公开(公告)号：US4978052A

公开(公告)日：1990-12-18

申请号：US399687

申请日：1989-08-28

Applicant: Julius C. Fister ,  Satyam C. Cherukuri ,  Deepak Mahulikar ,  Brian E. O'Donnelly

Inventor： Julius C. Fister ,  Satyam C. Cherukuri ,  Deepak Mahulikar ,  Brian E. O'Donnelly

IPC: H01L21/58 ,  H01L21/60 ,  H01L23/498

CPC classification number: H01L24/83 ,  H01L23/49866 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L2224/13111 ,  H01L2224/29 ,  H01L2224/29083 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/29288 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/8389 ,  H01L24/48 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/157 ,  H01L2924/16152 ,  H01L2924/351 ,  Y10T29/4913

Abstract: A semiconductor die attach system adapted for attaching a semiconductor die to a substrate is provided. A metallic buffer component is disposed between the substrate and the semiconductor die to withstand stresses created from thermal cycling of the substrate and the die. The metallic buffer component is sealed to the substrate with a layer of solder. The layer of solder is provided to dissipate stresses created by thermal cycling of the substrate and the die. The die is sealed to the buffer with a silver-glass adhesive.

Abstract translation: 提供了一种用于将半导体管芯附接到衬底的半导体管芯附接系统。 金属缓冲部件设置在基板和半导体管芯之间以承受由基板和模具的热循环产生的应力。 金属缓冲部件用一层焊料密封到基板上。 提供焊料层以消散由基板和模具的热循环产生的应力。 模具用银玻璃粘合剂密封到缓冲液。

公开(公告)号：US4961106A

公开(公告)日：1990-10-02

申请号：US91470

申请日：1987-08-31

Applicant: Sheldon H. Butt ,  Deepak Mahulikar

Inventor： Sheldon H. Butt ,  Deepak Mahulikar

IPC: H01L23/00 ,  H01L23/057 ,  H01L23/367 ,  H01L23/42

CPC classification number: H01L23/564 ,  H01L23/057 ,  H01L23/3672 ,  H01L23/42 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15787 ,  H01L2924/16152

Abstract: A package adapted to encase an electronic component is disclosed. The package comprises a metallic lid component disposed on a metallic base component to form an enclosure adapted to receive said electronic component. A metallic leadframe is disposed between the base and lid components and is glass or polymer sealed therebetween. The base component is split into first and second base layers which are bonded together at their interface with a layer of electrically insulating glass or polymer. In one embodiment, the first and second base layers are bonded only around the edges of their interface, with the internal cavity thereby formed filled with a fluid or powder to enhance heat transfer between the layers. A fluid or powder may also be placed in the electronic component enclosure for further enhancement of heat transfer from the electronic component.

Abstract translation: 公开了一种适于封装电子部件的封装。 所述包装件包括设置在金属底座部件上以形成适于接收所述电子部件的外壳的金属盖部件。 金属引线框架设置在基部和盖部件之间，并且是玻璃或聚合物之间密封的。 基底部件分成第一和第二基层，它们在与电绝缘玻璃或聚合物层的界面处结合在一起。 在一个实施例中，第一和第二基层仅在其界面的边缘附近结合，由此形成的内部空腔填充有流体或粉末以增强层之间的热传递。 流体或粉末也可以放置在电子部件外壳中，以进一步增强来自电子部件的热传递。

公开(公告)号：US4897508A

公开(公告)日：1990-01-30

申请号：US154544

申请日：1988-02-10

Applicant: Deepak Mahulikar ,  Sheldon H. Butt ,  Jacob Crane ,  Anthony M. Pasqualoni ,  Edward F. Smith

Inventor： Deepak Mahulikar ,  Sheldon H. Butt ,  Jacob Crane ,  Anthony M. Pasqualoni ,  Edward F. Smith

IPC: H01L21/50 ,  H01L23/057 ,  H01L23/10 ,  H01L23/36 ,  H01L23/367 ,  H01L23/42

CPC classification number: H01L24/32 ,  H01L21/50 ,  H01L23/057 ,  H01L23/10 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/42 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/16151 ,  H01L2924/16195

Abstract: A metal package for housing an electronic device wherein the electronic device is attached to a severable die attach pad. The die attach pad is bonded to the base of the package with a thermally conductive medium. The base is bonded to the die attach pad and to the leadframe at the same time to reduce the thermal degradation of the sealants. In other embodiments, apertures are provided in the base component to enhance cooling of the electronic device and in the cover component to vent reaction by-products.

公开(公告)号：US4872047A

公开(公告)日：1989-10-03

申请号：US928121

申请日：1986-11-07

Applicant: Julius C. Fister ,  Satyam C. Cherukuri ,  Deepak Mahulikar ,  Brian E. O'Donnelly

Inventor： Julius C. Fister ,  Satyam C. Cherukuri ,  Deepak Mahulikar ,  Brian E. O'Donnelly

IPC: H01L21/58 ,  H01L21/60 ,  H01L23/498

CPC classification number: H01L24/32 ,  H01L23/49866 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2224/8389 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/157 ,  H01L2924/16152 ,  H01L2924/351

Abstract: A semiconductor die attach system adapted for attaching a semiconductor die to a substrate is provided. A metallic buffer component is disposed between the substrate and the semiconductor die to withstand stresses created from thermal cycling of the substrate and the die. The metallic buffer component is sealed to the substrate with a layer of solder. The layer of solder is provided to dissipate stresses created by thermal cycling of the substrate and the die. The die is sealed to the buffer with a silver-glass adhesive.

Abstract translation: 提供了一种用于将半导体管芯附接到衬底的半导体管芯附接系统。 金属缓冲部件设置在基板和半导体管芯之间以承受由基板和模具的热循环产生的应力。 金属缓冲部件用一层焊料密封到基板上。 提供焊料层以消散由基板和模具的热循环产生的应力。 模具用银玻璃粘合剂密封到缓冲液。

公开(公告)号：US4793967A

公开(公告)日：1988-12-27

申请号：US140184

申请日：1987-12-31

Applicant: Michael J. Pryor ,  Eugene Shapiro ,  Deepak Mahulikar

Inventor： Michael J. Pryor ,  Eugene Shapiro ,  Deepak Mahulikar

IPC: C22C29/12 ,  C22C32/00 ,  H01L21/00 ,  B22F1/00

CPC classification number: H01L21/67126 ,  C22C29/12 ,  C22C32/00 ,  C22C32/0036 ,  Y10S264/36

Abstract: The present invention is directed to a cermet material comprising a matrix of aluminum alloy with ceramic particles distributed therein. The cermet is adapted for use as a semiconductor substrate and is manufactured using powder technology procedures. The cermet comprises from about 40 to about 60 volume % of aluminum or aluminum alloy, from an effective amount up to about 10 volume % of binder for enhancing bonding between the aluminum alloy and ceramic particles, and the balance essentially ceramic particles.

Abstract translation: 本发明涉及一种金属陶瓷材料，其包含铝合金基体，其中分布有陶瓷颗粒。 金属陶瓷适合用作半导体基板，并使用粉末技术程序制造。 金属陶瓷包括约40至约60体积％的铝或铝合金，有效量至约10体积％的粘合剂，用于增强铝合金和陶瓷颗粒之间的粘合，余量基本上为陶瓷颗粒。