公开(公告)号：US20060091506A1

公开(公告)日：2006-05-04

申请号：US11106514

申请日：2005-04-15

Applicant: Tae-Hun Kim ,  Jong-Bo Shim ,  Tae-Je Cho

Inventor： Tae-Hun Kim ,  Jong-Bo Shim ,  Tae-Je Cho

IPC: H01L23/495

CPC classification number: H01L23/49558 ,  H01L23/49541 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A lead frame may include a plurality of leads, each having a bonding portion electrically connected to a semiconductor chip and an attaching portion. A tape may be provided on the attaching portions of the leads. The attaching portion of each lead may have a width that is smaller than the width of another portion of the lead. A plating layer may be provided on the attaching portion. The lead frame may be implemented in a semiconductor package.

Abstract translation: 引线框架可以包括多个引线，每个引线具有电连接到半导体芯片和附接部分的接合部分。 可以在引线的附接部分上设置带。 每个引线的安装部分可以具有比引线的另一部分的宽度小的宽度。 可以在安装部上设置镀层。 引线框可以在半导体封装中实现。

公开(公告)号：US20050098863A1

公开(公告)日：2005-05-12

申请号：US10866774

申请日：2004-06-15

Applicant: Tae-Hun Kim

Inventor： Tae-Hun Kim

IPC: H01L21/56 ,  H01L21/48 ,  H01L23/495 ,  H01L23/50

CPC classification number: H01L23/49541 ,  H01L21/4821 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/1815 ,  Y10S438/94 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A lead frame and a method of fabricating a semiconductor package including the lead frame, where the lead frame includes a die pad, a tie bar supporting the die pad, and a plurality of leads. The leads may include inner and outer leads arranged along an outer periphery of the die pad, with each of the inner and outer leads having tip terminals. The lead frame may include a connecting bar connected to tip terminals of each of the inner leads. In the method, a bonding pad of a semiconductor chip is mounted on the die pad and connected via a conductive wire to the inner leads of the lead frame. The semiconductor chip, wire and inner leads may be subjected to a molding process, and the connecting bar which connects the tip terminals of the inner leads may be cut so as to independently separate each of the inner leads from the die pad.

Abstract translation: 引线框架和制造包括引线框架的半导体封装的方法，其中引线框架包括管芯焊盘，支撑管芯焊盘的连接杆和多个引线。 引线可以包括沿着芯片焊盘的外周布置的内引线和外引线，其中每个内引线和外引线都具有尖端。 引线框可以包括连接到每个内引线的尖端的连接杆。 在该方法中，半导体芯片的焊盘安装在芯片焊盘上，并通过导线连接到引线框架的内引线。 可以对半导体芯片，导线和内部引线进行模制处理，并且可以切割连接内部引线的末端的连接杆，以便将每个内部引线与芯片焊盘独立地分开。

公开(公告)号：US09741044B2

公开(公告)日：2017-08-22

申请号：US13524936

申请日：2012-06-15

Applicant: Kyoung Min Park ,  Ji Young Park ,  Woo Young Park ,  Tae Hun Kim

Inventor： Kyoung Min Park ,  Ji Young Park ,  Woo Young Park ,  Tae Hun Kim

IPC: G06Q30/02

CPC classification number: G06Q30/02 ,  Y04S50/14

Abstract: The demand response system comprises an automatic meter reading (AMR) unit to generate metering information. The demand response system comprises a multiple utility complex unit (MUC) which provides DR information based on the metering information and manages utility supply schedule in combination. The demand response system comprises an eco index (EI) calculation unit which calculates an eco index based on the metering information. The demand response system comprises a demand response (DR) unit which obtains the CBL information based on the metering information and computes a the DR bill by using the CBL data, the DR information and EI obtained, and outputs the DR bill. The demand response system comprises a smart portal (SP) unit which provides users with the calculated DR bill. According to the disclosure, the demand response system can provide environmental and social information, in addition to economic information.

公开(公告)号：US09330180B2

公开(公告)日：2016-05-03

申请号：US12242208

申请日：2008-09-30

Applicant: Tae Hun Kim ,  Jang Jae Jung

Inventor： Tae Hun Kim ,  Jang Jae Jung

IPC: G06F3/048 ,  G06F17/30 ,  G06F3/0488 ,  H04M1/725

CPC classification number: G06F17/30867 ,  G06F3/04886 ,  H04M1/72522 ,  H04M1/72561 ,  H04M2250/70

Abstract: A mobile terminal and method of controlling the same are disclosed, by which a terminal user is enabled to input specific commands to the mobile terminal with minimum effort in a manner of configuring a display screen with consideration of enhanced user's convenience. The present invention includes a display unit, a wireless communication unit for an internet access, a user input unit for receiving an input from a user, and a control unit controlling both a text input box and an indicator indicating one selected from the group consisting of at least two functions of the text input box to be displayed on a standby image of the display unit.

