公开(公告)号：US10139551B2

公开(公告)日：2018-11-27

申请号：US14941442

申请日：2015-11-13

申请人： Rohinni, LLC

发明人： Cody Peterson ,  Andrew Huska

IPC分类号： G01D11/28 ,  F21V8/00 ,  G06F1/00 ,  G09F13/08 ,  G09F23/00 ,  G09F13/22

摘要： An apparatus includes a first display, an indicium, and a second display. The second display can include a light-generating source deposited on a substrate. The second display illuminates the indicium and the second display has a thickness of less than 0.25 millimeters. The apparatus also includes one or more controllers communicatively coupled to the first display and the second display and configured to control states of the first display and the second display.

公开(公告)号：US20180301439A1

公开(公告)日：2018-10-18

申请号：US16013755

申请日：2018-06-20

申请人： Rohinni, LLC

发明人： Cody Peterson ,  Clinton Adams ,  Sean Kupcow ,  Andrew Huska

IPC分类号： H01L25/075 ,  H01L21/68 ,  H01L21/677 ,  H01L21/687 ,  H01L21/67 ,  H01L23/544 ,  H01L33/62 ,  H01L21/683 ,  H01L23/00 ,  H01L21/66 ,  H01L21/48

摘要： A circuit component for a display includes a substrate and a circuit trace having a predetermined pattern disposed on a surface of the substrate. A plurality of semiconductor die are connected to the substrate via the circuit trace. The plurality of semiconductor die are distributed across the surface of the substrate. One or more substrate orientation datum points are disposed on the substrate. The substrate orientation datum points are readable via a sensor of an apparatus that performs a transfer of the plurality of semiconductor die from a supply of die. The substrate orientation datum points provide information regarding positions on the circuit trace. The positions correspond to transfer locations for the plurality of semiconductor die, respectively.

公开(公告)号：US20180286838A1

公开(公告)日：2018-10-04

申请号：US16000746

申请日：2018-06-05

申请人： Rohinni, LLC

发明人： Andrew Huska ,  Cody Peterson ,  Clinton Adams ,  Sean Kupcow

IPC分类号： H01L25/075 ,  H01L21/683 ,  H01L21/48 ,  H01L23/532 ,  H01L21/677 ,  H01L21/67 ,  H01L21/66 ,  G02F1/1335 ,  H01L21/68 ,  H01L23/544 ,  H01L23/00 ,  H01L33/62 ,  H01L21/687

摘要： An apparatus for performing a direct transfer of a die. The apparatus includes a first frame to hold the first substrate and a second frame to hold the second substrate. The apparatus further includes a transfer mechanism disposed adjacent to the first frame. The transfer mechanism includes a needle configured to press against the first substrate at a location collinear with the die. A controller, including one or more processors communicatively coupled with the first frame, the second frame, and the transfer mechanism, has executable instructions, which when executed, cause the one or more processors to perform operations including: determining a transfer position of the die on the first substrate via one or more sensors, and aligning the transfer position of the die with the needle of the transfer mechanism via movement of at least two of the first frame, the second frame, and the transfer mechanism.

公开(公告)号：US20180261579A1

公开(公告)日：2018-09-13

申请号：US15978091

申请日：2018-05-12

申请人： Rohinni, LLC

发明人： Andrew Huska ,  Cody Peterson ,  Clinton Adams ,  Sean Kupcow

IPC分类号： H01L25/075 ,  H01L21/677 ,  H01L21/48 ,  H01L21/687 ,  H01L33/62 ,  H01L23/00 ,  H01L21/67 ,  H01L21/66 ,  H01L23/544 ,  H01L21/683 ,  H01L21/68

CPC分类号： H01L25/0753 ,  G02F1/133603 ,  G02F1/133605 ,  G02F1/133606 ,  G02F2001/133612 ,  H01L21/4853 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/67196 ,  H01L21/67265 ,  H01L21/67715 ,  H01L21/67778 ,  H01L21/681 ,  H01L21/6836 ,  H01L21/68742 ,  H01L22/12 ,  H01L22/20 ,  H01L23/53242 ,  H01L23/544 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/89 ,  H01L33/62 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2223/54413 ,  H01L2223/54426 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/16238 ,  H01L2224/75252 ,  H01L2224/75261 ,  H01L2224/75262 ,  H01L2224/75303 ,  H01L2224/7531 ,  H01L2224/75314 ,  H01L2224/75651 ,  H01L2224/75753 ,  H01L2224/75824 ,  H01L2224/75842 ,  H01L2224/75843 ,  H01L2224/81191 ,  H01L2224/81205 ,  H01L2224/81224 ,  H01L2224/83224 ,  H01L2924/12041 ,  H01L2924/405 ,  H01L2933/0066 ,  H01L2924/00014

摘要： A system to effectuate improved transfer of semiconductor die. A first frame secures a first substrate having the semiconductor die. A second frame secures a second substrate adjacent the first substrate. A needle is disposed adjacent to the first frame. The needle includes: a longitudinal surface extending in a direction toward the second frame, and a base end having a cross-sectional dimension being based, at least in part, on a cross-sectional dimension of the semiconductor die. A needle actuator is operably connected to the needle and is configured to actuate the needle such that, during the transfer operation, when the first substrate is secured in the first frame and the second substrate is secured in the second frame, the needle presses the semiconductor die into contact with the second substrate so as to transfer the semiconductor die onto the second substrate.

