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公开(公告)号:US10131116B2
公开(公告)日:2018-11-20
申请号:US14709280
申请日:2015-05-11
Applicant: Apple Inc.
Inventor: Christopher D. Prest , Matthew S. Scott , Stephen P. Zadesky , Dermot J. Stratton , Joseph C. Poole , Richard W. Heley
IPC: B21C27/00 , B32B15/01 , B23K31/02 , B23K15/00 , B23K20/12 , B22D19/04 , B22D19/16 , B22D25/06 , C22C1/00 , C22C33/00 , C22C45/00 , C22C45/02 , C22C45/10 , B23K35/26 , B23K35/28 , B23K35/30 , B23K103/08 , B23K103/10 , B23K103/18 , B23K103/12 , B23K103/14 , B23K103/02
Abstract: Provided in one embodiment is a method of forming a connection mechanism in or on a bulk-solidifying amorphous alloy by casting in or on, or forming with the bulk-solidifying amorphous alloy, a machinable metal. The connection mechanism can be formed by machining the machinable metal.
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公开(公告)号:US10118560B2
公开(公告)日:2018-11-06
申请号:US15078960
申请日:2016-03-23
Applicant: Apple Inc.
Inventor: Christopher D. Prest , Stephen P. Zadesky , Trent Weber , Lucy E. Browning
IPC: B60R7/04 , A45C11/00 , B60R11/02 , G06F1/18 , H01L23/043 , H01L23/047 , H01L23/053 , H01L23/057 , H01L23/10 , H05K5/00 , H05K13/00 , G06F1/16 , H05K5/02 , H05K5/04 , H05K5/06 , B60R11/00
Abstract: An electronic device having a unitary housing is disclosed. The device can include a first housing component having an open cavity, an internal electronic part disposed within the cavity, a second housing component disposed across the cavity, and a support feature disposed within the cavity and arranged to support the second housing component. The first housing component can be formed from metal, while the second housing component can be formed from a plurality of laminated foil metal layers. The second housing component can be attached to the first housing component via one or more ultrasonic welds, such that a fully enclosed housing is created. The fully enclosed housing can be hermetically sealed, and the outside surfaces thereof can be machined or otherwise finished after the ultrasonic welding.
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公开(公告)号:US09955599B2
公开(公告)日:2018-04-24
申请号:US14313505
申请日:2014-06-24
Applicant: Apple Inc.
Inventor: Stephen P. Zadesky , Phillip M. Hobson , Tang Yew Tan
CPC classification number: H05K5/0217 , H04M1/0252 , H05K5/0013 , Y10T29/18 , Y10T29/477 , Y10T29/49826
Abstract: A cold worked stainless steel bezel for a portable electronic device. The bezel is secured flush to a housing to form part of the case of the portable electronic device. A brace that includes a slot for receiving a wall extending from the bezel is fixed to the housing. When the bezel engages the housing, the wall of the bezel is inserted in the slot of the brace and releasably held by a spring that engages both the brace and the wall. The bezel can be released by disengaging the spring. The bezel is hard and resistant to impacts. Cold worked steel also facilitates manufacturing within design constraints and tolerances, and requires very little machining after manufacturing to comply with those constraints. the portable electronic device may include a personal media device, a mobile telephone, or any other suitable device or combination thereof.
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公开(公告)号:US09915573B2
公开(公告)日:2018-03-13
申请号:US15063488
申请日:2016-03-07
Applicant: Apple Inc.
Inventor: Christopher D. Prest , Matthew S. Scott , Stephen P. Zadesky , Dermot J. Stratton , Joseph C. Poole , Theodore A. Waniuk
IPC: H02B1/24 , G01L1/22 , H03K17/965
CPC classification number: G01L1/22 , H01H2211/032 , H03K17/965 , H03K2217/96062 , H03K2217/9651 , Y10T307/786
Abstract: Pressure sensing systems comprising bulk-solidifying amorphous alloys and pressure-sensitive switches containing bulk-solidifying amorphous alloys. The bulk-solidifying amorphous alloys are capable of repeated deformation upon application of pressure, and change their electrical resistivity upon deformation, thereby enabling measurement of the change in resistivity and consequently, measuring the deformation and amount of pressure applied.
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公开(公告)号:US20170094636A1
公开(公告)日:2017-03-30
申请号:US15376002
申请日:2016-12-12
Applicant: Apple Inc.
Inventor: Anthony Fadell , Andrew Bart Hodge , Stephen P. Zadesky , Aram Lindahl , Anthony Guetta
CPC classification number: H04W68/005 , G06F3/016 , G06F3/0412 , G06F3/044 , G06F3/04855 , G06F3/0488 , G06F2203/014 , G06F2203/04104 , G06F2203/04808 , G08B6/00
Abstract: An electronic device for providing tactile feedback is provided. The electronic device may provide tactile feedback using any suitable approach, including for example vibration, heat, electrical, visual, or any other type of feedback. The electronic device may provide tactile feedback in response to detecting any particular status of the electronic device, receiving any particular input, or detecting any suitable communication received by the electronic device. For example, the electronic device may provide tactile feedback in response to identifying the current network of the device, the status of a particular electronic device component, or any other electronic device status. As another example, the electronic device may provide tactile feedback in response to receiving a particular type of communication, or in response to receiving a communication from a particular contact. As still another example, the electronic device may provide tactile feedback in response to receiving a particular user input, or to detecting a user's finger on a particular portion of the electronic device.