Abstract translation: 公开了一种移动终端及其控制方法，通过该终端用户能够以考虑到增强的用户便利性配置显示屏的方式以最小的努力向移动终端输入特定命令。 本发明包括显示单元，用于互联网接入的无线通信单元，用于从用户接收输入的用户输入单元，以及控制单元，控制文本输入框和指示从以下组成的组中选择的一个的指示： 要显示在显示单元的待机图像上的文本输入框的至少两个功能。

公开(公告)号：US09172000B2

公开(公告)日：2015-10-27

申请号：US13167396

申请日：2011-06-23

Applicant: Tae Hun Kim ,  Gi Bum Kim ,  Won Goo Hur ,  Young Sun Kim ,  Ki Sung Kim

Inventor： Tae Hun Kim ,  Gi Bum Kim ,  Won Goo Hur ,  Young Sun Kim ,  Ki Sung Kim

IPC: H01L21/00 ,  H01L51/40 ,  H01L33/22 ,  H01L33/00

CPC classification number: H01L33/22 ,  H01L33/0079 ,  H01L2933/0091

Abstract: Disclosed are a semiconductor light emitting device and a method of manufacturing the same. The method includes providing a substrate having first and second main surfaces opposing each other and forming a first uneven structure in the first main surface, forming a sacrificial layer on the first main surface of the substrate, forming a mask having open regions on the sacrificial layer so as to expose a portion of an upper surface of the sacrificial layer, forming a second uneven structure in the substrate by etching the sacrificial layer and the substrate through the open regions, removing the sacrificial layer and the mask from the substrate, and forming a light emitting stack on the first and second uneven structures of the substrate.

Abstract translation: 公开了一种半导体发光器件及其制造方法。 该方法包括提供具有彼此相对的第一和第二主表面的衬底，并且在第一主表面中形成第一不平坦结构，在衬底的第一主表面上形成牺牲层，在牺牲层上形成具有开放区域的掩模 以便暴露牺牲层的上表面的一部分，通过通过开放区域蚀刻牺牲层和衬底，在衬底中形成第二不均匀结构，从衬底去除牺牲层和掩模，并形成 发光堆叠在基板的第一和第二不平坦结构上。

公开(公告)号：US20150245487A1

公开(公告)日：2015-08-27

申请号：US14480661

申请日：2014-09-09

Applicant: Jin Gyu KIM ,  Jung Woo KIM ,  Tae Hun KIM ,  Kyoung Sei CHOI

Inventor： Jin Gyu KIM ,  Jung Woo KIM ,  Tae Hun KIM ,  Kyoung Sei CHOI

IPC: H05K1/14 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/144 ,  H01L23/49811 ,  H01L23/5385 ,  H01L23/5386 ,  H01L25/0652 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H05K1/181 ,  H05K1/186 ,  H05K2201/042 ,  H05K2201/10674 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor package may include a plurality of first semiconductor package mounted on a first region of a first surface of a first circuit board, a plurality of terminals disposed between the plurality of first semiconductor chips on a second region of the first surface of the first circuit board, and at least one second semiconductor chip mounted on a second circuit board connected to the first circuit board through the plurality of terminals.

Abstract translation: 半导体封装可以包括安装在第一电路板的第一表面的第一区域上的多个第一半导体封装，设置在第一电路的第一表面的第二区域上的多个第一半导体芯片之间的多个端子 以及安装在通过多个端子连接到第一电路板的第二电路板上的至少一个第二半导体芯片。

公开(公告)号：US20150126022A1

公开(公告)日：2015-05-07

申请号：US14336082

申请日：2014-07-21

Applicant: Tae Hun KIM ,  Sung Joon KIM ,  Young Kyu SUNG ,  Wan Ho LEE ,  Tae Sung JANG ,  Tae Young PARK ,  Wan Tae LIM

Inventor： Tae Hun KIM ,  Sung Joon KIM ,  Young Kyu SUNG ,  Wan Ho LEE ,  Tae Sung JANG ,  Tae Young PARK ,  Wan Tae LIM

IPC: H01L21/223 ,  H01L21/285

CPC classification number: H01L21/2236 ,  H01L21/28575 ,  H01L29/2003 ,  H01L29/452 ,  H01L33/32 ,  H01L33/40 ,  H01L2933/0016

Abstract: According to an example embodiment, a method includes forming a nitrogen vacancy surface layer by treating a surface of an n-type nitride semiconductor with inert gas plasma, and forming an oxygen-added nitride film by treating a surface of the nitrogen vacancy surface layer with oxygen-containing gas plasma, and forming an electrode on the oxygen-added nitride film. The nitrogen vacancy surface layer lacks a nitrogen element.