公开(公告)号：US10062588B2

公开(公告)日：2018-08-28

申请号：US15409409

申请日：2017-01-18

申请人： Rohinni, LLC

发明人： Andrew Huska ,  Cody Peterson ,  Clinton Adams ,  Sean Kupcow

IPC分类号： B23P19/00 ,  H01L21/683 ,  H01L21/48 ,  H01L21/677 ,  H01L21/66 ,  H01L21/68 ,  H01L21/67 ,  H01L25/075 ,  H01L21/687 ,  H01L23/00 ,  H01L23/544 ,  H01L33/62

CPC分类号： H01L21/67132 ,  H01L21/67144 ,  H01L21/67259 ,  H01L21/67265 ,  H01L21/67778 ,  H01L21/681 ,  H01L21/6836 ,  H01L21/68742 ,  H01L22/12 ,  H01L23/544 ,  H01L24/83 ,  H01L24/89 ,  H01L25/0753 ,  H01L33/62 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2223/54413 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/83224 ,  H01L2924/12041 ,  H01L2924/405 ,  H01L2933/0066

摘要： An apparatus for transferring a semiconductor die from a wafer tape to a product substrate. The apparatus includes a wafer frame configured to hold the wafer tape and a support frame disposed adjacent to the wafer frame. A flexible support substrate is secured in the support frame and is configured to support the product substrate. The apparatus further includes an actuator configured to position the semiconductor die at a transfer position with respect to the product substrate. An energy-emitting device is configured to direct energy through the flexible support substrate to a portion of the product substrate corresponding to the transfer position at which the semiconductor die is positioned to be affixed to the product substrate.

公开(公告)号：US20180233495A1

公开(公告)日：2018-08-16

申请号：US15951094

申请日：2018-04-11

申请人： Rohinni, LLC

发明人： Cody Peterson ,  Andrew Huska

IPC分类号： H01L25/075 ,  H01L21/68 ,  H01L21/66 ,  H01L23/00 ,  H01L21/683 ,  H01L21/67 ,  H01L33/62 ,  H01L23/544 ,  H01L21/687 ,  H01L21/677 ,  H01L21/48

CPC分类号： H01L25/0753 ,  G02F1/133603 ,  G02F1/133605 ,  G02F1/133606 ,  G02F2001/133612 ,  H01L21/4853 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/67196 ,  H01L21/67265 ,  H01L21/67715 ,  H01L21/67778 ,  H01L21/681 ,  H01L21/6836 ,  H01L21/68742 ,  H01L22/12 ,  H01L22/20 ,  H01L23/53242 ,  H01L23/544 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/89 ,  H01L33/62 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2223/54413 ,  H01L2223/54426 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/16238 ,  H01L2224/75252 ,  H01L2224/75261 ,  H01L2224/75262 ,  H01L2224/75303 ,  H01L2224/7531 ,  H01L2224/75314 ,  H01L2224/75317 ,  H01L2224/75651 ,  H01L2224/75753 ,  H01L2224/75824 ,  H01L2224/75842 ,  H01L2224/75843 ,  H01L2224/81191 ,  H01L2224/81205 ,  H01L2224/81224 ,  H01L2224/83224 ,  H01L2924/12041 ,  H01L2924/405 ,  H01L2933/0066 ,  H01L2924/00014

摘要： An apparatus includes a substrate and a circuit trace having a predetermined pattern disposed on the substrate. A plurality of LEDs are connected to the substrate via the circuit trace. The predetermined pattern is arranged as an array of lines along a surface of the substrate, and the plurality of LEDs are distributed along the lines of the array.

公开(公告)号：US20180144971A1

公开(公告)日：2018-05-24

申请号：US15360645

申请日：2016-11-23

申请人： Rohinni, LLC

发明人： Cody Peterson ,  Andy Huska

IPC分类号： H01L21/683 ,  H01L21/687 ,  H01L21/677

CPC分类号： H01L21/6836 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/67766 ,  H01L21/68742 ,  H01L24/00 ,  H01L2221/68318 ,  H01L2221/68322 ,  H01L2221/68354 ,  H01L2221/68372

摘要： An apparatus includes a first frame that holds a wafer tape and a second frame that clamps a product substrate. A transfer element is disposed adjacent the wafer tape. A tip end of the transfer element has a footprint sized so as span across a group of dies on the wafer tape. An actuator is connected to the transfer element to move the transfer element to a die transfer position at which the transfer element presses on the wafer tape to press the group of dies into contact with a circuit trace on the product substrate. At least one energy source is directed at a portion of the product substrate corresponding to the transfer position at which the group of dies contacts the circuit trace to apply energy to the circuit trace to affix the group of dies to the circuit trace.

