Abstract:
A semiconductor memory device having a first memory cell array block including a memory cell having a floating body, the memory cell coupled to a word line, a first bit line, and a first source line, a second memory cell array block including a reference memory cell having a floating body, the reference memory cell coupled to a reference word line, a second bit line, and a second source line, a first isolation gate portion configured to selectively transmit a signal between the first bit line and at least one of a sense bit line and an inverted sense bit line, a second isolation gate portion configured to selectively transmit a signal between the second bit line and at least one of the sense bit lines, and a sense amplifier configured to amplify voltages of the sense bit line and the inverted sense bit line to first and second sense amplifying voltage levels.
Abstract:
In one aspect, a semiconductor memory device is provided which includes complementary first and second bit lines, a unit memory cell including complementary first and second floating body transistor capacitorless memory cells respectively coupled to the complementary first and second bit lines, and a voltage sense amplifier coupled between the complementary first and second bit lines which amplifies a voltage differential between the complementary first and second bit lines.
Abstract:
A multi-level dynamic memory device having an open bit line structure is disclosed. The multi-level dynamic memory device includes a plurality of word lines; a plurality of bit lines provided in an open bit line structure; a plurality of memory cells each of which is connected to each of the word lines and each of the bit lines and stores at least two bits of data; and a plurality of sense amplifiers, each of which amplifies a voltage difference between the bit lines, the bit lines being located at opposite sides of each of the plurality of sense amplifiers.
Abstract:
There is provided a flash memory device with multi-level cell and a reading and programming method thereof. The flash memory device with multi-level cell includes a memory cell array, a unit for precharging bit line, a bit line voltage supply circuit for supplying a voltage to the bit line, and first to third latch circuits each of which performs different function from each other. The reading and programming methods are performed by LSB and MSB reading and programming operations. A reading method in the memory device is achieved by reading an LSB two times and by reading an MSB one time. A programming method is achieved by programming an LSB one time and programming an MSB one time. Data having multi-levels can be programmed into memory cells by two times programming operations.
Abstract:
According to some embodiments, a nonvolatile semiconductor memory device includes high voltage circuits that prevent high voltages, which are applied to bitlines during an erase operation, from being applied to low voltage circuits that are operable with low voltages. Each high voltage circuit includes a first switching circuit for selectively isolating the low voltage circuit from the bitlines, and a second switching circuit for inhibiting a leakage current to the low voltage circuit from the bitlines. The second switching circuit is connected between the first switching circuit and the low voltage circuit.
Abstract:
A NAND EEPROM having a shielded bit line architecture reduces supply voltage and ground noise resulting from charging or discharging bit lines. The EEPROM has a PMOS pull-up transistor and an NMOS pull down transistor connected to a virtual power node. A control circuit for charging or discharging bit lines controls the gate voltage of the PMOS or NMOS transistor to limit peak current when charging or discharging bit lines via the virtual power node. In particular, the control circuit operates the PMOS or NMOS transistor in a non-saturation mode to limit current. One such control circuit creates a current mirror or applies a reference voltage to control gate voltages. A programming method sets up bit lines by pre-charging unselected bit lines via the PMOS pull-up transistor having controlled gate voltage while latches in the programming circuitry charge or discharge selected bit lines according to respective data bits being stored. Another bit line setup includes two stages. A first stage pre-charges all bit lines via PMOS pull-up, and the second stage uses the latches to discharge or leave charged the selected bit lines depending on respective data bits being stored. The gate voltages of NMOS transistors in the programming circuitry can be controlled to reduce noise caused by discharging selected bit lines through the latches.
Abstract:
A NAND-type flash memory device includes a plurality of row selectors each corresponding to memory blocks of each mat therein. Each of the row selectors selects a corresponding memory block in response to block selection information. A decoding circuit and a register are supplied to each of the row selectors. The decoding circuit generates a block selection signal in response to the block selection information, and the register stores an output of the decoding circuit when a latch signal of a corresponding mat is activated. According to the above row selection construction, all mats or a part of memory blocks can be selected at the same time.
Abstract:
A nonvolatile semiconductor memory device of the present invention has a well voltage detecting circuit. The well voltage detecting circuit detects whether a pocket p-type well voltage is equal to or is lower than a detection voltage (e.g., 0.1V) and outputs a detection signal at a high or low level. When the pocket p-type well voltage is identical to or lower than the detection voltage, a word line select signal generating circuit generates row select signals of respective rows in response to the detection signal. With this device, in case a well voltage of the pocket p-type well is increased due to applying a voltage into an unselected bit line, program and pass voltages are supplied to word lines at a point of time when the increased well voltage becomes lower than the detection voltage of the well voltage detecting circuit.
Abstract:
A semiconductor memory device includes a select signal generator, a wordline voltage generator, and a switch circuit. During a test operation mode, the device determine whether a wordline voltage has required level. The select signal generator activates one of select signals each corresponding to the other wordline voltages responsive to external select code signals. The external select code signals appoint an external instruction signal representative and appoint other wordline voltages used in the memory device. The wordline voltage generator generates a wordline voltage corresponding to the activated select signal out. The switch circuit transfers the wordline voltage outputted from the wordline voltage generator to a pad connected to an external pin.
Abstract:
A word line loading compensating circuit compensates a word line boosted voltage level changed in accordance with a word line loading. A word line boosting circuit outputs a word line boosted voltage boosted over a power supply voltage input from the exterior of a chip, so as to boost a voltage of the word line connected to the memory cell array. A row decoder is connected to the word line boosted voltage output from the word line boosting circuit and selects a memory cell from an array of memory cells in correspondence with a predetermined row address signal. A capacitor connected between the word line boosted voltage and the row decoder stores a charge from the word line boosted voltage. A variable connecting device connects the word line boosted voltage to the capacitor before the word line boosted voltage reaches a saturation level, and cuts off the word line boosted voltage from the capacitor after the word line boosted voltage reaches the saturation level. A delay device inputs the word line boosted voltage, delays the input word line boosted voltage during the arrival time of the saturation level, and generates a delay output signal which controls the variable connecting device. A discharging device is controlled by the delay output signal and discharges the charge stored in the capacitor to ground after the word line boosted voltage reaches the saturation level.