Abstract translation: 根据示例性实施例，一种方法包括通过用惰性气体等离子体处理n型氮化物半导体的表面来形成氮空位表面层，并且通过用氮气空隙表面层的表面处理形成添加氧的氮化物膜 含氧气体等离子体，并在氧加成氮化物膜上形成电极。 氮空位表层缺少氮元素。

公开(公告)号：US09001046B2

公开(公告)日：2015-04-07

申请号：US11746124

申请日：2007-05-09

Applicant: Tae Hun Kim

Inventor： Tae Hun Kim

IPC: G06F3/041 ,  G09G5/00 ,  G06F3/0488

CPC classification number: G06F3/04883 ,  G06F3/0488

Abstract: A mobile terminal having a touch screen is disclosed. The terminal includes a touch input unit and a control unit. The touch input unit provides a touch input area for inputting data information, a display area for displaying the input data information and a control region for inputting control commands, wherein the touch input area overlaps with the display area and/or the control region. The control unit controls the input and display of the information through the touch input and display area according to the control commands input through the control region.

Abstract translation: 公开了具有触摸屏的移动终端。 终端包括触摸输入单元和控制单元。 触摸输入单元提供用于输入数据信息的触摸输入区域，用于显示输入数据信息的显示区域和用于输入控制命令的控制区域，其中触摸输入区域与显示区域和/或控制区域重叠。 控制单元根据通过控制区域输入的控制命令，通过触摸输入和显示区域来控制信息的输入和显示。

公开(公告)号：US08829540B2

公开(公告)日：2014-09-09

申请号：US13029739

申请日：2011-02-17

Applicant: Sung Tae Kim ,  Tae Hun Kim ,  Jae Yoon Kim ,  Hae Soo Ha

Inventor： Sung Tae Kim ,  Tae Hun Kim ,  Jae Yoon Kim ,  Hae Soo Ha

IPC: H01L29/18 ,  H01L27/15 ,  H01L33/62 ,  H01L33/46 ,  H01L33/60 ,  H01L33/20

CPC classification number: H01L27/156 ,  H01L33/20 ,  H01L33/46 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2933/0091 ,  H01L2924/00014

Abstract: A semiconductor light emitting device includes a substrate, a plurality of light emitting cells, a connection part, and a concavo-convex part. The light emitting cells are arrayed on the top surface of the substrate. Each of the light emitting cells has a first-conductivity-type semiconductor layer, an active layer, and a second-conductivity-type semiconductor layer that are sequentially stacked on the top surface of the substrate. The connection part is formed to connect the light emitting cells in series, parallel or series-parallel. The concavo-convex part is formed in at least one of the bottom surface of the substrate and the top surface of an isolation region between the light emitting cells.

Abstract translation: 半导体发光器件包括衬底，多个发光单元，连接部分和凹凸部分。 发光单元排列在基板的顶表面上。 每个发光单元具有依次层叠在基板的顶面上的第一导电型半导体层，有源层和第二导电型半导体层。 连接部分形成为将发光单元串联，并联或串联连接。 凹凸部形成在基板的底表面和发光单元之间的隔离区域的顶表面中的至少一个中。

公开(公告)号：US08787719B2

公开(公告)日：2014-07-22

申请号：US13652656

申请日：2012-10-16

Applicant: Yeong-Seop Lee ,  Mun-Hyun Do ,  Si-Ho Song ,  Myung-Hwan Pyo ,  Dae-Hwan Oh ,  Won-Sun Lee ,  Dae-Seung Moon ,  Tae-Hyung Lee ,  Tae-Hun Kim

Inventor： Yeong-Seop Lee ,  Mun-Hyun Do ,  Si-Ho Song ,  Myung-Hwan Pyo ,  Dae-Hwan Oh ,  Won-Sun Lee ,  Dae-Seung Moon ,  Tae-Hyung Lee ,  Tae-Hun Kim

IPC: G02B6/02

CPC classification number: C03B37/01413 ,  C03B37/01807 ,  C03B2201/12 ,  C03B2203/23

Abstract: Provided is an extreme bending insensitive optical fiber. The optical fiber includes a core comprising a maximum refractive index difference Δn1 in the optical fiber, an inner layer comprising a refractive index difference Δn2 that is smaller than the maximum refractive index of the core and decreases in a direction away from the core, the inner layer being positioned outside the core, and a trench layer comprising an inner-circumference refractive index difference Δn3 that is smaller than the refractive index difference of the inner layer and an outer-circumference refractive index difference Δn4 that is a minimum refractive index difference in the optical fiber.

Abstract translation: 提供极端的弯曲不敏感光纤。 该光纤包括在光纤中包括最大折射率差Dgr; n1的芯，包含折射率差Dgr; n2的内层，其小于芯的最大折射率，并且在远离 所述内层位于所述芯的外侧，以及沟槽层，其包含小于所述内层的折射率差的内周折射率差Dgr; n3和外周折射率差Dgr; n4， 是光纤中的最小折射率差。