公开(公告)号：US20170194171A1

公开(公告)日：2017-07-06

申请号：US15316505

申请日：2015-06-06

申请人： Rohinni, LLC

发明人： Cody Peterson ,  Andrew Huska ,  Kasey Christie ,  Clinton Adams ,  Orin Ozias

IPC分类号： H01L21/50 ,  H01L23/31 ,  H01L21/683 ,  H01L25/03 ,  H01L23/00

CPC分类号： H01L21/50 ,  H01L21/561 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/3121 ,  H01L24/24 ,  H01L24/76 ,  H01L24/82 ,  H01L25/03 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2224/82

摘要： An apparatus includes a carrier-to-circuit transfer mechanism that is configured to obtain one or more unpackaged semiconductor devices on a carrier substratum and directly transfer the one or more unpackaged semiconductor devices from the carrier substratum to a circuit assembly. The apparatus further includes an in-situ packager that is configured to in-situ package the one or more transferred devices by interconnecting each semiconductor device of the one or more transferred devices to conductive links of the circuit assembly and applying a coating material to the one or more transferred devices.

公开(公告)号：US20170140967A1

公开(公告)日：2017-05-18

申请号：US15418605

申请日：2017-01-27

申请人： Rohinni, LLC

发明人： Andrew Huska ,  Cody Peterson ,  Clinton Adams ,  Sean Kupcow

IPC分类号： H01L21/68 ,  H01L23/532 ,  H01L21/677 ,  H01L21/683 ,  H01L21/67

CPC分类号： H01L25/0753 ,  G02F1/133603 ,  G02F1/133605 ,  G02F1/133606 ,  G02F2001/133612 ,  H01L21/4853 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/67196 ,  H01L21/67265 ,  H01L21/67715 ,  H01L21/67778 ,  H01L21/681 ,  H01L21/6836 ,  H01L21/68742 ,  H01L22/12 ,  H01L22/20 ,  H01L23/53242 ,  H01L23/544 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/89 ,  H01L33/62 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2223/54413 ,  H01L2223/54426 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/16238 ,  H01L2224/75252 ,  H01L2224/75261 ,  H01L2224/75262 ,  H01L2224/75303 ,  H01L2224/7531 ,  H01L2224/75314 ,  H01L2224/75317 ,  H01L2224/75651 ,  H01L2224/75753 ,  H01L2224/75824 ,  H01L2224/75842 ,  H01L2224/75843 ,  H01L2224/81191 ,  H01L2224/81205 ,  H01L2224/81224 ,  H01L2224/83224 ,  H01L2924/12041 ,  H01L2924/405 ,  H01L2933/0066 ,  H01L2924/00014

摘要： An apparatus includes a first frame to hold a wafer tape, and a second frame to hold a substrate adjacent to the first side of the wafer tape. A needle is disposed adjacent to the second side of the wafer tape and extends in a direction toward the wafer tape. A needle actuator is connected to the needle to move the needle, during a direct transfer process, to a die transfer position at which the needle contacts the second side of the wafer tape to press the first semiconductor device die into contact with a second semiconductor device die. An energy-emitting device is disposed adjacent to the substrate to induce a bond between the first semiconductor device die and the second semiconductor device die such that the first semiconductor device die is released from the wafer tape and is attached to the second semiconductor device die.

公开(公告)号：US20170053901A1

公开(公告)日：2017-02-23

申请号：US15345425

申请日：2016-11-07

申请人： Rohinni, LLC.

发明人： Andrew Huska ,  Sean Kupcow ,  Cody Peterson ,  Clinton Adams

IPC分类号： H01L25/075 ,  H01L21/68 ,  H01L21/67 ,  H01L23/00 ,  H01L33/62 ,  H01L21/683

CPC分类号： H01L25/0753 ,  G02F1/133603 ,  G02F1/133605 ,  G02F1/133606 ,  G02F2001/133612 ,  H01L21/4853 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/67196 ,  H01L21/67265 ,  H01L21/67715 ,  H01L21/67778 ,  H01L21/681 ,  H01L21/6836 ,  H01L21/68742 ,  H01L22/12 ,  H01L22/20 ,  H01L23/53242 ,  H01L23/544 ,  H01L24/75 ,  H01L24/83 ,  H01L24/89 ,  H01L33/62 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2223/54413 ,  H01L2223/54426 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/75261 ,  H01L2224/83224 ,  H01L2924/12041 ,  H01L2924/405 ,  H01L2933/0066

摘要： An apparatus includes a substrate and a circuit trace having a predetermined pattern disposed on the substrate. A plurality of LEDs are connected to the substrate via the circuit trace. The predetermined pattern is arranged as an array of lines along a surface of the substrate, and the plurality of LEDs are distributed along the lines of the array.

摘要翻译： 一种装置包括基板和具有设置在基板上的预定图案的电路迹线。 多个LED通过电路迹线连接到基板。 预定图案被布置为沿着基板的表面的线阵列，并且多个LED沿着阵列的线分布。