at least one embodiment, the air moving assembly includes first and second air moving assemblies coupled to a shared strut assembly.
摘要:
An assembly comprising an integrated cooling system/liquid containment system/EMI shield/pump housing/heat sink is built atop a multi-chip module. The attached devices are cooled by a spray of fluid, effecting a phase change from liquid to gas at the point of evaporation. Condensing liquid accumulates at the base of the fins and is collected by a pump for redistribution. The pump is coupled to a fan blade, which in turn is operated by a motor. A seal is formed between the multi-chip module and the integrated housing. The assembly is designed such that this seal need not be broken to service the motor, thus minimizing the amount of vapors from the working fluid lost into the atmosphere. Case fins and fan blades are arranged for improved efficiency.
摘要:
The inventive system uses a backplane to interconnect a plurality of modular cell boards. Each cell board comprises a plurality of processors, a processor controller chip, a memory subsystem, and a power subsystem. The processor controller chip manages communications between components on the cell board. A mechanical subassembly provides support for the cell board, as well as ventilation passages for cooling. Controller chips are connected to one side of the backplane, while the cell boards are connected to the other side. The controller chips manage cell board to cell board communications, and communications between the backplane and the computer system. The cell boards are arranged in back to back pairs, with the outer most cell boards having their components extend beyond the height of the backplane. This allows for an increase of spacing between the front to front interface of adjacent cell boards.
摘要:
A compact cooling method and apparatus arranged for simultaneously drawing heat from both a processor and from the voltage regulator. The invention provides for advantageous arrangement of the voltage regulator and memory proximate to the processor for high speed operation. The invention includes a processor requiring at least one bias voltage, and further includes a companion voltage regulator for providing the bias voltage. The voltage regulator is arranged sufficiently proximate to the processor, so as to limit inductance of electrical coupling therebetween.
摘要:
A “data plant” accepts power-generation-capable raw materials and outputs processed data. The processed data can be delivered to consumers more efficiently than other forms of power transfer, including power transfer through electricity, steam, physical motion, and the like. Consequently, data plants can be located where power-generation-capable raw materials can be obtained inexpensively, for free, or where power-generation-capable raw materials are waste products for which the operator of the data plants can be compensated for processing. Self-powered data plants need not even be continuously fed with power-generation-capable raw materials and, if such data plants receive and output data via wireless communications, the self-powered data plants can require no physical connection or attachment at all. For example, a single piece of silicon comprising a silicon solar cell that generates electrical power and silicon circuitry that consumes it to perform data processing can be a silicon self-powered data plant.
摘要:
One or more techniques and/or systems are provided for regulating an amount of power on a power grid using a datacenter. This allows demand to be more closely brought into alignment with supply. For example, when supply exceeds demand by a predetermined level, the datacenter may increase consumption, causing demand to increase, and when demand exceeds supply and/or comes within a predetermined threshold of supply, the datacenter may decrease consumption, causing demand to decrease. In this way, the datacenter can be utilized as a regulatory tool on the grid. It may be appreciated that given the technology used by and/or operations performed by datacenters, datacenters are uniquely situated to achieve these ends as compared to other (large) energy consumers, such as manufacturing facilities that cannot shift around and/or shut-down operations swiftly.