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公开(公告)号:US09313906B2
公开(公告)日:2016-04-12
申请号:US14755994
申请日:2015-06-30
Applicant: Apple Inc.
Inventor: Christopher D. Prest , Stephen P. Zadesky , Trent Weber , Lucy E. Browning
IPC: G06F1/16 , H05K5/02 , G06F1/18 , H01L23/043 , H01L23/047 , H01L23/053 , H01L23/057 , H01L23/10 , H05K5/00 , H05K13/00 , H05K5/04 , H05K5/06
CPC classification number: B60R7/04 , A45C11/00 , A45C2011/001 , A45C2011/002 , A45C2011/003 , B60R11/0211 , B60R11/0241 , B60R11/0252 , B60R2011/0003 , B60R2011/0057 , G06F1/1656 , G06F1/181 , H01L23/043 , H01L23/047 , H01L23/053 , H01L23/057 , H01L23/10 , H01L2924/0002 , H05K5/0004 , H05K5/0021 , H05K5/02 , H05K5/04 , H05K5/069 , H05K13/00 , Y10T29/302 , Y10T29/49002 , Y10T29/49826 , H01L2924/00
Abstract: An electronic device having a unitary housing is disclosed. The device can include a first housing component having an open cavity, an internal electronic part disposed within the cavity, a second housing component disposed across the cavity, and a support feature disposed within the cavity and arranged to support the second housing component. The first housing component can be formed from metal, while the second housing component can be formed from a plurality of laminated foil metal layers. The second housing component can be attached to the first housing component via one or more ultrasonic welds, such that a fully enclosed housing is created. The fully enclosed housing can be hermetically sealed, and the outside surfaces thereof can be machined or otherwise finished after the ultrasonic welding.
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公开(公告)号:US20150305175A1
公开(公告)日:2015-10-22
申请号:US14755994
申请日:2015-06-30
Applicant: Apple Inc.
Inventor: Christopher D. Prest , Stephen P. Zadesky , Trent Weber , Lucy E. Browning
CPC classification number: B60R7/04 , A45C11/00 , A45C2011/001 , A45C2011/002 , A45C2011/003 , B60R11/0211 , B60R11/0241 , B60R11/0252 , B60R2011/0003 , B60R2011/0057 , G06F1/1656 , G06F1/181 , H01L23/043 , H01L23/047 , H01L23/053 , H01L23/057 , H01L23/10 , H01L2924/0002 , H05K5/0004 , H05K5/0021 , H05K5/02 , H05K5/04 , H05K5/069 , H05K13/00 , Y10T29/302 , Y10T29/49002 , Y10T29/49826 , H01L2924/00
Abstract: An electronic device having a unitary housing is disclosed. The device can include a first housing component having an open cavity, an internal electronic part disposed within the cavity, a second housing component disposed across the cavity, and a support feature disposed within the cavity and arranged to support the second housing component. The first housing component can be formed from metal, while the second housing component can be formed from a plurality of laminated foil metal layers. The second housing component can be attached to the first housing component via one or more ultrasonic welds, such that a fully enclosed housing is created. The fully enclosed housing can be hermetically sealed, and the outside surfaces thereof can be machined or otherwise finished after the ultrasonic welding.
Abstract translation: 公开了具有整体式壳体的电子设备。 该装置可以包括具有开放空腔的第一壳体部件,设置在腔体内部的内部电子部件,跨越腔体设置的第二壳体部件和布置成支撑第二壳体部件的支撑部件。 第一壳体部件可以由金属形成,而第二壳体部件可以由多个层压箔金属层形成。 第二壳体部件可以经由一个或多个超声波焊缝附接到第一壳体部件,使得产生完全封闭的壳体。 完全封闭的壳体可以被密封,并且其外表面可以在超声波焊接之后被加工或以其他方式完成。
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公开(公告)号:US20140217864A1
公开(公告)日:2014-08-07
申请号:US14251298
申请日:2014-04-11
Applicant: Apple Inc.
Inventor: Lucy E. Browning , Joseph C. Poole , Christopher D. Prest , Stephen P. Zadesky
IPC: H05K5/04
CPC classification number: H05K5/04 , B23K26/0861 , B23K26/0884 , B23K26/32 , B23K26/34 , B23K2101/36 , B23K2103/02 , B23K2103/04 , B23K2103/05 , B23K2103/08 , B23K2103/10 , B23K2103/14 , B23K2103/15 , B23K2103/16 , B23K2103/18 , B23K2103/26 , B23K2103/50 , Y10T29/49982 , Y10T29/49984
Abstract: A metal enclosure has a surface region which is coated with cladding material using a laser cladding process. The metal enclosure can form at least a portion of an electronic device housing. All or part of one or more surfaces of the enclosure can be coated with cladding material. The coating of cladding material can be varied at selective regions of the enclosure to provide different structural properties at these regions. The coating of cladding material can be varied at selective regions to provide contrast in cosmetic appearance.
Abstract translation: 金属外壳具有使用激光熔覆工艺涂覆包层材料的表面区域。 金属外壳可以形成电子设备外壳的至少一部分。 外壳的一个或多个表面的全部或部分可以用包覆材料涂覆。 包层材料的涂层可以在外壳的选择性区域变化,以在这些区域提供不同的结构特性。 包层材料的涂层可以在选择性区域变化,以提供美观外观的对比度。
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